ASM launches 200 mm PE2O8 silicon carbide epitaxy system

ASM has launched the PE2O8, a silicon carbide (SiC) epitaxy system designed to enhance power device production with improved yields and reduced costs. The PE2O8 targets key applications in electric vehicles, green energy, and AI data centers, addressing the need for chips with higher power performance in smaller form factors. Its dual-chamber design enables high throughput, process uniformity, and efficient maintenance, while supporting both 6" and 8" wafer processing. With advanced thermal control and recipe transfer capabilities, the PE2O8 system offers high reliability, making it ideal for SiC epitaxy on bare wafers and during chip fabrication.

ASM's PE2O8 is a high-productivity epitaxy system designed for silicon carbide (SiC) applications, enabling the production of power devices with higher yields and lower costs. It plays a crucial role in industries like electric vehicles, green energy, and AI data centers, where chips must meet high power specifications within smaller form factors. The PE2O8 system features dual reactors for easy chamber maintenance, cross-flow hot wall reactors for precise thermal control, and inductive heating for processing 6" and 8" wafers. It ensures process uniformity and recipe transfer from earlier platforms, making it highly reliable and cost-efficient for SiC epitaxy on bare wafers and in power device fabrication.

Raleigh, NC, USA, September 30, 2024 / New system extends ASM’s portfolio of industry benchmark single wafer silicon carbide epitaxy systems, the 6” PE1O6 and 8” PE1O8 systems, with a higher throughput, lower cost of ownership, dual chamber, single wafer, 6” and 8” compatible, silicon carbide epitaxy system.

Today at the 2024 International Conference on Silicon Carbide and Related Materials, ASM International N.V. (Euronext Amsterdam: ASM) introduced the PE2O8 silicon carbide epitaxy system, a new, dual chamber, platform for silicon carbide (SiC) epitaxy (Epi). Designed to address the needs of the advanced SiC power device segment, the PE2O8 is the benchmark epitaxy system for low defectivity, high process uniformity, all with higher throughput and low cost of ownership needed to enable broader adoption of SiC devices.

As the general electrification trend drives more power device manufacturers to utilize SiC for a growing number of high-power applications (such as for electric vehicles, green power, and advanced data centers) the expanded demand and requirements for lower cost for SiC is causing a transition from 6” to 8” SiC substrates. At the same time, SiC device manufacturers are designing higher power devices that will benefit from better SiC epitaxy.

Utilizing a unique design, the dual chamber PE2O8 system deposits SiC with ultra precise control, enabling benchmark higher yield and higher throughput. The highly compact, dual chamber design enables high productivity and low total costs of operation. Additionally, the system features an easy preventive maintenance approach helping to increase uptime and reduce the occurrence of unscheduled downtime. System deliveries have been ongoing to multiple customers globally, among them leaders in SiC power device manufacturing.

“We are at a critical inflection for silicon carbide power products, as our customers transition from 6” to 8” wafers”, said Steven Reiter, Corporate Vice President, and business unit head of Plasma and Epi at ASM. “Delivering a high-quality epitaxy process on larger wafers with defectivity control is critical, and we have been the industry benchmark for process uniformity with our novel chamber design. We have now extended our system capability to improve our process control and our value for customers with lower cost of ownership.”

Since 2022, ASM, through its new SiC Epi product unit has been developing and refining its single wafer SiC epitaxy system. With the structurally higher demand for electric vehicles and improvement of the overall SiC wafer and device yield, the equipment market for SiC epitaxy has grown substantially in recent years.

About ASM International

ASM International N.V., headquartered in Almere, the Netherlands, and its subsidiaries design and manufacture equipment and process solutions to produce semiconductor devices for wafer processing, and have facilities in the United States, Europe, and Asia. ASM International's common stock trades on the Euronext Amsterdam Stock Exchange (symbol: ASM). For more information, visit ASM's website at www.asm.com.

Sources:

PE2O8 SiC epitaxy | ASM

Boosting the Future: Increased ALD Use Paves the Way for Advanced GAAFET Technology

The Biden administration is considering a complete ban on the export of chips utilizing Gate All-Around Field Effect Transistor (GAAFET) technology to China, Bloomberg reports (LINK). The rationale behind this potential ban is the concern that such advanced transistors could be leveraged for military applications and artificial intelligence (AI) advancements by China. This move follows previous restrictions from 2022, when the U.S. barred its Electronic Design and Automation (EDA) companies from selling tools necessary for GAAFET development to China. In addition, advanced chip exports from companies like Nvidia were restricted, with these measures being progressively tightened and expanded over time.

Atomic Layer Deposition (ALD) is celebrating its 50th anniversary in 2024. The anniversary marks 50 years since Dr. Tuomo Suntola and his colleagues filed the first patent for Atomic Layer Epitaxy in 1974, which laid the foundation for ALD technology. This milestone will be celebrated at various events, including the ALD 2024 conference, where Dr. Suntola is expected to deliver the opening remarks .

ASM International, a leader in Atomic Layer Deposition (ALD), plays a crucial role in enabling Gate-All-Around Field Effect Transistors (GAAFETs) and continued semiconductor scaling. ALD's precision in depositing ultra-thin, uniform films is essential for creating the high-performance, low-power structures required by GAAFETs. This technology, along with other advanced processes such as epitaxy and selective etching, supports the intricate fabrication steps needed for these next-generation transistors.

