ALD/CVD Chemielaborant/in bei Fraunhofer IKTS in Dresden

Die Fraunhofer-Gesellschaft ist die führende Organisation für angewandte Forschung in Europa. Unter ihrem Dach arbeiten 72 Institute und Forschungseinrichtungen an Standorten in ganz Deutschland. Mehr als 25 000 Mitarbeiterinnen und Mitarbeiter erzielen das jährliche Forschungsvolumen von 2,3 Milliarden Euro. Davon fallen knapp 2 Milliarden Euro auf den Leistungsbereich Vertragsforschung. Rund 70 Prozent dieses Leistungsbereichs erwirtschaftet die Fraunhofer-Gesellschaft mit Aufträgen aus der Industrie und mit öffentlich finanzierten Forschungsprojekten. Internationale Kooperationen mit exzellenten Forschungspartnern und innovativen Unternehmen weltweit sorgen für einen direkten Zugang zu den wichtigsten gegenwärtigen und zukünftigen Wissenschafts- und Wirtschaftsräumen.

In der Arbeitsgruppe Dünnschicht-Technologien werden hauptsächlich chemische Gasphasenabscheidung (CVD) für verschiedene Anwendungsfelder eingesetzt bzw. entwickelt. Dabei kommen die Verfahren thermische CVD-Prozesse bei reduziertem oder Atmosphärendruck (LPCVD, APCVD), plasmagestütztes CVD (PACVD) und Atomlagenabscheidung (ALD) zum Einsatz. Werkstoffseitig stehen Hartstoffschichten, Schichten aus gerichteten Carbon Nanotubes (CNT) und nanoskalige Dielektrika auf der Basis von Hafnium-, Zirkon- und Titanoxiden sowie von Perowskiten im Mittelpunkt. Die Anwendungen reichen vom Verschleißschutz über die Aktorik, Sensorik, Batterie- und Energietechnik bis hin zur Mikroelektronik. Die Herstellung neuer Dünnschichtmaterialien erfordert auch die Modifizierung bekannter bzw. die Entwicklung neuer CVD-Technologien. Dies umfasst den Test neuer Precursorsysteme sowie die Durchführung detaillierter Parameterstudien. Unterstützt werden die Untersuchungen durch thermodynamische Berechnungen und durch eine umfassende Charakterisierung von Zusammensetzung, Struktur und Eigenschaften der Schichten.

Künftig umfassen Ihre Aufgaben hierbei

• Eigenständiger Aufbau, Betrieb und Wartung von Laboraufbauten und Versuchsdurchführung nach Ablaufplan
• Mitarbeit bei der Auswahl und Definition der wissenschaftlichen Ausrüstung und Chemikalien
• Anpassung der Laboranlagen an Projekterfordernisse
• Unterstützung bei der Fehlerbehebung an Anlagen
• Bereitstellung und Pflege technischer Dokumentationen
• Auswahl und Koordination externer und interner Lieferanten und Dienstleister
• Bestellung von Bauteilen und Wartung von für den Anlagenbetrieb notwendigen Zusatzgeräten

ASM International announces response to Hitachi Kokusai´s counterclaim

ASM International N.V. (Euronext Amsterdam: ASM) today responds to press reports of a patent infringement suit against ASM filed by Hitachi Kokusai in Federal District Court for the District of Oregon on February 20, 2018. The claim follows an earlier suit for patent infringement filed by ASM against Hitachi Kokusai and ASM's earlier initiation of an arbitration against Hitachi Kokusai alleging breach of a license agreement between the parties. ASM will diligently prosecute its cases against Hitachi Kokusai and will vigorously defend against Hitachi Kokusai's claims, which, ASM believes lack merit.

In 2007, ASM and Hitachi Kokusai entered into a licensing agreement, according to which ASM granted usage of its ALD patents in the field of use of batch ALD to Hitachi Kokusai.

On August 30, 2017, ASM initiated an arbitration with the American Arbitration Association against Hitachi Kokusai for breach of the license agreement between the parties. It is not yet known when the arbitration will be completed. 

 

Following the expiration of the parties' patent license agreement, ASM filed, on December 1, 2017, a suit for patent infringement against Hitachi Kokusai and its U.S. subsidiary in the U.S. District Court for the Northern District of California. ASM asserted three patents. ASM has requested both an injunction and monetary damages.

