Monday, May 2, 2022

NCD supplied additional ALD equipment for special protective coating

Recently NCD supplied additional ALD equipment to the customer based in Korea. It is for coating products used in semiconductor equipment to protect from corrosion and plasma arcing.

This re-contracted equipment is Lucida GSH Series ALD. It is a fast and efficient ALD protective layer coating system with lower precursor usage than existing equipment. The customer is looking forward to extending the lifetime of high cost products through uniform and high quality ALD coating.

This repeat ordered supply shows that the customer has had confidence in the NCD’s ALD technology and the excellence of the equipment.



<LucidaTM GSH Series ALD>

Friday, April 8, 2022

Sneak Peak Into Our New Equipment Components Session at CMC2022 in Chandler AZ April 27-29

Less than 4 Weeks to go for our CMC Conference, April 27-29, Chandler, AZ! Register Now Before It's Too Late!




Here's a Sneak Peak Into Our New Equipment Components Session

-George Alajajian, Ph.D.,VP Strategic Parts Supply Chain, Intel Corp. presenting on "Consumable Equipment Components Requirements for Leading Edge IDMs"

-Dalia Vernikovsky, CEO & GM, Applied Seals NA, Inc presenting on "Polymeric Sealing Properties, Advances & Limitations"

-Jennifer Braggin, Director, CTO’s Office, Entegris presenting on "New filtration and purification technologies for 3nm and beyond for better contamination control and yield improvement"

-Sami Sneck, Vice President, Advanced ALD, Beneq presenting on “Enhancing yield with ALD coatings for critical chamber components”

Coffee / Networking Break - Sponsor: Coexcell with Raffle Giveaway

-Nicole Rutherford, Product Manager, Greene Tweed presenting on “Large-Area Batch ALD Coatings for Chamber Component Protection”

-Christoph Hemmann, EVP Head of Airfreight Americas Region, DB Schenker presenting on "The Air Cargo Supply Chain of the Future- Challenges and Opportunities"

-Michael Bristol, Sr. Product Manager, CoorsTek presenting on “Trends in High Temp Furnace Components for Power Device Processing”

-Tim Dyer, President, Elcon Precision LLC presenting on "Semiconductor ESC and Ceramic Parts Industry Needs and Technical Challenges"

Click here to register for this information packed critical materials event: https://lnkd.in/gkShiM6s

Want to see the full agenda, click here: https://lnkd.in/gzDna7sy

ALD of almost pure organic polymer (3-4 at% Al) films with stability up to 400 °C

The clever ALD people at Helsinki University just published ALD of almost pure organic polymer (3-4 at% Al) films with stability up to 400 °C. This opens the path to a lot of new cool applications. For instance one could imagine the use of ALD deposited photo resist in the semiconductor industry.


Molecular Layer Deposition of Thermally Stable Polybenzimidazole-Like Thin Films and Nanostructures 
Saba Ghafourisaleh, Timo Hatanpää, Anton Vihervaara, Kenichiro Mizohata, Marko Vehkamäki, Markku Leskelä, Matti Putkonen, Mikko Ritala 

First published: 07 April 2022 https://doi.org/10.1002/admi.202200370

The deposition of polybenzimidazole (PBI)-like thin films by molecular layer deposition is reported here for the first time using isophthalic acid (IPA) and 3,3′-diaminobenzidine (DAB) as monomers and trimethylaluminum (TMA) as a linker precursor. Two precursor pulsing sequences are tested, the ABCB (TMA + IPA + DAB + IPA) and ABC (TMA + IPA + DAB) type MLD processes result in different types of PBI-like films. With the ABCB sequence thin film growth per cycle (GPC) of 6.0 Å is obtained at 225–280 °C, whereas GPC of 7.0 Å is obtained with the ABC sequence. Films are characterized in detail by Fourier transform infrared spectroscopy, scanning electron microscopy, thermogravimetric analysis, time-of-flight elastic recoil detection analysis, and atomic force microscopy. The films have good thermal stability and withstand annealing at 400 °C in both air and nitrogen. PBI nanostructures are prepared by depositing PBI-like film on electroblown polyvinylpyrrolidone fibers and removing the template fibers by annealing or dissolution into ethanol.