The production of GAAFETs requires a significant increase in the use of ALD technology - maybe up to 40% more according to ASM. ALD is essential for creating the ultra-thin, uniform films needed for GAAFET structures, ensuring high-quality, defect-free layers that are critical for advanced transistor performance. This technology enables precise control over the deposition process, crucial for developing high-k dielectrics and other materials that enhance GAAFET performance and efficiency. As the semiconductor industry now transitions from FinFET to GAAFET technology, leveraging ALD's capabilities is vital for maintaining and advancing Moore's Law, enabling more powerful and energy-efficient chips using existing manufacturing infrastructure

Applied Materials has outlined next-generation tools essential for producing 3nm and GAA transistors, such as those in Samsung's upcoming 3GAE and 3GAP technologies. These advanced tools address the complexities of GAA transistor manufacturing, including precise lithography, epitaxy, and selective materials removal. Applied's Producer Selectra Selective Etch IMS tool is pivotal in defining channel width without damaging surrounding materials, while the Centura Prime Epi tool ensures clean deposition of Si and SiGe nanosheets. Additionally, their Integrated Materials Solution (IMS) systems integrate atomic layer deposition (ALD), thermal steps, and plasma treatments to optimize the gate oxide stack, enhancing performance and reducing gate leakage. These innovations are crucial as they enable higher performance, lower power consumption, and greater transistor density, aligning with the industry's move from FinFET to GAA technology.

Today GAA transistors are currently in mass production only by Samsung, which offered the technology to customers with its 3-nanometer process in 2022. Intel is set to follow, producing GAAFET on its 2-nanometer process expected to be available in its products later this year. TSMC, the market leader, plans to introduce GAAFET with its own 2 nm process in 2025. The GAAFET technology itself is not inherently suited for AI or military applications but represents an evolution in transistor design, enabling denser packing of transistors as lithography equipment and manufacturing processes advance. This technology shift, akin to transitioning to a new node, typically results in either reduced power consumption or improved performance by 15-25%.

The improvements facilitated by GAAFET could significantly enhance the capabilities available to China. SMIC, China's largest contract manufacturer, currently produces chips on a 7 nm process and is believed to be capable of reaching at least 5 nanometers with existing tools. The combination of this process with GAAFET could theoretically prevent China from falling too far behind Western advancements. However, China has been effectively shut out from developing GAAFET using tools from leading EDA companies, all of which are American. Additionally, the Dutch company ASML, dominant in the lithography equipment market, has not sold its EUV (Extreme Ultraviolet) machines to China and faced further restrictions in 2023 on selling its advanced DUV (Deep Ultraviolet) equipment. In April 2024, ASML took another step in the tech war against China by announcing that it would no longer service existing equipment in China, potentially crippling the country's semiconductor manufacturing capabilities. The specific details of the new export bans are still unclear, but Reuters notes that initial proposals have faced criticism from the U.S. semiconductor industry for being overly broad and extensive.

Source: USA överväger ytterligare GAAFET-sanktioner mot Kina – Semi14, www.ASM.com, Applied Materials Outlines Next-Gen Tools for 3nm and GAA Transistor Era (anandtech.com), Atomic layer deposition, next-gen transistors, and ASM (techfund.one)

ASM a revenue of €639 million Q12024 - driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

Here are the key points from ASM International NV's financial results for the first quarter of 2024:

The company reported a revenue of €639 million, at the upper end of their guidance, driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

The foundry and memory segments were the leading contributors to revenue. While the combined logic/foundry segment saw a decline year-over-year, it improved from the previous quarter. The automotive semiconductor market showed weakness, whereas the memory market is showing signs of recovery.

• Gross margin increased to 52.9%, largely due to strong sales performance in the Chinese market.
• New orders reached €698 million, marking a 10% increase from the previous year, mainly driven by the foundry sector. The company expects continued demand for gate-all-around technology, with significant orders anticipated in the second half of the year.
• Despite a slowdown in certain segments like power/analog/wafer, ASM International maintains a strong financial position with a cash reserve of €720 million at the end of the quarter. Sales in China are expected to remain robust.

ASM International: Spearheading Semiconductor Innovation in ALD, Epitaxy, and CVD Markets

ASM International N.V. (Euronext Amsterdam: ASM) yesterday reported its fourth quarter 2023 operating results (unaudited). Double-digit full-year revenue growth, outperforming softer WFE market in 2023

Investor presentation: 2023_q4_investor-presentation.pdf (asm.com)

“2023 was another successful year for ASM. Sales increased by 13% at constant currencies, despite softening market conditions, and marking the seventh consecutive year of double-digit growth.” said Benjamin Loh, CEO of ASM. “Revenue in Q4 2023 amounted to €633 million, in line with our guidance of €600-640 million and down compared to the level in Q4 2022. Revenue in the quarter was supported by strong sales in the power/analog/ wafer segment. Bookings at €678 million were slightly better than our expectation and were driven by GAA pilot- line orders and continued strength in China demand.

ASM's Leadership in the Growing ALD Market

According to ASM, the single wafer Atomic Layer Deposition (ALD) market is experiencing significant growth, with projections indicating an increase from $2.6 billion in 2022 to a range of $4.2 billion to $5.0 billion by 2027. This growth, characterized by a Compound Annual Growth Rate (CAGR) of 10-14% from 2022 to 2027, underscores the expanding role of ALD technology in semiconductor manufacturing. ASM International, a key player in the semiconductor industry, holds a dominant position in this market, commanding a share of over 55% throughout the forecast period.

Please note that this market assessment, most probably originally from TechInsights (prev. VLSI Research) does not include Large Batch furnace ALD, which historically have been about 30% of the total 300 mm ALD equipment market. The leaders in this segment are Tokyo Electron followed by Kokusai and ASM chose not to compete with its A412 ALD product line.

Driving Forces Behind ALD Market Expansion

The expansion of the ALD market is propelled by a series of technological advancements and increasing demands within the semiconductor sector. Key factors contributing to this growth include the industry's shift towards Gate-All-Around (GAA) technology, the necessity for advanced high-k gate dielectrics, and the precision required for threshold voltage tuning. Additionally, the development of sacrificial layers and the use of high aspect ratio Through-Silicon Vias (TSVs) are critical in advancing semiconductor manufacturing techniques. The application of metals and the adoption of selective ALD processes further accentuate the importance of ALD technology in modern semiconductor fabrication.

