New Export Controls on ALD, ALE and ASD Technologies Effective September 2024 to Safeguard National Security

The US Bureau of Industry and Security (BIS) is introducing* stringent export controls targeting advanced technologies essential to national security, particularly within the semiconductor, quantum computing, and additive manufacturing sectors. These controls include new and revised Export Control Classification Numbers (ECCNs) and specific restrictions on critical equipment and materials, such as those involved in Gate-All-Around Field-Effect Transistor (GAAFET) technology, Atomic Layer Etching (ALE), and Atomic Layer Deposition (ALD). The controls aim to safeguard U.S. technological leadership while harmonizing with international export control standards. Specific restrictions apply to high-precision wafer processing equipment and isotopically enriched materials used in quantum computing, reflecting the critical importance of these technologies. These measures ensure that while international collaboration continues, sensitive technologies remain protected under national security protocols.

BIS has introduced new export controls focused on advanced technologies, particularly in the semiconductor, quantum computing, and additive manufacturing sectors. These controls include new Export Control Classification Numbers (ECCNs), revisions to existing ones, and the addition of new license exceptions for countries with similar technical controls. This rule aims to protect national security and advance foreign policy objectives by aligning U.S. export controls with those of international partners. The controls cover a wide range of items, including quantum computing technologies and semiconductor manufacturing equipment, reflecting the critical importance of these technologies to national security. The rule is effective immediately, though there are delayed compliance dates for certain items, allowing businesses time to adjust to the new requirements.

BIS has also established a framework to differentiate between items controlled multilaterally and those controlled through Implemented Export Controls (IEC), which are harmonized with international partners. The new regulations include provisions for annual reporting, particularly concerning the deemed export of quantum technology and software, highlighting the global nature of innovation in these fields. The rule is designed to support U.S. technology leadership while ensuring that export controls do not impede international collaboration, particularly in areas like quantum computing, where global expertise is crucial. Comments on the rule and its potential impact on supply chains and compliance programs are invited, with a focus on refining the scope and clarity of the new ECCNs and license exceptions.

BIS specifies that the restrictions on GAAFET (Gate-All-Around Field-Effect Transistor) technology primarily focus on the "technology" required for the "development" or "production" of GAAFET structures. This includes process recipes and other detailed specifications necessary for fabricating these advanced semiconductor devices. These restrictions are captured under ECCN 3E905, which applies to the "technology" for GAAFETs but does not extend to vertical GAAFET architectures used in 3D NAND. The export, reexport, or transfer of this technology to certain countries requires a license due to its national security and regional stability implications. However, the rules include specific exceptions for existing collaborations and provisions for continued access under certain conditions.

The specific wafer processing technologies restricted for export include:

Dry Etching Equipment:

Equipment designed for isotropic dry etching, as well as anisotropic etching of dielectric materials. These include technologies that enable the fabrication of high aspect ratio features, with aspect ratios greater than 30:1 and a lateral dimension on the top surface of less than 100 nn.  

The specific restrictions on Atomic Layer Etching (ALE) equipment are detailed under the export control regulations. The BIS has imposed controls on equipment designed or modified for anisotropic dry etching, which includes certain types of ALE equipment. These tools, particularly those using RF pulse-excited plasma, pulsed duty cycle excited plasma, and other advanced techniques, are now restricted due to their critical role in the precise fabrication of high-performance semiconductor devices. The restrictions apply to ALE equipment that is capable of producing high aspect ratio features, which are essential for advanced semiconductor manufacturing, making these tools subject to national security and regional stability controls .

Deposition Technologies:

Equipment designed for the selective bottom-up chemical vapor deposition (CVD) of tungsten fill metal, and other deposition processes such as those for tungsten nitride, tungsten, and cobalt layers. This also includes atomic layer deposition (ALD) equipment designed for area selective deposition of barriers or liners.

The restrictions on Atomic Layer Deposition (ALD) equipment are focused on several key types of equipment essential for advanced semiconductor manufacturing. Specifically, ALD equipment designed for area-selective deposition of barriers or liners using organometallic compounds is controlled. This includes equipment capable of area-selective deposition (ASD) that enables fill metal contact to an underlying electrical conductor without a barrier layer at the fill metal via interface to the conductor. Additionally, ALD equipment designed for depositing tungsten (W) to fill interconnects or channels less than 40 nm wide is also restricted. These restrictions are imposed due to the critical role these technologies play in the precision required for the fabrication of next-generation semiconductor devices.

These technologies are controlled under ECCNs (Export Control Classification Numbers) such as 3B001 and related classifications, and are subject to national security (NS) and regional stability (RS) controls.

The specific materials, chemicals, or precursors that are being restricted under the new export controls include:

These restrictions reflect the importance of controlling advanced materials that play a crucial role in emerging technologies, particularly those with significant national security implications, i.e., quantum technologies.

Epitaxial Materials: This includes materials with at least one epitaxially grown layer of silicon or germanium containing a specified percentage of isotopically enriched silicon or germanium. These materials are controlled due to their critical role in developing spin-based quantum computers.

