Sneak Peak Into Our New Equipment Components Session at CMC2022 in Chandler AZ April 27-29

Less than 4 Weeks to go for our CMC Conference, April 27-29, Chandler, AZ! Register Now Before It's Too Late!

Here's a Sneak Peak Into Our New Equipment Components Session

-George Alajajian, Ph.D.,VP Strategic Parts Supply Chain, Intel Corp. presenting on "Consumable Equipment Components Requirements for Leading Edge IDMs"

-Dalia Vernikovsky, CEO & GM, Applied Seals NA, Inc presenting on "Polymeric Sealing Properties, Advances & Limitations"

-Jennifer Braggin, Director, CTO’s Office, Entegris presenting on "New filtration and purification technologies for 3nm and beyond for better contamination control and yield improvement"

-Sami Sneck, Vice President, Advanced ALD, Beneq presenting on “Enhancing yield with ALD coatings for critical chamber components”

Coffee / Networking Break - Sponsor: Coexcell with Raffle Giveaway

-Nicole Rutherford, Product Manager, Greene Tweed presenting on “Large-Area Batch ALD Coatings for Chamber Component Protection”

-Christoph Hemmann, EVP Head of Airfreight Americas Region, DB Schenker presenting on "The Air Cargo Supply Chain of the Future- Challenges and Opportunities"

-Michael Bristol, Sr. Product Manager, CoorsTek presenting on “Trends in High Temp Furnace Components for Power Device Processing”

-Tim Dyer, President, Elcon Precision LLC presenting on "Semiconductor ESC and Ceramic Parts Industry Needs and Technical Challenges"

Click here to register for this information packed critical materials event: https://lnkd.in/gkShiM6s

Want to see the full agenda, click here: https://lnkd.in/gzDna7sy

ALD of almost pure organic polymer (3-4 at% Al) films with stability up to 400 °C

The clever ALD people at Helsinki University just published ALD of almost pure organic polymer (3-4 at% Al) films with stability up to 400 °C. This opens the path to a lot of new cool applications. For instance one could imagine the use of ALD deposited photo resist in the semiconductor industry.

Molecular Layer Deposition of Thermally Stable Polybenzimidazole-Like Thin Films and Nanostructures 

Saba Ghafourisaleh, Timo Hatanpää, Anton Vihervaara, Kenichiro Mizohata, Marko Vehkamäki, Markku Leskelä, Matti Putkonen, Mikko Ritala 

First published: 07 April 2022 https://doi.org/10.1002/admi.202200370

The deposition of polybenzimidazole (PBI)-like thin films by molecular layer deposition is reported here for the first time using isophthalic acid (IPA) and 3,3′-diaminobenzidine (DAB) as monomers and trimethylaluminum (TMA) as a linker precursor. Two precursor pulsing sequences are tested, the ABCB (TMA + IPA + DAB + IPA) and ABC (TMA + IPA + DAB) type MLD processes result in different types of PBI-like films. With the ABCB sequence thin film growth per cycle (GPC) of 6.0 Å is obtained at 225–280 °C, whereas GPC of 7.0 Å is obtained with the ABC sequence. Films are characterized in detail by Fourier transform infrared spectroscopy, scanning electron microscopy, thermogravimetric analysis, time-of-flight elastic recoil detection analysis, and atomic force microscopy. The films have good thermal stability and withstand annealing at 400 °C in both air and nitrogen. PBI nanostructures are prepared by depositing PBI-like film on electroblown polyvinylpyrrolidone fibers and removing the template fibers by annealing or dissolution into ethanol.

Spatial ALD Day coming up at TU Eindhoven June 9

Save the date! On June 9th 2022, we will organize a spatial ALD day at the Eindhoven University of Technology.
You can preregister on the website! The final registration form will appear early May when the detailed program is known.https://t.co/GjjpkGRdDX#ALDep #ALD pic.twitter.com/Bt5jJYg111

— AtomicLimits (@AtomicLimits) April 6, 2022

Senior Process Engineer I- Coating at ASM Phoenix AZ

About the job

We’re not like most. We don’t just overcome obstacles – we don’t see them. Instead, we see the potential in every person, and every situation. We don’t wait for opportunity to appear – we create it. Meet ASM. A company that has been searching for people just like you.

Job link: (21) Snr Process Engineer I- Coating | ASM | LinkedIn

Who is ASM?