ASM's Strategic Positioning and Market Opportunities

ASM is well-positioned to capitalize on the opportunities presented by the burgeoning ALD market. The company's strategic emphasis on innovation, coupled with its comprehensive product portfolio, positions ASM as a frontrunner in meeting the evolving needs of the logic/foundry and memory segments of the semiconductor industry. The transition to advanced manufacturing technologies, such as GAA and high-k metal gate applications, presents significant growth avenues for ALD, with ASM at the forefront of this technological evolution.

To be more specific, the transition to GAA technology and the expansion in FinFET applications are set to significantly increase ASM's served available market by approximately US$400 million for every 100,000 wafer starts per month (WSPM). According to ASM, the equipment orders started to come in in the 2nd half of 2023. We can assume that this are orders from Samsung, TSMC and Intel. It is however about peculiar since Samsung had 3 nm GAA going already with yield in August 2023 and ASM is describing it as GAA pilot lines. Anyhow, come 2028 when all leading foundries including Rapidus in Japan are up and running GAAFETs, this additional market will be + USD 1.5 B as compared to if it would have been "only" FinFET technology - according to my back of the envelope calculations. For a company like ASM, with just below USD 3 B (2.6 B EUR) annual Revenue 2023 this is a huge thing. If this is not enough to go woah - add to that the GAAFET market is an upwards moving target and will continue to grow and looking ahead stacking of NMOS/PMOS will drive further demand for this type of ALD and Epi processes.

Expansion into the Epitaxy and CVD Markets

The Silicon Epitaxy (Si epi) market is also on a growth trajectory, with forecasts suggesting it will reach between $2.3 billion and $2.9 billion by 2027. ASM aims for a market share target of over 30%, focusing on both leading-edge and non-leading-edge segments. The leading-edge growth is driven by transitions to GAA technology and advancements in high-performance DRAM, while the non-leading-edge growth is buoyed by wafer power analog and strong momentum from ASM's Intrepid ESA. The epitaxy market is expected to see a Compound Annual Growth Rate (CAGR) of 3-8% from 2022 to 2027, with the leading-edge segment outpacing the overall market with a CAGR of 10-15%.

Regarding the SiC market, the investor presentation highlighted significant growth in power/analog/wafer revenue, almost doubling, primarily driven by robust demand in China. This growth was positively impacted by the consolidation of LPE (SiC Epitaxy), with sales comfortably exceeding the target of more than €130 million in 2023. This indicates ASM's strong performance in the SiC market and its successful integration and expansion in SiC epitaxy, aligning with the broader industry trend towards more advanced and efficient semiconductor materials.

Chemical Vapor Deposition (CVD) technology is another area of focus for ASM, particularly in the context of transitioning to new materials like Molybdenum, which is replacing traditional materials such as CVD Tungsten and PVD Copper in interconnect applications. This shift is indicative of the evolving needs within the semiconductor manufacturing process and highlights ASM's adaptability to changing market dynamics.

In summary, ASM's strategic initiatives in ALD, Epitaxy, and CVD technologies underscore the company's commitment to innovation and leadership within the semiconductor equipment market. Through a combination of market foresight, technological prowess, and strategic investments, ASM is well-positioned to capitalize on the growth opportunities presented by the evolving semiconductor landscape. 

ASM International Announces $300M Expansion in Arizona, Boosted by Dutch-U.S. Collaboration with Prime Minister Mark Rutte's Support

ASM International N.V. is set to expand its U.S. operations with a €300 million investment in a new facility in Scottsdale, Arizona. This expansion, covering more than 20 acres, aims to bolster their research, technology development, and manufacturing capabilities in the semiconductor industry. The state-of-the-art site, spanning 250,000 square feet, will host various functions, emphasizing renewable energy and sustainability.

A rendering of the new ASM HQ (source ASM America)

This move marks a significant step in reinforcing Arizona's position as a hub for semiconductor innovation and highlights the strong Arizona-Netherlands partnership. Notably, Mark Rutte, Prime Minister of the Netherlands, emphasized the importance of this expansion in strengthening cross-border collaborations and the global semiconductor value chain. The initiative is viewed as pivotal in fostering Dutch-U.S. partnerships and propelling advancements in the industry.

“Arizona and the U.S. are valuable partners in the Netherlands’ mission to co-create solutions that promote innovation and partnerships in the global semiconductor value chain,” said Mark Rutte, Prime Minister of the Netherlands. “It is through these types of cross-border collaborations that we are shaping the future of advancements in this growing industry.”

The new facility will create approximately 500 new jobs over six years, focusing on engineering and research roles. ASM's commitment to sustainability is evident in its plans for LEED certification and water reuse programs. Additionally, the company has formed partnerships with local organizations for environmental conservation efforts, showcasing its dedication to community and environmental stewardship. This expansion by ASM International is set to significantly enhance semiconductor technology and innovation, highlighting the growing synergy between the U.S. and the Netherlands in this vital sector.

Source:

Press releases | ASM

ASM International N.V. has completed the purchase of a strategic plot of land in Scottsdale, Arizona.

ASM International N.V. has completed the purchase of a strategic plot of land in Scottsdale, Arizona. This move is a significant step towards consolidating ASM's multiple sites in Arizona, positioning the company for streamlined operations and future expansion in R&D and support activities.

The decision aligns perfectly with ASM's Growth through Innovation strategy, reflecting the company's commitment to adapting and evolving in the dynamic semiconductor landscape. While specific financial details remain undisclosed, this investment contributes to ASM's targeted €150-200 million total group capex for 2023, as communicated earlier this year.