CMC Conference 2018 - a Critical Event for Semiconductor Materials

Critical Event for Semiconductor Materials

CMC Conference Update

This year's Critical Materials Conference features:    Keynote Speaker: David Bloss, VP, Technology and Manufacturing Group Director, Lithography Technology Sourcing, Global Supply Management, Intel Corporation, presenting  "Patterning Challenges and Fab Materials for Future ICs"   Also Featuring:    Glen Wilk, VP, ALD Products, ASM "ALD Materials Integration Challenges" Risto Puhakka, President, VLSI Research "OEM Markets and Materials Trends" Michelle Garza, Sr. R&D Chemist, Fujimi "Cobalt CMP Post Cleans; Wet Cleans Compatibility" Ken Unfried, Sr. Technologist, Linde "Neon and Xenon Recycling" Dave Thompson, Director, Applied Materials "Ruthenium Integration" More than 20 powerful & actionable presentations    and the popular Not-so-unusual Round Table Session - a highly differentiated program, with networking opportunities for all attendees.

The CMC Conference provides: * Updates on market dynamics and regulations * Trends in the profitable control of all fab materials * Technology forecasts for future critical materials Register now for the early-bird rate of $375 by March 15th: http://cmcfabs.org/cmc-events/. Click here for the updated agenda

Schedule Details: Welcome Reception April 25th evening Sessions I & II, April 26th Session III, April 27 morning  Welcome reception, lunch on 26th & coffee/tea breaks are included. Hotel Hilton Phoenix Chandler 2929 W Frye Rd Chandler, AZ 85224 Phone: (480) 899-7400 Reserve your room today The conference follows the CMC Fabs F2F meeting (on April 24-25) and CMC Members only (Associates and Fabs) Joint Session (on April 25, 2-5pm), located nearby at NXP. For more information about these meetings and/or the Conference, please contact Meena Sher by email by clicking here.

Early-Bird Registration by March 15 $375

Standard Price $450

Register Now

ALD Development Engineer at Encapsulix S.A. in Provence area in the South-East of France

A full time position as a development engineer is available at Encapsulix SAS. (HTTP://www.encapsulix.com). Encapsulix is a fast growing supplier of ultra fast, large area ALD manufacturing and R&D equipment that serve the thin film barrier and encapsulation needs for the OLED lighting and display, photovoltaic, data storage, architectural glass, and generic large area electronic markets. Encapsulix headquarters and application laboratory are located in Provence, south of France.

Personal Specification

The candidate should at least have a Master Degree in Mechanical or Electrical Engineering, Material Science, Physics or Chemistry ; A professional experience with development , utilization, and/or maintenance of vacuum equipment and or metrology.

The selected candidate will be responsible for development of certain hardware (system and subsystem level), control algorithms and deposition processes related to high speed Atomic Layer Deposition. Relevant technical skills include the design, sourcing and test of mechanical parts, a working knowledge of subsystems such as vacuum systems, thermal control systems and thin film characterization and related metrology. Experience in industrial R&D and product development is preferred.

Candidates should demonstrate enthusiasm and are expected to take ownership of their part of the project for on-time/in budget/ in spec delivery in a high pace/high tech manufacturing environment. They should demonstrate a solid technical background and the ability to rapidly acquire new technical skills. This position requires extensive interactions with customers, development partners and suppliers. Excellent written and oral communication skills and an ability to perform the work independently are essential.

They should also be willing to travel for extended periods of time in Europe, North America and East Asia. Full professional fluency in English is expected. Activities within the scope of certain government related collaborations may require a background check by third parties.

Location

The position will be based in the Provence area in the South-East of France. In recent years, the region has developed a vibrant high tech industry in the fields of microelectronics, aerospace, advanced optics and renewable energies.

Appointment and Starting Date

This position offers full-time employment. The starting date will be March 1st, 2018 at the earliest.

Information and Application

For more information on the position, please contact Jacques Kools (jkools@encapsulix.com). To apply, please send an application letter, along with curriculum vitae with the names of two professional references who can be contacted.