ASM is a leading, global supplier of semiconductor wafer processing equipment. Our ambitious team is dedicated to delivering innovative technology solutions to the world’s leading semiconductor manufacturers. We have over 2,600 employees based in 14 countries, including Belgium, Japan, Netherlands, South Korea, Singapore, Taiwan and United States. Together we work to develop Epitaxy, ALD, PEALD, Vertical Furnaces and PECVD thin-film deposition technologies for our customers. Our goal is to remain an industry leader by being ahead of what’s next. We accomplish this by focusing on finding collaborative solutions to make integrated circuits, or chips, smaller, faster and even more powerful.

ASM, an inclusive workplace

We at ASM are a truly global organization that works diligently with an open-mind in all areas of our business. We strive for a culture and work style that fosters trust and transparency. We put our people first, and that is how we will continue to succeed. We are an equal opportunity employer and value diversity. We recognize and value the differences between individuals, including gender, ethnicity, religious beliefs, sexual orientation, knowledge and experience, work background, age, skills, amongst others. Recruiting and developing a diverse workforce provides a wide range of perspectives. This enables a culture of continuously exploring and adopting new technological ideas and innovations, and it also enables us to deliver excellent products and service to our clients.

Essential Functions

• Work with a safety-first mentality
• Drive ASM process protocol with emphasis and regularly institute or update service solutions to the field
• Work on assigned CIP projects, develop DOE’s and communicate openly both internally and externally.
• Focus on refresh of IP for legacy products and influence new design IP.
• Provide “novelty” to items making them hard to reproduce
• Improve upon existing design for performance and cost efficiency
• Generate project scope documentation and prepares specific project reports against identified schedule.
• Building stakeholder consensus to deliver approach
• Collaboratively manages global stakeholders including end users, technicians, engineers, procurement, spares, manufacturing, subject matter experts as well as management in both business and / or operations to project specific details.
• Applies project management principles to produce cooperative and collaborative efforts, deliver business strategic objectives and fill the end customer needs.
• Consistently provide quality solutions to field and customer personnel and create new BKM’s.
• Exercise good judgment within broadly defined practices and policies in selecting methods, techniques, tools and evaluation criteria for obtaining desired results
• Be willing to travel domestically and internationally as required.
  
  

Education /Experience

• BS or MS Degree in Mechanical engineering, Electrical Engineering, Material Science or related degree required.
• 5+ years of experience in the semiconductor field.
• Equipment Engineering experience with design, and development of complex mechanical systems including comprehension of: reactors, vacuum systems and chambers, gas delivery systems, abatement systems, pneumatics, water cooling, and circuits required. Ability to implement, maintain, improve electrical instruments, equipment, facilities, components, products, systems and provide novel solutions for the semiconductor equipment industry. Comprehension of PLC's and functionality.
• Should have a broad based background in analysis and debug of complex electrical and/or mechanical systems
• Semiconductor capital equipment experience is preferred.
• Understanding of materials: metals, plastics, surface coatings and surface finishes.
• Deposition product knowledge a plus (CVD, ALD, EPI, PVD). Knowledge of ASM Emerald tool distinct plus.
• Design applications Pro/ENGINEER, AutoCAD, and Hands on experience with FEA and CFD analysis preferred. Solid ability to read and understand P&IDs, Electrical, and Mechanical schematics and drawings.
• Proficiency in ANSI Y14.5 geometric dimension and tolerance.
  
  

Skills

• Ability to rectify a challenging situation and gain customer (Internal and external) confidence
• Strong positive attitude, ability to work in a team environment and work alone. Able to drive meetings, both internal and external, with excellent internal ASM relations
• Ability to work responsibly with all ASM resources and departments in a multifunctional high paced atmosphere with minimum supervision on highly complex problems
• Ability to handle multiple tasks simultaneously and be able to organize and run projects
• Strong computer skills, working knowledge of MS Word, Excel, PowerPoint, SharePoint, Project, and SAP
• Drive ASM SOP’s and protocol, able to guide co-workers toward common goals
• Become an active member of ASM GSS core teams
• Excellent communication skills; speak and write in a clear and concise manner, and ability to accurately and fully convey issues to peers, management, or customers
• Strong organizational skills and leadership qualities
• Accurate, timely reporting
• Parts tracking, ordering, managing, Setting BOM levels
• Technical writing background. Ability to create procedures, written in an informative manner that eliminates ambiguity and personal interpretation
• Training skills, be able to communicate with customers and their employees on maintenance procedures, preventative maintenance, and operating specific equipment. Be the content expert with ability to provide onsite support when needed
• Process comprehension, be able to understand basics of creating process recipes focusing on the ALD process.
• Understanding of chemistry interactions with different materials. Gas and liquid chemistry knowledge is a bonus
• Experience with Equipment installs Organizing/Coordinating trades, SL1, SL2, commissioning and qualifications to specific standards.
• SPC creation with JMP/Statistical analysis and ability to drive root cause solutions through data driven decisions
  