Thursday, April 7, 2022

Spatial ALD Day coming up at TU Eindhoven June 9

Wednesday, April 6, 2022

Senior Process Engineer I- Coating at ASM Phoenix AZ

About the job

We’re not like most. We don’t just overcome obstacles – we don’t see them. Instead, we see the potential in every person, and every situation. We don’t wait for opportunity to appear – we create it. Meet ASM. A company that has been searching for people just like you.


Job link: (21) Snr Process Engineer I- Coating | ASM | LinkedIn

Who is ASM?

ASM is a leading, global supplier of semiconductor wafer processing equipment. Our ambitious team is dedicated to delivering innovative technology solutions to the world’s leading semiconductor manufacturers. We have over 2,600 employees based in 14 countries, including Belgium, Japan, Netherlands, South Korea, Singapore, Taiwan and United States. Together we work to develop Epitaxy, ALD, PEALD, Vertical Furnaces and PECVD thin-film deposition technologies for our customers. Our goal is to remain an industry leader by being ahead of what’s next. We accomplish this by focusing on finding collaborative solutions to make integrated circuits, or chips, smaller, faster and even more powerful.

ASM, an inclusive workplace

We at ASM are a truly global organization that works diligently with an open-mind in all areas of our business. We strive for a culture and work style that fosters trust and transparency. We put our people first, and that is how we will continue to succeed. We are an equal opportunity employer and value diversity. We recognize and value the differences between individuals, including gender, ethnicity, religious beliefs, sexual orientation, knowledge and experience, work background, age, skills, amongst others. Recruiting and developing a diverse workforce provides a wide range of perspectives. This enables a culture of continuously exploring and adopting new technological ideas and innovations, and it also enables us to deliver excellent products and service to our clients.

Essential Functions
  • Work with a safety-first mentality
  • Drive ASM process protocol with emphasis and regularly institute or update service solutions to the field
  • Work on assigned CIP projects, develop DOE’s and communicate openly both internally and externally.
  • Focus on refresh of IP for legacy products and influence new design IP.
  • Provide “novelty” to items making them hard to reproduce
  • Improve upon existing design for performance and cost efficiency
  • Generate project scope documentation and prepares specific project reports against identified schedule.
  • Building stakeholder consensus to deliver approach
  • Collaboratively manages global stakeholders including end users, technicians, engineers, procurement, spares, manufacturing, subject matter experts as well as management in both business and / or operations to project specific details.
  • Applies project management principles to produce cooperative and collaborative efforts, deliver business strategic objectives and fill the end customer needs.
  • Consistently provide quality solutions to field and customer personnel and create new BKM’s.
  • Exercise good judgment within broadly defined practices and policies in selecting methods, techniques, tools and evaluation criteria for obtaining desired results
  • Be willing to travel domestically and internationally as required.

Education /Experience
  • BS or MS Degree in Mechanical engineering, Electrical Engineering, Material Science or related degree required.
  • 5+ years of experience in the semiconductor field.
  • Equipment Engineering experience with design, and development of complex mechanical systems including comprehension of: reactors, vacuum systems and chambers, gas delivery systems, abatement systems, pneumatics, water cooling, and circuits required. Ability to implement, maintain, improve electrical instruments, equipment, facilities, components, products, systems and provide novel solutions for the semiconductor equipment industry. Comprehension of PLC's and functionality.
  • Should have a broad based background in analysis and debug of complex electrical and/or mechanical systems
  • Semiconductor capital equipment experience is preferred.
  • Understanding of materials: metals, plastics, surface coatings and surface finishes.
  • Deposition product knowledge a plus (CVD, ALD, EPI, PVD). Knowledge of ASM Emerald tool distinct plus.
  • Design applications Pro/ENGINEER, AutoCAD, and Hands on experience with FEA and CFD analysis preferred. Solid ability to read and understand P&IDs, Electrical, and Mechanical schematics and drawings.
  • Proficiency in ANSI Y14.5 geometric dimension and tolerance.