Gain a 'Material' Advantage - CMC Conference 2018

Gain a 'Material' Advantage

CMC Conference 2018

The 3rd Critical Materials Council (CMC) Conference is a 2-day event happening April 26-27 in Phoenix, AZ, where leading semiconductor fabs and suppliers discuss ways to resolve issues related to materials, manufacturing and global supply-chains. Speakers from CMC Members such as Intel, Samsung, and TI, along with analysts and experts from OEMs and materials-suppliers will provide presentations at this public event, which follows the private members-only CMC meeting. Benchmark your world here. Keynote speaker David Bloss, VP of Technology and Manufacturing Group, and Director of Lithography Technology Sourcing in Global Supply Management, Intel Corp., will start the three-session event exploring:

* Updates on market dynamics and government regulations, * Trends in the profitable control of all fab materials, and * Technology trends & forecasts for future critical materials. Register now for the early-bird rate of $375 by March 15th: http://cmcfabs.org/cmc-events/. Click here for the updated agenda

CONFERENCE DETAILS Welcome Reception April 25th evening Sessions I & II, April 26th Session III, April 27 morning  Welcome reception, lunch on 26th & coffee/tea breaks are included. Hotel Hilton Phoenix Chandler 2929 W Frye Rd Chandler, AZ 85224 Phone: (480) 899-7400 Reserve your room today The conference follows the CMC Fabs F2F meeting (on April 24-25) and CMC Members only (Associates and Fabs) Joint Session (on April 25, 2-5pm), located nearby at NXP, Chandler, AZ.  For more information about these meetings and/or the Conference, please contact Meena Sher by email by clicking here.

Early-Bird Registration by March 15 $375

Full Price $450

Register Now

NCD signed a contract to supply ALD equipment for PERC cells with JA Solar in China

NCD has recently signed a contract to supply ALD equipment for manufacturing high efficiency PERC cells with JA Solar, a large solar cell manufacturer in China. This equipment is Lucida GS Series that offers higher efficiency to crystalline silicon solar cells by depositing high quality Al2O3 ALD thin films on the back side of wafers. 

 

Lucida GS Series is a batch type ALD deposition system that forms backside passivation of Al2O3 on multiple wafers and can process more than 4.500 wafers (@ 6nm thickness) of 156mm x 156mm size per an hour. By applying Lucida GS Series in the production of solar cells, customers can dramatically lower the production cost of high efficiency solar cells due to the high-volume productivity, high yield, efficient gas consumption and low maintenance cost compared to competitors. Based on these advantages and excellence, NCD is confident that the Lucida GS Series will become essential equipment for ALD process application for manufacturing high efficiency solar cells.

NCD will continue to make efforts to become the world’s best specialized company that leads ALD technologies in the future.

< Lucida GS Series >

Spatial atomic layer deposition for coating flexible porous Li-ion battery electrodes

Here is important step forward in fast roll to roll processing of Li-battery electrodes using fast spatial ALD from CU Boulder, Colorado. Spatial ALD (SALD) is based on separating the precursors and inert gas purges in space rather than in time and therefore the deposition rates up to a hundred times faster are achievable. SALD can be performed at ambient atmosphere and therefore is a cheaper technology due to less need of expensive vacuum technology compared to conventional low pressure ALD.

High speed and low cost of ownership opens the door to high volume manufacturing of bulk quantities of energy materials for applications including solar energy, energy storage, or smart windows. Previously ALD Nanosolutions has announced a Spatial ALD technology for conformal encapsulation of ALD on powder material like for instance Li-battery cathode powder (LINK). A good overview of Spatial ALD for energy applications is this review paper by David Muñoz-Rojas et al: "Spatial Atomic Layer Deposition (SALD), an emerging tool for energy materials. Application to new-generation photovoltaic devices and transparent conductive materials" https://doi.org/10.1016/j.crhy.2017.09.004 [OPEN ACCESS]

Please find the JVSTA abstract below for the recent article form Boulder:

Spatial Atomic Layer Deposition for Coating Flexible Porous Li-Ion Battery Electrodes Abstract for paper @GeorgeGroupCU @@coschoolofmines https://t.co/eCCJEdudwa pic.twitter.com/K2R6P7i6tc

— JVST A - JVST B (@JVSTAB) February 7, 2018

Recent Solar Cell and Battery Materials Articles in JVSTA

Quite a bunch of interesting ALD papers in JVSTA!

