Showing posts with label Tokyo Electron. Show all posts
Showing posts with label Tokyo Electron. Show all posts

Sunday, September 4, 2022

Tokyo Electron is forcastiong high continued sales in semiconductor equipment sales 2023 - slow down in DRAM

Tokyo electron forecast for FY2023 SPE Division New Equipment Sales Forecast - DRAM is retracting in 2023 but you can´t say that about Logic and Non-Volatile Memory (3DNAND Flash). Full power ahead for ALD and its friends!




One good freind of ALD is Etch. Tokyo Electron is spending quite some development Yen Billions by building a new facility just for etch development.




Thursday, April 8, 2021

Why China denied Applied Materials take over of Hitachi Kokusai

According to a recent analysis by Robert Castellano (Seeking Alpha/The Information Network LINK), Hitachi Kokusai holds a strong position in tube/non-tube LPCVD and oxidation/diffusion semiconductor equipment. For some time Applied Material has planned the acquisition of Kokusai that would have increased its global market share, for silicon wafer processing equipment by adding a big segment that it does not have in its product portfolio - LPCVD, Diffusion, and ALD Furnaces. According to the market assessment, Hitachi Kokusai holds a leading market share in this segment over No. 2. Tokyo Electron. 

Castellano brings up the interesting observation that "China blocked Applied Materials' acquisition of Kokusai while permitting the Marvell-Inphi deal the same week". Basically meaning that there are more than just US-China Trade issues behind the decision. He concludes that "China is developing a home-grown equipment industry infrastructure, and the deal would impede on that effort." and follows up by breaking up the segments and global competitive situation as below.

Summary by Castellano of China OEM active in LPCVD, Diffusion, and ALD segments vs. the global leaders

China’s NAURA makes oxidation and diffusion furnaces and its products have captured a significant share (40-50%) of YMTC’s thermal process equipment purchases, per our channel checks. In RTP, major players include Applied Materials, Tokyo Electron, and Mattson Technology.

NAURA is developing etchers and deposition equipment for 7nm and 5nm nodes. NAURA has a large product offering, and its customers consist of SMIC, Hua Hong, YMTC, and GTA Semiconductors.

NAURA also makes thermal furnaces and has a 45% share of China’s memory maker YMTC purchases. Whereas NAURA sold 8 etch systems and 6 CVD and ALD deposition systems to Chinese semiconductor companies, the company sold 34 furnaces in 2019 as well as 16 cleaning systems.

Shenyang Piotech also supplies PECVD and ALD deposition equipment. Piotech received orders for 4 PECVD (for SiN, SiO2) systems from YMTC, and is also receiving repeat orders from Hua Hong, and SMIC.


The size of the semiconductor equipment market and the small share China's equipment suppliers currently enjoy compared to foreign suppliers (source: The Information Network LINK)

Wednesday, March 24, 2021

Canon, SCREEN and Tokyo Electron to join Japan advanced chipmaking project for 2nm

Canon has partnered with Tokyo Electron and Screen Semiconductor Solutions to develop advanced chipmaking production technology with support from the Japanese government according to a report by Nikkei Asia.

♦ The $386mil USD funding from the Japanese government is through the National Institute of Advanced Industrial Science and Technology, along with the Ministry of Economy, Trade and Industry (METI).
♦ Japans semiconductor production industry has lost ground in recent years to Taiwanese chipmakers and companies like Intel.
The goal is to develop and implement a 2-nanometer or smaller process for chips by the mid-2020s.

Source (Paywall): LINK


Tokyo Electron semiconductor fab professionals shuffling wafers (credit: Tokyo Electron)

Wednesday, February 3, 2021

LIVE Stream - Advanced Process Technologies to Enable Future Devices and Scaling (invited), Rob Clark Tokyo Electron

SEMICON Korea SEMI Technology Symposium (STS) 2021 - The invited presentation titled "Advanced Process Technologies to Enable Future Devices and Scaling" can be streamed starting Feb. 3 in S. Korea (2/2 evening U.S.). 

This is an overview of new processing technologies required for continued scaling of leading-edge and emerging semiconductor devices. The main drivers and trends affecting future semiconductor device scaling are introduced to explain how these factors are influencing and driving process technology development. Topics explored in this presentation include atomic layer deposition (ALD), atomic layer etching (ALE), selective deposition and etching. In order to enable self-aligned and multiple patterning schemes as well as emerging devices for future manufacturing, atomic level process technologies need to be leveraged holistically. Real-world examples of current and future integration schemes, as well as emerging devices, will be presented and explained so that attendees can understand how advanced process technologies will be used in future device manufacturing as well as what benefits and tradeoffs may be encountered in their use.




Saturday, November 28, 2020

Applied Materials will regain its No. 1 ranking in the semiconductor equipment market in 2020 from ASML

According to recent published data by The Information Network (Seeking Alpha LINK), Applied Materials will regain its top ranking in the semiconductor equipment market in 2020 from ASML. Fab equipment spend in 2020 was enhanced from pull-ins of sales into China and Taiwan, with 3Q QoQ increases of 22.5% and 36.2%, respectively.