ASM International N.V., headquartered in Almere, the Netherlands, is a key player in semiconductor equipment and process solutions. With facilities spanning across the United States, Europe, and Asia, ASM International is driving innovation and growth in the industry.

For more insights, visit ASM's official website: www.asm.com. 

U.S. and Netherlands Tighten Restrictions on Chipmaking Equipment Sales to China, Impacting ALD and ASM International

The United States and the Netherlands are set to impose stricter restrictions on the sale of chipmaking equipment to China, aiming to prevent the use of foreign technology for military strengthening. In their efforts to curb China's access to advanced semiconductor technology, the Dutch government plans to restrict equipment from ASML, the leading chip equipment maker in the Netherlands, while the U.S. plans to further withhold Dutch equipment from specific Chinese fabs. These measures will impact atomic layer deposition (ALD) firm ASM International as well.

Besides ASM and Lithography, ASM International and ALD is of national interest to The Netherlands. During the recent Royal State Visit of King Willem-Alexander and Queen Máxima of the Netherlands to imec, ASM, a long-standing partner of imec, was in attendance. With over 30 years of partnership, ASM has made significant investments in research and development and maintains a substantial on-site team at imec known in the industry as ASM B or ASM Belgium. During the visit, ASM had the opportunity to highlight its role in the semiconductor ecosystem of both the Netherlands and Belgium, emphasizing how this collaboration connects Europe to advanced semiconductor manufacturing activities on a global scale. (Source: ASM LinkedIn)

ASML, Europe's largest chip equipment company, dominates in lithography, a crucial step in the chip manufacturing process. The Dutch government intends to announce new regulations, including a licensing requirement, for ASML's deep ultraviolet (DUV) semiconductor equipment. ASML's more sophisticated extreme ultraviolet (EUV) lithography machines are already restricted and have never been shipped to China. The U.S. is expected to identify specific Chinese facilities, possibly including those operated by SMIC, China's largest chipmaker, in a new rule that restricts foreign equipment containing any U.S. parts. ASM International, an ALD firm, is also likely to be impacted by the new Dutch regulations.

The U.S. and Dutch measures aim to prevent China from gaining access to advanced chipmaking technology that could be used for military purposes. These actions reflect the ongoing tensions between the U.S. and China regarding national security concerns and technological competition. While the exact details and timing of the restrictions may change, the increasing limitations on chipmaking equipment sales are expected to have significant implications for the global semiconductor industry and the supply chain dynamics in the coming months.

Sources:

US, Dutch set to hit China's chipmakers with one-two punch | Daily Mail Online

State visit to Belgium – programme | News item | Royal House of the Netherlands (royal-house.nl)

ASM breaks ground on new state-of-the-art innovation and manufacturing center in Hwaseong, Korea

ASM International N.V. is embarking on the construction of a state-of-the-art innovation and manufacturing center in Hwaseong, South Korea. With a groundbreaking ceremony to be held soon, the expansion project is part of ASM's US$100 million investment plan and follows a Memorandum of Understanding signed with the Ministry of Trade, Industry and Energy of South Korea. The investment aims to bolster ASM's research and product development infrastructure and increase manufacturing capacity to meet the growing demand for semiconductors. The company also intends to create job opportunities in engineering, R&D, and manufacturing, contributing to workforce development in Korea.

The ceremony will be attended by ASM's CEO, Benjamin Loh, and other dignitaries, including political figures and business partners. Loh expressed his enthusiasm for the expansion in Hwaseong, highlighting the potential and dedication of the Korean people. The investment signifies ASM's commitment to Korea and its ambition to grow the business while enabling the development of advanced technologies in the semiconductor industry. Hwaseong has played a vital role in ASM's growth, serving as a hub for advanced R&D and technology for both local and global customers.

The existing Hwaseong facility, which currently employs over 450 people, will be expanded to accommodate more employees as the company continues to grow. The new extension will add 31,000 m2 across eight floors, more than doubling the facility's R&D area and nearly tripling its manufacturing area. YK Kim, Chairman of ASM Korea, emphasized that the expansion is an investment in people and the semiconductor ecosystem in Korea, aiming to support the country's semiconductor industry growth in collaboration with the government, customers, and suppliers.

ASM's commitment to Hwaseong demonstrates its dedication to the Korean market and its goal of facilitating domestic semiconductor innovation while meeting global customer demands. The company's local R&D team has been instrumental in developing groundbreaking technologies in the industry, such as ALD QCM quad chamber modules, TENZA™ ALD for high aspect ratio gap-fill, and high-quality PEALD silicon and metal oxides and nitrides for various applications. 

Release of TENZA(TM): BALD Engineering - Born in Finland, Born to ALD: ASM International launches TENZA ALD Quad Chambers for silicon oxide gap-fill and liners on the XP8 platform

ASM Korea MOU: BALD Engineering - Born in Finland, Born to ALD: Dutch ALD euipment leader ASM to invest $100 mil. in Korea for facility expansion

ASM faces restrictions on exporting advanced chip equipment to China, impacting its operations.

• ASM faces restrictions on exporting advanced chip equipment to China, impacting its operations.
• Despite the curbs, ASM experiences a boost in demand driven by the growing need for artificial intelligence (AI) technologies.
• The CEO of ASM believes that achieving complete decoupling between the United States and China will be a challenging task.

According to Bloomberg, Dutch CVD, ALD and Epi semiconductor equipment company ASM International NV is experiencing minimal impact on its sales due to US export controls on semiconductor equipment to China. The company remains optimistic as strong demand for chips, driven by artificial intelligence applications such as generative AI, continues to grow. 