Skills
  • Ability to rectify a challenging situation and gain customer (Internal and external) confidence
  • Strong positive attitude, ability to work in a team environment and work alone. Able to drive meetings, both internal and external, with excellent internal ASM relations
  • Ability to work responsibly with all ASM resources and departments in a multifunctional high paced atmosphere with minimum supervision on highly complex problems
  • Ability to handle multiple tasks simultaneously and be able to organize and run projects
  • Strong computer skills, working knowledge of MS Word, Excel, PowerPoint, SharePoint, Project, and SAP
  • Drive ASM SOP’s and protocol, able to guide co-workers toward common goals
  • Become an active member of ASM GSS core teams
  • Excellent communication skills; speak and write in a clear and concise manner, and ability to accurately and fully convey issues to peers, management, or customers
  • Strong organizational skills and leadership qualities
  • Accurate, timely reporting
  • Parts tracking, ordering, managing, Setting BOM levels
  • Technical writing background. Ability to create procedures, written in an informative manner that eliminates ambiguity and personal interpretation
  • Training skills, be able to communicate with customers and their employees on maintenance procedures, preventative maintenance, and operating specific equipment. Be the content expert with ability to provide onsite support when needed
  • Process comprehension, be able to understand basics of creating process recipes focusing on the ALD process.
  • Understanding of chemistry interactions with different materials. Gas and liquid chemistry knowledge is a bonus
  • Experience with Equipment installs Organizing/Coordinating trades, SL1, SL2, commissioning and qualifications to specific standards.
  • SPC creation with JMP/Statistical analysis and ability to drive root cause solutions through data driven decisions

From the very start of the semiconductor industry to the present day, we’ve been technology leaders who have pioneered innovation and brought new processes into mainstream manufacturing. We are collaborating, creating, and delivering on our vision – a shared vision to drive innovation with new technologies and delivering excellence with dependable products. By doing this, we’ll create new possibilities for everyone to understand, create and share more of what they love.

Be part of our exciting future and join our team today!

Tuesday, April 5, 2022

Using Vapor Phase Infiltration for Fabricating Membranes with David Bergsman – ALD Stories Ep 11

 

 

From the corner of one continent to another, Professor David Bergsman joins Tyler from the University of Washington in Seattle. David discusses his use of vapor phase infiltration as a method of fabricating new membrane structures inspired by his work in Stacey Bent’s lab at Stanford and how he started an ALD lab during a pandemic. 
In this video: 
00:00 – Introduction 
02:01 – David’s Background & MLD 
08:02 – Membrane Fabrication and Property Challenges 
17:19 – Vapor Phase Infiltration 
37:36 – Starting an ALD lab 
48:30 – Ending & Outro 

Follow Professor David Bergsman on Twitter @DavidBergsman and learn about his research group in Seattle at www.bergsmangroup.com

Innovative Spatial ALD system at the LZH can precisely coat complex-shaped optics

New possibilities: The LZH can also coat curved optics uniformly with the innovative Spatial ALD system. This is interesting, for example, for applications in the automotive lighting sector. The system achieves high deposition rates.Thanks to the plasma-based Spatial ALD system, another application that is in high demand in industry has been made economical. Layer systems of uniform thickness can be developed and manufactured much faster than before on curved and structured optics.

The system was developed by the Finnish company Beneq together with the LZH.



Picosun ALD and NYCU in Taiwan enhances micro-LED efficiency

ESPOO, Finland, 5th of April 2022 – Picosun Atomic Layer Deposition (ALD) has played a vital role in enhancing electro-optical characteristics of micro-LEDs in research done by National Yang Ming Chiao Tung University (NYCU) in Taiwan.

The usage of dielectric films as a passivation material is a popular technique to suppress dangling bonds as well as to improve output power and external quantum efficiency in LEDs. The study conducted at NYCU compared III-Nitride micro-LEDs of different sizes with and without ALD Al2O3 passivation. The results showed external quantum efficiency enhancement of 70% for 5 µm × 5 µm micro-LEDs and 60% for 10 µm ×10 µm micro-LEDs when using ALD Al2O3 passivation.