  

From the very start of the semiconductor industry to the present day, we’ve been technology leaders who have pioneered innovation and brought new processes into mainstream manufacturing. We are collaborating, creating, and delivering on our vision – a shared vision to drive innovation with new technologies and delivering excellence with dependable products. By doing this, we’ll create new possibilities for everyone to understand, create and share more of what they love.

Be part of our exciting future and join our team today!

Using Vapor Phase Infiltration for Fabricating Membranes with David Bergsman – ALD Stories Ep 11

 

 

From the corner of one continent to another, Professor David Bergsman joins Tyler from the University of Washington in Seattle. David discusses his use of vapor phase infiltration as a method of fabricating new membrane structures inspired by his work in Stacey Bent’s lab at Stanford and how he started an ALD lab during a pandemic. 

In this video: 

00:00 – Introduction 

02:01 – David’s Background & MLD 

08:02 – Membrane Fabrication and Property Challenges 

17:19 – Vapor Phase Infiltration 

37:36 – Starting an ALD lab 

48:30 – Ending & Outro 

Follow Professor David Bergsman on Twitter @DavidBergsman and learn about his research group in Seattle at www.bergsmangroup.com

Innovative Spatial ALD system at the LZH can precisely coat complex-shaped optics

New possibilities: The LZH can also coat curved optics uniformly with the innovative Spatial ALD system. This is interesting, for example, for applications in the automotive lighting sector. The system achieves high deposition rates.Thanks to the plasma-based Spatial ALD system, another application that is in high demand in industry has been made economical. Layer systems of uniform thickness can be developed and manufactured much faster than before on curved and structured optics.

The system was developed by the Finnish company Beneq together with the LZH.

Press release: Innovative Spatial ALD system at the LZH can precisely coat complex-shaped optics | Laser Zentrum Hannover

Picosun ALD and NYCU in Taiwan enhances micro-LED efficiency

ESPOO, Finland, 5th of April 2022 – Picosun Atomic Layer Deposition (ALD) has played a vital role in enhancing electro-optical characteristics of micro-LEDs in research done by National Yang Ming Chiao Tung University (NYCU) in Taiwan.

The usage of dielectric films as a passivation material is a popular technique to suppress dangling bonds as well as to improve output power and external quantum efficiency in LEDs. The study conducted at NYCU compared III-Nitride micro-LEDs of different sizes with and without ALD Al2O3 passivation. The results showed external quantum efficiency enhancement of 70% for 5 µm × 5 µm micro-LEDs and 60% for 10 µm ×10 µm micro-LEDs when using ALD Al2O3 passivation.

In addition, to achieve full color display, an inkjet printing to pattern quantum dots automatically has been developed at NYCU. The solution can considerably improve the precision of color pixels and satisfy the high-resolution requirements. Picosun ALD passivation technology was successfully used for preventing the quantum dots from photo-oxidation and degradation. After a 500 hours environmental reliability test, the color gamut remained at excellent level.*

“Micro-LED technology has been the disruptive technology in the next generation displays, and more application areas are emerging its benefits being long lifetime, high power efficiency and high brightness. With quantum dot-based technology micro-LEDs can be used in applications such as virtual and mixed reality as they allow the use of single-color, blue, micro-LED chips resulting in lower manufacturing costs. Our study has proved that ALD passivation plays a key role in upcoming nanometer-scale devices”, says Hao-Chung Kuo, professor at NYCU.

“Picosun’s ALD technology has been production-proven at many prominent LED manufacturers. ALD films’ superior conformality and uniformity, and their ability to ensure reliable, pinhole-free encapsulation even at extremely low film thicknesses is a key benefit. Furthermore, the ALD process can be run at moderate temperatures”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.