ASM's CEO, Benjamin Loh, highlighted the increasing need for memory in the coming years, particularly in the context of AI technologies. ASM expects the chip market to recover from next year onwards, with sales in 2025 surpassing those of 2022. To capitalize on future growth, ASM plans to invest $100 million in expanding its research operations and facility in South Korea and aims to hire an additional 200 staff within three to five years. Despite restrictions on selling advanced chipmaking gear to China, ASM's position as a key machinery provider to Nvidia, a leading AI accelerator supplier, has contributed to its shares gaining over 70% this year.

Loh, reiterates that the company will experience minimal impact from the restrictions on exporting semiconductor equipment to China. Loh mentions that while they are unable to sell the most advanced equipment, there is still a significant market for other non-restricted equipment, and they can continue trading with Chinese customers. He remains optimistic about the future, stating that as long as chip demand continues to grow, there will be other buyers for their premium products. 

Loh also highlights the challenge of complete decoupling between China and the US, as the chip supply chain remains highly globalized. Recent statements from US officials reflect a shift towards derisking rather than decoupling from China in efforts to improve relations between the two economies.

Source: ASM Sees Impact From China Chip Curbs Offset by AI-Driven Demand - Bloomberg

Dutch ALD euipment leader ASM to invest $100 mil. in Korea for facility expansion

Korea’s industry ministry said Thursday it agreed with Dutch semiconductor equipment supplier ASM to boost cooperation for the firm’s planned investment of $100 million to build a production factory and a research and development center in Korea.

The two sides signed a memorandum of understanding (MOU) in Seoul on the day, which calls for joint work for the smooth implementation of the corporate investment worth $100 million through 2025, according to the Ministry of Trade, Industry and Energy.

The company is reviewing building a second factory that produces equipment for atomic layer deposition, a key process in chips manufacturing, and the expansion of its RD center in Korea.

Currently, ASM is headquartered in the city of Hwaseong, Gyeonggi Province, some 40 kilometers south of Seoul.

In October, ASM announced a plan to invest $100 million in Korea, but the amount has surged “as discussions between the two sides have developed,” a ministry official said.

Following the MOU signing ceremony, Industry Minister Lee Chang-yang and ASM CEO Benjamin Loh held a meeting for discussions on the envisioned expansion of bilateral cooperation.

“The investment is expected to help Korea better ensure stable supply chains of the sector and boost exports,” the ministry said in a release. “The government will actively extend support, such as providing incentives and resolving difficulties.” (Yonhap)

Source: Dutch chip firm ASM to invest $100 mil. in Korea for facility expansion

https://theconservativeinvestordaily.com/2023/02/02/dutch-chip-firm-asm-to-invest-100-mil-in-korea-for-facility-expansion/

Thin layers paved the way for ASMI’s success - Outgoing CTO Ivo Raaijmakers explains what atomic layer deposition has brought the semiconductor industry

ASM International played a key role in developing a deposition technique that has saved Moore’s law more than once. Outgoing CTO Ivo Raaijmakers explains what atomic layer deposition has brought the semiconductor industry – and ASMI – and what more is in store.

This vision has come true. The technique that ASMI acquired through Microchemistry – atomic layer deposition (ALD) – has become an integral part of the semiconductor manufacturing process. And that’s just the beginning, according to Raaijmakers. The demands placed on material layers are ever higher – thinner, more uniform, featuring just the right properties – and ALD is the best technique to meet them, the former CTO argues.


Well before ALD had proven itself in the deposition of high-k materials, Raaijmakers was already looking at which applications would follow. On his initiative, ASMI acquired Korean company Genitech in 2004, a specialist in plasma-enhanced ALD technology (PEALD). Plasmas are more reactive than un-ionized gases and therefore can deposit materials at lower temperatures. Because chipmakers often have to deal with strict temperature budgets, PEALD expands the scope of ALD.

Full interview in this article in Bits & Chips: https://bits-chips.nl/artikel/thin-layers-paved-the-way-for-asmis-success/

ASM International has completed the acquisition of Italian Silicon Carbide Equipment Manufacturer LPE S.p.A.

ASM International (Euronext Amsterdam: ASM) today announces that it has completed the acquisition of LPE S.p.A., after having received regulatory approvals.

On July 18, 2022, ASM entered into a definitive agreement under which it would at closing acquire all of the outstanding shares of LPE, an Italian based manufacturer of epitaxial reactors for silicon carbide (SiC) and silicon. As announced in our press release of July 18, 2022, the transaction is financed with a combination of cash, a conditional earn out, and 631,154 ASM shares (a combination of 580,000 treasury shares and 51,154 newly issued shares).

The acquisition has been completed today, and LPE is now a fully owned subsidiary and will operate as a product unit under ASM’s Global Products organization.

“This is an important milestone for ASM. We are excited to welcome LPE and its talented and experienced team into ASM,” said Benjamin Loh, President and CEO of ASM. “Together with LPE we look forward to capturing many of the opportunities in the high-growth silicon carbide epitaxy market and to support our power electronics customers with innovative solutions, driving the further electrification of the automotive industry.”

“I believe ASM is the right partner for LPE, especially now looking at the growth we are seeing in the silicon carbide market. The global reach that ASM has with its entrenched supplier and customer networks will bring benefits to all stakeholders,” said Franco Preti, who envisioned the silicon carbide opportunity in the earliest stages and led LPE growth as CEO until the acquisition.

LPE is profitable with margins in line with ASM’s 2021-2025 target model. As announced earlier, LPE’s revenue is projected to grow to more than €100 million in 2023, mainly driven by its SiC epitaxy equipment business. Based on ASM internal estimates, demand for SiC epitaxy equipment is forecasted to grow at a CAGR in excess of 25% from 2021 to 2025, driven by the rapidly expanding market for electric vehicles.

ASM reports that the ALD market is expected to grow by a CAGR of 16%-20% from 2020 to 2025

ASM International presented its Q2/2022 report in July and a new record orders of EUR 943 million driven by robust new node spending in logic/foundry and by recent wins in memory, particularly for ALD gap-fill in 3D-NAND and continued adoption of HKMG in DRAM.