In addition, to achieve full color display, an inkjet printing to pattern quantum dots automatically has been developed at NYCU. The solution can considerably improve the precision of color pixels and satisfy the high-resolution requirements. Picosun ALD passivation technology was successfully used for preventing the quantum dots from photo-oxidation and degradation. After a 500 hours environmental reliability test, the color gamut remained at excellent level.*

“Micro-LED technology has been the disruptive technology in the next generation displays, and more application areas are emerging its benefits being long lifetime, high power efficiency and high brightness. With quantum dot-based technology micro-LEDs can be used in applications such as virtual and mixed reality as they allow the use of single-color, blue, micro-LED chips resulting in lower manufacturing costs. Our study has proved that ALD passivation plays a key role in upcoming nanometer-scale devices”, says Hao-Chung Kuo, professor at NYCU.

“Picosun’s ALD technology has been production-proven at many prominent LED manufacturers. ALD films’ superior conformality and uniformity, and their ability to ensure reliable, pinhole-free encapsulation even at extremely low film thicknesses is a key benefit. Furthermore, the ALD process can be run at moderate temperatures”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

Thursday, March 31, 2022

Launch of the ALD & ALE ReviewBase – An easy-to-access overview of all ALD and ALE review papers

The scientific and technological interest in atomic layer deposition (ALD) and atomic layer etching (ALE) has been surging in the last decade and the sheer volume of ALD and ALE papers can make it difficult to get a clear overview. Now AtomicLimits and Prof. Kessels launched the ALD & ALE ReviewBas in Dresden at the annual EFDS ALD for Industry conference.


Link to the new site: ALD & ALE reviews – Atomic Limits




Tutorial and launch of the ReviewBase - ALD: materials, process technologies and applications Prof. Erwin Kessels, TU Eindhoven, NL.


Sunday, March 27, 2022

Call for Papers for the 242nd ECS Meeting, to be held from Oct. 9-13, 2022, symposium G02: Atomic Layer Deposition and Etching Applications

Dear colleagues in Atomic Layer Deposition and Etching,

We hereby send you the Call for Papers for the 242nd ECS Meeting, to be held from Oct. 9-13, 2022, in Atlanta (USA). Especially interesting for you will be symposium G02: Atomic Layer Deposition and Etching Applications 18 that we* are organizing on an annual basis.

*organizers: Fred Roozeboom, Stefan De Gendt ; Jolien Dendooven ; Jeff Elam ; Oscar van der Straten ;Andrea Illiberi ; Ganesh Sundaram ; Rong Chen ; Thorsten Lill ; Oana Leonte ; Matthias Young



Below, you can find the Call for Papers and instructions to submit your abstract.

The due date for submission is Friday April 8, 2022.

Students can apply for (partial) travel support.

More details can be found right below this message.

Kind regards, also on behalf of my co-organizers.
Fred

Prof. dr. Fred Roozeboom
Group Inorganic Membranes
Faculty of Science & Technology
University of Twente
PO Box 217
7500 AE Enschede
The Netherlands
Mobile: +31 6 51375283
f.roozeboom@utwente.nl

Wednesday, March 16, 2022

Additive Manufacturing in Atomic Layer Processing Mode by Atlant 3D

Open Source : Additive Manufacturing in Atomic Layer Processing Mode

Ivan Kundrata,Maïssa K. S. Barr,Sarah Tymek,Dirk Döhler,Boris Hudec,Philipp Brüner,Gabriel Vanko,Marian Precner,Tadahiro Yokosawa,Erdmann Spiecker,Maksym Plakhotnyuk,Karol Fröhlich,Julien Bachmann
First published: 11 March 2022


Additive manufacturing (3D printing) has not been applicable to micro- and nanoscale engineering due to the limited resolution. Atomic layer deposition (ALD) is a technique for coating large areas with atomic thickness resolution based on tailored surface chemical reactions. Thus, combining the principles of additive manufacturing with ALD could open up a completely new field of manufacturing. Indeed, it is shown that a spatially localized delivery of ALD precursors can generate materials patterns. In this “atomic-layer additive manufacturing” (ALAM), the vertical resolution of the solid structure deposited is about 0.1 nm, whereas the lateral resolution is defined by the microfluidic gas delivery. The ALAM principle is demonstrated by generating lines and patterns of pure, crystalline TiO2 and Pt on planar substrates and conformal coatings of 3D nanostructures. The functional quality of ALAM patterns is exemplified with temperature sensors, which achieve a performance similar to the industry standard. This general method of multimaterial direct patterning is much simpler than standard multistep lithographic microfabrication. It offers process flexibility, saves processing time, investment, materials, waste, and energy. It is envisioned that together with etching, doping, and cleaning performed in a similar local manner, ALAM will create the “atomic-layer advanced manufacturing” family of techniques.