Laser ablation compatible substoichiometric SiO_x/SiN_y passivating rear side mirror for passivated emitter and rear thin-film crystalline silicon solar cells,  Félix Gérenton, Fabien Mandorlo, Erwann Fourmond, Marine Le Coz, Danièle Blanc-Pélissier, Mustapha Lemiti |  Read More

Plasma-enhanced atomic layer deposition of vanadium phosphate as a lithium-ion battery electrode material,  Thomas Dobbelaere, Felix Mattelaer, Philippe M. Vereecken, Christophe Detavernier |  Read More

Performance and durability of broadband antireflection coatings for thin film CdTe solar cells,  G erald Womack, Piotr M. Kaminski, Ali Abbas, Kenan Isbilir, Ralph Gottschalg, John Michael Walls |  Read More

Application of microcracked columnar TiO₂ thin films deposited by DC hollow cathode plasma jet in dye-sensitized solar cells,  Roman Perekrestov, Pavel Kudrna, Stanislav Danis, Milan Tichý, Igor Bieloshapka, Rodica Vladoiu |  Read More

Optimizing AlF₃ atomic layer deposition using trimethylaluminum and TaF₅: Application to high voltage Li-ion battery cathodes,   David H. K. Jackson, Masihhur R. Laskar, Shuyu Fang, Shenzhen Xu, Ryan G. Ellis, Xiaoqing Li, Mark Dreibelbis, Susan E. Babcock, Mahesh K. Mahanthappa, Dane Morgan, Robert J. Hamers, Thomas F. Kuech |  Read More

Single vacuum chamber with multiple close space sublimation sources to fabricate CdTe solar cells,  Drew E. Swanson, Jason M. Kephart, Pavel S. Kobyakov, Kevin Walters, Kevan C. Cameron, Kurt L. Barth, Walajabad S. Sampath, Jennifer Drayton, James R. Sites |  Read More

Spatial atomic layer deposition on flexible porous substrates: ZnO on anodic aluminum oxide films and Al₂O₃ on Li ion battery electrodes,   Kashish Sharma, Dmitri Routkevitch, Natalia Varaksa, Steven M. George |  Read More

 

Atomic layer deposition of tin oxide using tetraethyltin to produce high-capacity Li-ion batteries,  Denis V. Nazarov, Maxim Yu. Maximov, Pavel A. Novikov, Anatoly A. Popovich, Aleksey O. Silin, Vladimir M. Smirnov, Natalia P. Bobrysheva, Olga M. Osmolovskaya, and Michail G. Osmolovsky, Aleksandr M. Rumyantsev |  Read More

Atomic layer deposition of NiS and its application as cathode material in dye sensitized solar cell,   Neha Mahuli, Shaibal K. Sarkar |  Read More

Effect of the cadmium chloride treatment on RF sputtered Cd_0.6Zn_0.4Te films for application in multijunction solar cells,  Tushar M. Shimpi, Jason M. Kephart, Drew E. Swanson, Amit H. Munshi, Walajabad S. Sampath, A. Abbas, John M. Walls |  Read More

CRITICAL EVENT FOR SEMI MATERIALS - April 26-27 Phoenix

The Critical Materials Council (CMC) Conference is a 2-day event, happening April 26-27 in Phoenix, AZ, providing actionable information on materials and supply-chains for current and future semiconductor manufacturing. Speakers from CMC Members such as GlobalFoundries, Intel, Samsung, and TI, along with analysts and experts from OEMs and materials-suppliers will explore issues associated with using materials such as cobalt and ruthenium in commercial fabs. Evening receptions and lunch allow for networking time with industry leaders.

Keynote speaker David Bloss, VP of Technology and Manufacturing Group, and Director of Lithography Technology Sourcing in Global Supply Management, Intel Corp., will start the three-session event exploring:

* Updates on market dynamics and government regulations,
* Trends in the profitable control of all fab materials, and
* Technology forecasts for future critical materials.