ASM focuses on the single wafer market so the numbers presented does typically not include ALD Large Batch, which is dominated by Tokyo Electron and Kokusai. Back in 1999, ASM acquired Finnish legendary ALD company Microchemistry and its Pulsar 2000 cross-flow chamber ALD technology, which later took the market as the 300 mm version Pulsar 3000 for HfO2 in HKMG at Intel, TSMC, Samsung Globalfoundries, and others. Now it is interesting to follow how the success story continues also for DRAM HKMG. Since then, ASM has added PEALD from Genitech (South Korea) and Large Batch ALD (A412), and many other ALD process technologies. See recent announcements 2022 here:

BALD Engineering - Born in Finland, Born to ALD: ASM International launches TENZA ALD Quad Chambers for silicon oxide gap-fill and liners on the XP8 platform

BALD Engineering - Born in Finland, Born to ALD: ASM Internaltional launces new 300 mm Vertical batch for LPCVD and ALD

So it is interesting that ASM has launched a new ALD Batch platform based on the now rather old A412 and the new TENZA to capture growth in Gap-fill - a stronghold for Lam Research.

The ALD market is driven by increased wafer starts in 300 mm for sub 45 nm nodes, 3DNAND and DRAM, and the ongoing fab expansions world-wide.

Source: 2022_Q2_Investor_presentation (asm.com)

• TechInsights expects WFE to increase by 21% in 2022 (July 2022)
• Strongest growth in leading-edge nodes, spending on 7nm and below expected to grow from ~25% of WFE in 2020 to ~42% of WFE in 2025
• Gartner expects total WFE to increase by 19% in 2022 (July 2022)

You can compare the TECHCET forecast on precursors where you can see high y-o-y growth going through 2021 and 2023 driven by increased 300 mm wafer production and a slowdown in 2023. Please find deeper dives, assessments and all the data in the TECHCET CMR reports: ALD / CVD Precursors (2) Archives - TECHCET CA LLC

Precursor market forecast 2022-2026 - Invited talk for TECHCET LLC CA in: AA2-TuM2-1 High ALD Equipment and Precursor Demand and 5-Year Forecast Due to Continued Semiconductor Device Scaling and Fab Expansions by Jonas Sundqvist.

ASM International launches TENZA ALD Quad Chambers for silicon oxide gap-fill and liners on the XP8 platform

New process technology addresses 300mm advanced memory and logic/foundry applications with best film quality, highest productivity and lowest cost of ownership in its class.

San Francisco, USA – ASM International N.V. (Euronext Amsterdam: ASM) today announced TENZATM ALD, an innovative single wafer atomic layer deposition (ALD) process technology for 300mm wafers. TENZATM ALD is optimized for gap-fill applications and provides the best film quality, conformal coverage through the full trench and highest productivity in its class.

Quad chamber modules (QCMs) 30, 32, 34, and 36 are connected to four side surfaces of the vacuum chamber 22. Each QCM is a module having four reactor chambers (RC1 to RC4). Processing such as plasma film forming processing is performed on a substrate in each reactor chamber. (ASM Patent application US20170278074A1) LINK: BALD Engineering - Born in Finland, Born to ALD: ASM International enhances ALD productivity with new 300 mm XP8 Quad Chamber Module

TENZATM ALD is offered on ASM’s high productivity quad chamber module (QCM) architecture, with four tightly integrated reactors on each QCM. In a compact configuration, up to 4 QCMs running the TENZATM ALD process can be attached to the XP8 platform, enabling processing of up to 16 wafers at a time.

“TENZATM ALD leverages ASM’s production proven QCM quad chamber module architecture and XP8® platform, which have been in high volume manufacturing fabs for several years, to bring enhanced process capability at the lowest cost of ownership to the market. TENZATM ALD enables ultra-high aspect ratio (>100:1) gap-fill for advanced memory devices”, said Hichem M’Saad, Chief Technology Officer and Member of the Management Board.

TENZATM ALD utilizes a novel design optimized for ALD reactions, minimizing process volume for maximum precursor utilization efficiency, reducing precursor consumption up to 50% and increasing productivity more than double compared to conventional ALD approaches. Each reactor chamber controls the RF plasma power supply and matching system individually to improve process reproducibility. The small volume reactor also provides excellent defect performance and extended reactor life (run time before preventive maintenance). Process reactions are confined within each small volume reactor space to minimize consumable parts, making maintenance very easy and less costly.

TENZATM ALD enables a variety of silicon oxide applications for gap-fill and liners for a range of structures in advanced transistors, memory devices and interconnects. The industry can count on TENZATM ALD to deliver a high quality, reliable, repeatable, production proven gap-fill process with the lowest cost of ownership on the market today.

Deliveries of TENZATM ALD have begun to multiple global customers, among them leaders in memory device manufacturing. ASM’s mature compact ALD quad chamber module architecture has a proven track record with more than 2,000 reactors shipped to customers.

ASM Internaltional launces new 300 mm Vertical batch for LPCVD and ALD

New system addresses 300mm advanced logic/foundry and memory applications with highest productivity and lowest cost of ownership in its class

San Francisco, USA – ASM International N.V. (Euronext Amsterdam: ASM) today introduced the SONORA® vertical furnace system with dual reactor chambers for 300mm wafers. The system’s dual boat reactors produce the highest available throughput in its class, increasing reactor utilization to virtually 100%, while ensuring the lowest capex.