As is well known ASML and Applied Materials does not compete in their  business segments, Lithography (ASML) resp. Deposition & Etch (Applied Materials). Applied Materials has a number 1 spot in PVD, CVD, Epi, CMP and Implant/Doping. However, business segments where Applied Materials so far has not been successful to reach a top 3 position in the past years include:
  • Atomic Layer Deposition
  • MOCVD
  • Furnace 
  • Dielectric Etch  
  • Spray Processing
  • Dielectric Etch (including ALE)
  • Wet Stations
As is known, Applied Materials have several times made very serious attempts to enter the ALD segment, but failed several times to compete with ASMI, Tokyo Electron and the South Korean OEMs (Jusung Engineering, Wonik IPS and Eugene Technology. In 2019 Applied Materials announced that it will acquire Japanese Kokusai (LINK) but the final agreement is yet not settled. If successful Applied will have an opportunity to kill 2 birds with one stone:

1. Move in to top 3 spot in ALD
2. Take number 2 spot in Furnace business


Table based on information and own assumptions in the article (Seeking Alpha LINK)

Sunday, July 7, 2019

Rapid and Selective Deposition of Patterned Thin Films on Heterogeneous Substrates via Spin Coating

[Tokyo Electron] Researchers at UC Santa Barbara along with TEL and SRC have collaborated to develop new methods for selective spin coating. With wide-ranging applications in the future of semiconductor patterning as device makers are challenged to build more complex transistors and simultaneously lower costs. 

They demonstrate that accurate control over the process parameters allows incomplete trichlorosilane self-assembled monolayers (SAMs) to induce spin dewetting on both homogeneous (SiO2) and heterogeneous (Cu/SiO2 or TiN/SiO2) surfaces. Under optimal conditions, spin dewetting on line–space patterns results in the selective deposition of polymer over regions not functionalized with SAM.  

Source: "Rapid and Selective Deposition of Patterned Thin Films on Heterogeneous Substrates via Spin CoatingLINK

Saturday, March 16, 2019

VLSIresearch released its list of the top Semiconductor Equipment Suppliers for 2018 shown big wins for Japanese OEMs

VLSI Research report well above average growth for ASML (NL), Tokyo Electron (JPN), Advantest (JPN), Kokusai (JPN), Daifuku (JPN) and Canon (JPN) so a big win for Japan and the Netherlands last year. All Japanese companies outperform the market growth 2018!

Dan Hutchenson: "VLSIresearch released its list of the top Semiconductor Equipment Suppliers for 2018. Notable shifts were TEL passing Lam to take the top spot. Advantest past Screen for 7th with the highest growth of any chip equipment manufacturer. While ASM Pacific passed SEMES. For details, see: https://lnkd.in/gDxccnX

Most growth is seen in Litho as for each Immersion or EUV tool that is installed a bunch of Tokyo Electron tools come as well like e.g. the TEL Track platform.

With respect to ALD, judging by ASMI, TEL and Kokusai it seems that ALD was able to capture all of the growth in 2018 and maybe a bit more. In April the Japanese companies start their 2018 annual reporting so then we will know more for now we have the ASMI report to study (LINK).



Wednesday, May 2, 2018

Tokyo Electron is Challenging ASM International as The Leader in ALD Market share

Tokyo Electron recently (APR 25, 2018) presented their Q1/2018 numbers to share holders and released a slide deck (LINK) with some interesting new numbers on market share. For the first time it seems that another OEM is up there seriously challenging ASM International on the No.1 spot in ALD Equipment market share. ASM International has dominated the ALD segment with a share of >70% in 2014, but this share has slipped down year by year and they have lost their market share to well below 50% in 2017 due to strong competition in a rapidly expanding ALD market from Tokyo Electron, Lam Research, Kokusai, The Korean OEMs (Jusung Engineering, Wonik IPS and Eugene Technology) and also to some extent by Applied Materials.

According to the latest estimate based on Gartner research (released April 18, 2018), Tokyo Electron as of 2017 holds a 31% total market share of ALD wafer based processing equipment. That should include all wafer based ALD platforms, however some companies hide their ALD revenue in the CVD segments so you can not know for sure if you don´t know the data in detail. The segments are:
  • ALD Tube - Large batch furnaces, typically loading 100 or more wafers
  • Single wafer platforms
  • Multi wafer platforms, spatial or multi station

TEL Market share for 2017, Based on Gartner research (TEL Q1/2018 Earnings call slide deck) 

One explanation why Tokyo Electron has taken market share in ALD is because of a lot of the recent investment is coming from DRAM and 3DNAND Fabs and not Logic Fabs (see below). Traditionally Tokyo Electron has been much stronger in Memory than ASM International. Here the Japanese have very attractive tools for commodity product manufacturing (DRAM and Flash memory chips) like their ALD Large Batch Furnaces and relatively new and successful NT333 Spatial ALD platforms.
TEL sales their FY 2016 to 2018 by segment (TEL Q1/2018 Earnings call slide deck) 

Also interesting is that Tokyo Electron presents a rather bright future with growth not only in DRAM and 3DNAND but also in Logic due to 10/7nm investments from the IDMs and Foundries.


Saturday, March 31, 2018

Tokyo Electron reports on patterning technology for advancements in scaling

If you are interested in the latest patterning technology you should read this excellent online publication by Ken Nawa at the Process Integration Center, Tokyo Electron. Tokyo Electron is one of the top supplier for wafer based advanced etch, deposition and clean (and more) tools for the semiconductor industry. Besides the evolution of semiconductor by scaling technology, he covers all the latest advanced technologies:
  • Introduction of advanced patterning technology and challenges
  • SADP – Scaling by thin film formation on sidewall  
  • SAQP – Scaling by extending SADP technology 
  • SAB – Scaling by etch selectivity to multiple materials

Full article: LINK 


(screen dump form tel.com)