AVS ASD 2022 April 21-22 - Technical program

 

Technical Program
Reserve Hotel by March 25
We have arranged a special conference rate at the Westin St. Francis. Keep in mind that reserving a room in the conference hotel block is important because it helps ASD meet its financial commitments to the host city and retain lower registration fees as well as a high quality conference with the features and services you are accustomed too.

Due to limited space we recommend booking as early as possible to receive this special rate—please note that once the reserved/contracted room block is full, the room availability and rate are not guaranteed and may vary.

If your dates are not available, please contact Alberto Lamberti at 1-415-774-0122, alberto.lamberti@westin.com for help.
In an effort to help facilitate the progression of ASD techniques, the 6th Area Selective Deposition Workshop (ASD 2022) scheduled for April 21-22, 2022, in San Francisco will act as a central event for sharing and discussing the newest developments in ASD by gathering leading experts from both academia and industry. Attendees can expect to participate in talks regarding fundamental challenges related to recent developments in ASD, applications for ASD in next-generation technology, emergent processes for implementing ASD techniques, and new perspectives on metrological and characterization strategies for further understanding persistent mechanistic challenges. Based on the success of the previous workshops, ASD 2022 will consist of two days of presentations by invited and contributing speakers, as well as a banquet reception and poster session.
Invited Speakers:

  • Keynote Speaker - Stacey Bent (Stanford University, USA), "Next Generation Nanopatterning Using Area Selective Deposition”
  • Cathleen Crudden (Queen's University, Canada), "N-heterocyclic Carbenes in Selective Area Deposition"
  • Jolien Dendooven (Ghent University, The Netherlands), "In-situ Studies of Nucleation Mechanisms during ALD of Platinum-Group Metals"
  • Damon Farmer (IBM Research, USA), "Inhibitor-Free Nucleation Inhibition of Superconductors"
  • Padma Gopalan (University of Wisconsin, USA), "Carbon Nanotube Selective Deposition"
  • Andrew Kummel (University of California San Diego), "Selective Atomic Layer Deposition of MoSiX"
  • Mikko Ritala (University of Helsinki, Finland), "Area-Selective Etching of Polymers, a Novel Approach to Self-Aligned Patterning of Thin Films"
  • Frances Ross (Massachusetts Institute of Technology, USA), "In Situ Electron Microscopy to Visualize Crystal Growth Mechanisms on Plain and Patterned Surfaces"
  • Bonggeun Shong (Hongik University, South Korea), "Theoretical Understanding on the Principles of Area-Selective Atomic Layer Deposition"
Topics:
This event is centered on showcasing developments across the whole spectrum of area-selective deposition. Thus, the Workshop will cover a wide range of topics including the following:

  • Near Term Technology Readiness (Scalable and Relevant ASD Processes for Use in Manufacturing)
  • Fundamentals of ASD (Defects, Growth Mechanisms and Inhibitor Chemistries)
  • Metrology Techniques for ASD
  • Emerging/Exploratory ASD Processes and Applications (e.g., Catalysis, Energy Generation and Storage)
Program Chair:
Rudy J. Wojtecki
IBM Almaden Research Center, USA
Questions? Contact rjwojtec@us.ibm.com

Thursday, March 10, 2022

Beneq fulfills customer demand for tailored ALD equipment services and support with BeneqCareTM

Beneq, the home of Atomic Layer Deposition (ALD), has introduced BeneqCare, a new modular solution to offer support and maintenance services to organizations that own and operate Beneq ALD equipment.

Beneq leads the market with ALD products for R&D, semiconductor device fabrication, 3D and batch production, ultra-fast spatial ALD (C2R), and roll-to-roll ALD. Today, the company has launched BeneqCare to help customers in the EU, Asia and the USA maximize the value of their ALD tools throughout their equipment’s life cycles.