SONORA is named after the blossoming Sonoran desert near Phoenix, Arizona. The look and feel of the SONORA system reflects the colors of the Saturn rockets from the Space Age - a time when semiconductor technology was given a huge boost. It is also the era that gave birth to ASM, and so the SONORA® color scheme creates a link to ASM’s more than 50-year legacy in semiconductor processing equipment. LINK: SONORA_vertical_furnace (asm.com)

“The introduction of the novel SONORA® system is part of our strategy to selectively grow our vertical furnace presence in the market. The new SONORA® ensures that ASM will be strengthening its offering in advanced logic/foundry and memory applications as well as extend our leadership position in the market for More than Moore (such as analog and power) applications,” said Hichem M’Saad, Chief Technology Officer and Member of the Management Board.

The new SONORA® is fully compatible with the original A412™, so existing process recipes are easily transferred, accelerating system qualification and ramp up. System deliveries have begun to multiple customers globally, among them leaders in advanced logic, and power device manufacturing.

ASM’s predecessor A412™ vertical furnace system has a proven track record of more than 1,000 reactors shipped to customers worldwide and over 22 years of maturity in semiconductor manufacturing. The new SONORA® has a novel system architecture that maximizes floor space productivity as well as service area. Its dedicated process modules have individually controlled high purity mini environments. Our innovative gas injection system for low pressure processing provides the best uniformities of deposited films between the individual wafers at larger load sizes. These larger process wafer load sizes combined with the updated control system, new robots, faster wafer cooldown, faster boat exchange modules generate up to 30% more productivity, compared to its predecessor. Higher productivity also results in lower energy and chemical usage per wafer. Special attention was given to the design for serviceability leading to a spacious access for all maintenance activities. The new system has been further modernized with an intuitive graphical user interface, predictive maintenance by advanced control diagnostics, and plug & play installation. Customers can count on the SONORA® delivering increased reliability and better ease of use with production output that achieves better repeatability, productivity, and time utilization.

The A412 PLUS is for 300mm wafers, while the A400 is for 200mm and smaller wafers sizes

Like its predecessor, the SONORA® offers a comprehensive portfolio of process applications including low pressure chemical vapor deposition (LPCVD) processes like doped silicon and silicon nitride films, diffusion processes such as wet oxidation and anneal processes, as well as a leading portfolio of atomic layer deposition (ALD) materials.

Senior Process Engineer I- Coating at ASM Phoenix AZ

About the job

We’re not like most. We don’t just overcome obstacles – we don’t see them. Instead, we see the potential in every person, and every situation. We don’t wait for opportunity to appear – we create it. Meet ASM. A company that has been searching for people just like you.

Job link: (21) Snr Process Engineer I- Coating | ASM | LinkedIn

Who is ASM?

ASM is a leading, global supplier of semiconductor wafer processing equipment. Our ambitious team is dedicated to delivering innovative technology solutions to the world’s leading semiconductor manufacturers. We have over 2,600 employees based in 14 countries, including Belgium, Japan, Netherlands, South Korea, Singapore, Taiwan and United States. Together we work to develop Epitaxy, ALD, PEALD, Vertical Furnaces and PECVD thin-film deposition technologies for our customers. Our goal is to remain an industry leader by being ahead of what’s next. We accomplish this by focusing on finding collaborative solutions to make integrated circuits, or chips, smaller, faster and even more powerful.

ASM, an inclusive workplace

We at ASM are a truly global organization that works diligently with an open-mind in all areas of our business. We strive for a culture and work style that fosters trust and transparency. We put our people first, and that is how we will continue to succeed. We are an equal opportunity employer and value diversity. We recognize and value the differences between individuals, including gender, ethnicity, religious beliefs, sexual orientation, knowledge and experience, work background, age, skills, amongst others. Recruiting and developing a diverse workforce provides a wide range of perspectives. This enables a culture of continuously exploring and adopting new technological ideas and innovations, and it also enables us to deliver excellent products and service to our clients.

Essential Functions

• Work with a safety-first mentality
• Drive ASM process protocol with emphasis and regularly institute or update service solutions to the field
• Work on assigned CIP projects, develop DOE’s and communicate openly both internally and externally.
• Focus on refresh of IP for legacy products and influence new design IP.
• Provide “novelty” to items making them hard to reproduce
• Improve upon existing design for performance and cost efficiency
• Generate project scope documentation and prepares specific project reports against identified schedule.
• Building stakeholder consensus to deliver approach
• Collaboratively manages global stakeholders including end users, technicians, engineers, procurement, spares, manufacturing, subject matter experts as well as management in both business and / or operations to project specific details.
• Applies project management principles to produce cooperative and collaborative efforts, deliver business strategic objectives and fill the end customer needs.
• Consistently provide quality solutions to field and customer personnel and create new BKM’s.
• Exercise good judgment within broadly defined practices and policies in selecting methods, techniques, tools and evaluation criteria for obtaining desired results
• Be willing to travel domestically and internationally as required.
  
  

Education /Experience

• BS or MS Degree in Mechanical engineering, Electrical Engineering, Material Science or related degree required.
• 5+ years of experience in the semiconductor field.
• Equipment Engineering experience with design, and development of complex mechanical systems including comprehension of: reactors, vacuum systems and chambers, gas delivery systems, abatement systems, pneumatics, water cooling, and circuits required. Ability to implement, maintain, improve electrical instruments, equipment, facilities, components, products, systems and provide novel solutions for the semiconductor equipment industry. Comprehension of PLC's and functionality.
• Should have a broad based background in analysis and debug of complex electrical and/or mechanical systems
• Semiconductor capital equipment experience is preferred.
• Understanding of materials: metals, plastics, surface coatings and surface finishes.
• Deposition product knowledge a plus (CVD, ALD, EPI, PVD). Knowledge of ASM Emerald tool distinct plus.
• Design applications Pro/ENGINEER, AutoCAD, and Hands on experience with FEA and CFD analysis preferred. Solid ability to read and understand P&IDs, Electrical, and Mechanical schematics and drawings.
• Proficiency in ANSI Y14.5 geometric dimension and tolerance.
  