Join us in the Phoenix area: http://cmcfabs.org/cmc-events/

 

ASD 2018 Call for Abstracts Deadline Extended to March 5

Call for Abstracts Extended to March 5, 2018

Click for Abstract Guidelines & Submission

Website

Hotel

Sponsors

The principal chemical processes and mechanisms that enable Area Selective Deposition (ASD) are rapidly becoming critical in several areas of materials and technological advancement. Most notably, the semiconductor industry will likely need new ASD processes to enable “chemical alignment” to complement traditional physical alignment (i.e. lithography) to allow transistors to scale to less than 10 nm dimensions. Other fields are also exploring chemical selectivity in materials to achieve precise targeted performance. Catalytic materials, for example, which are commonly employed to promote chemically selective reactions, are now being designed and constructed using site-selective deposition reactions. In addition, the growing complexity of energy generation and storage materials are also driving the need for new site- or area-selective processes to control heterogeneous material structures. To share advances in these areas, the 3rd Area Selective Deposition Workshop (ASD 2018), will be held on April 29 – May 1, 2018, at North Carolina State University in Raleigh North Carolina USA. The Workshop will bring together leading international scientists and engineers from academia and industry from all regions to share results and insights into: 1) fundamental principles and barriers to area selective deposition; 2) technological needs and challenges of ASD; 3) new chemical approaches and processes to address the expanding needs; and 4) surface characterization techniques and metrology innovation for ASD. Based on successful workshops at the Eindhoven University of Technology in 2017 and at IMEC in Leuven Belgium in 2016, ASD 2018 will consist of two days of presentations and discussions, preceded by a welcome reception at North Carolina State University on April 29. The program will include a series of invited and contributed speakers, a panel discussion, as well as a poster session reception on the evening of April 30.

Invited speakers and tutorials for AVS ALD & ALE 2018 in Incheon Korea

The invited speakers and tutorials for AVS ALD & ALE 2018 in Incheon Korea have been announced! Please follow the link here for full details (LINK). A lot of experts from the South Korean ALD Industry and Fabs will present, including offcourse the early industry adopters (DRAM!) Samsung Electronics and SK Hynix as well as suppliers like Wonik IPS and UP Chemical and a good mix of the worlds best experts will be there as well ALD and ALE. Noting also that there will be multiple presentations from Japan for ALE like Sony (cool!), Toshiba and Tokyo Electron.

As for other years the exhibition has been sold out but sponsoring is open!

SUBMISSION for abstarcts deadline is also close - February 16, 2018 (LINK)

2nd HERALD.ECI Workshop with hands-on training for “bonding HERALD.ECIs from ideas to proposals”

Following the HERALD.ECI network kick-off : June 14, 2017 in Linköping, Sweden, and the 1st HERALD.ECI Workshop on Career Development : August 28-29, 2017 in Ghent, Belgium

The team behind HERALD ECI wisheds you alls a Warm Welcome to the 2nd HERALD.ECI Workshop with hands-on training for “bonding HERALD.ECIs from ideas to proposals” March 1-2, 2018 in Barcelona.

The 2nd HERALD.ECI Workshop is organized by:

• Mariona Coll & Jaume Gazquez, Institut de Ciència de Materials de Barcelona;
• Maximilian Gebhard, Ruhr-University Bochum; and
• Marcel Junige, Technische Universität Dresden.

Just recently the Agenda was released (see below). Please visit the web page administrated by Marcel Junige for more informations : LINK

 

Picosun establishes a new business unit to ensure the best customer experience

ESPOO, Finland, 1^st February, 2018 – Picosun Group, a leading supplier of advanced industrial Atomic Layer Deposition (ALD) thin film coating technology, has established a new business unit dedicated to customer experience. The goal of the new unit is to reinforce and streamline Picosun’s service and support operations even further, to ensure always the highest level customer satisfaction and maximized uptime of PICOSUN™ production ALD systems around the world.

Timo Malinen (right) - The newly appointed Customer Experience Director of the Picosun Group and the leader of the new service business unit in Helsinki and Jonas Sundqvist (left) during the making of the "Picosun - MECRALD technology by Hitachi High-Technologies and Picosun" promotion movie in Helsinki (LINK)

In the last few years, Picosun has become the ALD technology provider of choice for the world’s leading semiconductor manufacturers and various other industries. This is manifested by the impressive 68 % increase in new orders in the calendar year 2017, compared to the previous calendar year, resulting in total value of 24,4 M€ (of new orders). The demand for the company’s industrial ALD solutions is growing fast, and repeat sales of PICOSUN™ P-series high throughput batch ALD tools and PICOPLATFORM™ vacuum cluster systems underline the need for a strong, well-oiled service organization able to provide all-inclusive round-the-clock response around the globe, every day of the year.