“We have been investing heavily in widening our service capabilities worldwide. Now, we offer service coverage in all regions. We have also established spare part hubs in every region at Beneq offices,” says Hans Fabritius, Vice President, Life Cycle Services at Beneq.

“BeneqCare simplifies ALD equipment ownership by helping our customers maximize uptime and gain access to the right support at every stage of their tool’s life cycle. We are ready to assist our customers in meeting their productivity requirements –from training personnel in using the equipment to meeting any unscheduled maintenance or spare parts needs,” asserts Fabritius.

BeneqCare provides Beneq customers who operate in the industrial and research sectors with a wide range of service modules to suit their operations, from extended warranty and training services to remote or onsite support.

“Our customers have high expectations for the performance of their Beneq ALD tools. BeneqCare brings them versatile support and service plans that grow with their businesses,” says Fabritius.

Companies and research facilities that have commissioned Beneq ALD equipment can avail of a variety of BeneqCare service modules to suit their unique requirements. Among the BeneqCare modules are technical support services, including remote support via Augmented Reality (AR); spare part services; extended warranties; preventive as well as unscheduled maintenance services; and training.

Learn more about BeneqCare.

 

Tuesday, March 8, 2022

RASIRC Granted Patent for Controlled Delivery of Hydrogen Peroxide Gas

Novel method for generation of H2O2 gas granted patent in US and Japan


San Diego, California – February 24, 2022 – RASIRC announced that the United States Patent and Trademark Office has granted Patent # US 11,154,792 B2 for a novel Method, System and Device for Delivery of Process Gas. The patent is applicable to RASIRC hydrogen peroxide products including the Peroxidizer®. The patent was also certified by the Japan Patent Office as Patent 6951321. The method enables more accurate and repeatable delivery of hydrogen peroxide gas into a wide range of flow rates, operating pressures, and temperatures.



This invention correlates instantaneous applied power to mass delivery of H2O2, largely eliminating nonuniformities in the liquid source and thermal droop. This enables the Peroxidizer to provide accurate and linear delivery of chemistry without regard to vaporization temperature or process pressure.

“By applying this new process control method, the Peroxidizer can provide linear control throughout the mass flow range independent of the carrier gas flow rate and operating pressure of the process,” said RASIRC Founder and CEO Jeffrey Spiegelman. “This design integrates custom hardware, firmware and software to improve both Peroxidizer performance and tool-to-tool repeatability, helping us meet the semiconductor standards for high volume manufacturing (HVM).”

Power control is a very effective way to deliver vapor from a liquid source. Most liquid to vapor mass flow control is managed by temperature regulation of the liquid source or bath. However, bath temperature increases with increased mass flow rate causing temperature non-uniformities, localized droop, and output instabilities. As the temperature increases the vapor pressure increases on a power curve. Error increases in a highly non-linear fashion. For example, H2O2 vapor pressure change of 1°C at 90°C is 20 times larger than 1°C at 30°C, leading to 20X increased error at the higher temperature. Power control is based on the mass evaporated so the error does not increase with increasing bath temperature.

About the RASIRC Peroxidizer®

The RASIRC Peroxidizer provides a safe, reliable way to deliver high-concentration hydrogen peroxide gas into ALD, annealing, gapfill, dry surface preparation, and cleaning processes.

About RASIRC

RASIRC transforms liquids into dynamic gases that power process innovation in semiconductor and adjacent markets. By commercializing molecules for lower temperature processes, RASIRC patented technology enables the manufacture of atomic-scale oxides, nitrides, and metals. Innovative products such as Brute Peroxide, Brute Hydrazine, the Peroxidizer, and the Rainmaker Humidification Systems are being used to develop solutions for 5G, AI, IOT, and advanced automation.

What makes RASIRC a unique industry leader is our technical expertise and commitment to solving complex industry challenges for our customers. Our team of industry experts has a proven track record of beating larger competitors to market by efficiently delivering state of the art technology that reduces cost, improves quality, and dramatically improves safety. With our customers at the forefront of all we do, we continue to research, develop, and design innovative products that purify and deliver ultra-pure gas from liquids for the semiconductor and related markets. Contact RASIRC to help solve your complex problems.



P: 858-259-1220, email info@rasirc.om or visit http://www.rasirc.com