  

Skills

• Ability to rectify a challenging situation and gain customer (Internal and external) confidence
• Strong positive attitude, ability to work in a team environment and work alone. Able to drive meetings, both internal and external, with excellent internal ASM relations
• Ability to work responsibly with all ASM resources and departments in a multifunctional high paced atmosphere with minimum supervision on highly complex problems
• Ability to handle multiple tasks simultaneously and be able to organize and run projects
• Strong computer skills, working knowledge of MS Word, Excel, PowerPoint, SharePoint, Project, and SAP
• Drive ASM SOP’s and protocol, able to guide co-workers toward common goals
• Become an active member of ASM GSS core teams
• Excellent communication skills; speak and write in a clear and concise manner, and ability to accurately and fully convey issues to peers, management, or customers
• Strong organizational skills and leadership qualities
• Accurate, timely reporting
• Parts tracking, ordering, managing, Setting BOM levels
• Technical writing background. Ability to create procedures, written in an informative manner that eliminates ambiguity and personal interpretation
• Training skills, be able to communicate with customers and their employees on maintenance procedures, preventative maintenance, and operating specific equipment. Be the content expert with ability to provide onsite support when needed
• Process comprehension, be able to understand basics of creating process recipes focusing on the ALD process.
• Understanding of chemistry interactions with different materials. Gas and liquid chemistry knowledge is a bonus
• Experience with Equipment installs Organizing/Coordinating trades, SL1, SL2, commissioning and qualifications to specific standards.
• SPC creation with JMP/Statistical analysis and ability to drive root cause solutions through data driven decisions
  
  

From the very start of the semiconductor industry to the present day, we’ve been technology leaders who have pioneered innovation and brought new processes into mainstream manufacturing. We are collaborating, creating, and delivering on our vision – a shared vision to drive innovation with new technologies and delivering excellence with dependable products. By doing this, we’ll create new possibilities for everyone to understand, create and share more of what they love.

Be part of our exciting future and join our team today!

ALD centre of excellence to drive leading edge process technology - ASM International and University of Helsinki have renewed and expanded their long-term research agreement

The new five-year agreement entails a significant expansion of the collaboration that already began in 2004 and now gets extended to the impressive length of 23 years. ASM will more than double the current funding provided to the University as part of this agreement. The accelerator laboratory of Department of Physics receives part of the funding. ASM also plans to expand the team at its subsidiary ASM Microchemistry Oy at the Kumpula campus.

ASM Microchemistry has been pioneering ALD (Atomic Layer Deposition) technology since its founding in 1987 and has been co-located since 2004 in the Chemicum building at the Kumpula campus. University of Helsinki, working on ALD since 1990, hosts HelsinkiALD that is one of the world's best known academic research groups in the field of ALD chemistry. The ALD CoE will focus on ALD and other atomic layer processes and thin film materials that are necessary for future microelectronics. ALD is an advanced technology for depositing thin film materials in highly controlled manner for integrated circuits and other applications. Semiconductors in all today’s mobile phones and computers contain materials made by ALD. One recognition of the importance of the ALD technology was the Millennium Technology Prize that was awarded in 2018 to Dr. Tuomo Suntola, the Finnish inventor of ALD.

In front ASM International CEO Benjamin Loh and vice rector Paula Eerola. Behind from left emeritus prof. Markku Leskelä, CTO and Corporate VP R&D Ivo Raaijmakers, VP of Technology & Corporate R&D Vamsi Paruchuri, prof. Mikko Ritala, Senior Director Corporate R&D Operations Kees van der Jeugd, dean Kai Nordlund and assistant prof. Matti Putkonen. (Image: Jani Närhi)

Benjamin Loh, CEO of ASM International, commented:

– The ALD Center of Excellence agreement significantly expands our nearly two-decade long and successful collaboration with University of Helsinki. We are very excited about this partnership aimed for breakthroughs around ALD that will enable future semiconductor technologies.

– Collaboration with ASM, which is exceptional in terms of both length and volume, is highly valuable for the University of Helsinki, stated vice-rector Paula Eerola.

Professor Mikko Ritala and associate professor Matti Putkonen who head the HelsinkiALD research group at the University added:

– We greatly appreciate ASM for the long-term commitment and collaboration. Our research area is clearly exceptionally fruitful and rewarding for academia-industry collaboration. The research questions we are addressing are fundamental by their nature, yet our results may find immediate use in the future semiconductor devices. Therefore division between basic and applied research is meaningless.

A critical element behind the successful collaboration is the mutual understanding and respect of each party’s interests, in particular intellectual property protection for ASM and open science for the university.

– When new innovations are made, these are first patented, after which we are free to publish all the results without any undue delay, said Ritala.

In 2020 ALD center Finland research infrastructure, formed by HelsinkiALD in chemistry department and accelerator and x-ray physics laboratories in physics department, was selected by Academy of Finland to the national research infrastructure roadmap. ALD center Finland serves as a national platform for research and education in atomic layer level processing techniques. The center also supports other fields of research requiring state-of-the-art techniques for thin film deposition, characterisation and surface chemistry, catalysis in particular.

ALD research has also a strong educational dimension.

– It is a pleasure seeing how wanted chemists graduating from us are in the industry and elsewhere. To make the training even more attractive, a unique Master´s programme in ALD has been launched. The students will be majoring from Inorganic materials chemistry study track of Master’s Programme in Materials Research, and their courses are directed so that they cover all important aspects of ALD, including precursors, thin film deposition and characterization as well as potential applications, explains Matti Putkonen, who was appointed in 2019 as an associate professor in atomic layer deposition and etching, seemingly the first one of its kind in the world.

– Our education and hands on training create an exceptionally good starting point for our graduates to become part of the rapidly increasing global ALD community.