Fluorides, Hydrides, Chlorides: Specific chemicals of silicon or germanium that contain a certain isotopic composition are also restricted. These chemicals are essential in semiconductor manufacturing processes, particularly in the development of quantum technologies.

Silicon, Silicon Oxides, Germanium, or Germanium Oxides: These materials, when isotopically enriched, are restricted due to their applications in quantum computing and other advanced technologies. The control extends to various forms such as substrates, lumps, ingots, boules, and preforms . 

* The new export controls introduced by the Bureau of Industry and Security (BIS) are effective as of September 6, 2024. However, there are delayed compliance dates for certain items, allowing businesses until November 5, 2024, to comply with the new requirements, particularly for specific quantum technologies and related equipment. This delayed compliance is intended to give affected parties time to adjust to the new regulations.

Source:

2024-19633.pdf (SECURED) (govinfo.gov)

Forge Battery Begins Shipping High-Energy 300 Wh/kg Lithium-Ion Cells Made in The USA

Forge Battery, a subsidiary of Forge Nano, has initiated the shipment of its advanced 21700 cylindrical lithium-ion battery cells, branded as “Gen. 1.1 Supercell,” to customers and potential partners. The cells, which boast a specific energy of 300 Wh/kg, have passed rigorous safety certifications (UN 38.3 and UL 1642), allowing for safe transportation. The company plans to deliver thousands of cells throughout 2024, fulfilling existing customer commitments and generating interest from new markets. These cells are designed with over 20% silicon in the anode and use NMC 811 cathodes, outperforming U.S. Advanced Battery Consortium (USABC) energy density targets and reducing costs by 20% per kWh.

The Supercells incorporate Forge Nano’s proprietary Atomic Armor™ coating technology, enhancing the durability and performance of the cells by preventing unwanted chemical reactions. With 90% of the materials sourced from U.S. suppliers, Forge Battery is set to become a key player in the domestic battery market, aiming for full-scale production at its upcoming North Carolina Gigafactory in 2026. These cells are targeted at high-performance applications, including electric trucks, aerospace, and defence, with the potential to outcompete current Tier 1 global suppliers.

Source:

Forge Battery Begins Bulk Customer Shipments of 300 Wh/kg Lithium-Ion Battery Cells - Forge Nano

Samsung Electronics faces challenges in securing tax breaks from the U.S. government for its new chip plant in Taylor, Texas

Samsung Electronics faces challenges in securing tax breaks from the U.S. government for its new chip plant in Taylor, Texas. Amid stiff competition from Intel, Micron Technology, and over 400 other chipmakers, Samsung's negotiations for subsidies under the $53 billion Chips and Science Act are ongoing. The plant, which will produce AI processors, has delayed its mass production start to 2025 due to rising construction costs and disappointing tax benefits. Intel, Micron, and TSMC are also investing heavily in U.S. facilities, intensifying the competition for government funding. Samsung, while not commenting on the negotiations, has highlighted its substantial U.S. investments and cooperation history at a recent event with U.S. lawmakers.

Source: [EXCLUSIVE] Samsung struggles to secure U.S. CHIPS Act funding (joins.com)

Hamas' Brutal Attacks on Israel Could Disrupt Global Tech Supply Chain and Intel's Expansion Plans

The escalating Israel-Hamas war, after Hamas brutal attack on Israel and innocent civilians, is affecting the global tech sector. Many professionals, including top executives, are now serving as reservists in the Israel Defense Forces, as highlighted by EPSNews. Intel, a major private employer in Israel, along with other tech giants like Nvidia, Apple, Amazon, and Microsoft, faces potential disruptions, especially with facilities near conflict zones. The blockade in Gaza and transportation interruptions further strain the supply chain, emphasizing the tech industry's vulnerability to geopolitical challenges.

Intel factory in Kiryat Gat, employing about 5000 workers, which manufactures computer chips (wWikipedia), Location of Intel Fabs in Israel (Google)

Kiryat Gat, situated in Israel's Southern District, is known for Intel's semiconductor fabrication plants, including Fab 28 and the upcoming Fab 38. Founded in 1954, the city has grown significantly due to Jewish immigration over the decades and it remains an educational hub with 25 schools serving over 10,000 students.

The Israel-Hamas conflict has intensified concerns over the global semiconductor supply chain, as CNBC reports. With Israel being a key player in chip production, the geopolitical unrest poses risks to the semiconductor industry. The recent kidnapping of an Nvidia engineer further accentuates these threats, prompting tech firms to prioritize their employees' safety in the region.

Bloomberg reported this summer of Intel Corp.'s initiative to set up a new manufacturing facility in Israel. This move is part of Intel's strategy to diversify its production sources. While details remain undisclosed, the facility will focus on wafer fabrication. Intel's CEO, Pat Gelsinger, intends to expand manufacturing bases outside Asia. The plant, expected to operate from 2027, will be located in Kiryat Gat and is seen as a significant foreign investment in Israel. This development aligns with the global shift in chip manufacturing, as seen with Intel's investment in Poland and Micron Technology's potential investment in India.

Sources: 

War in Israel to Impact Electronics Supply Chain - EPS News

Intel to Build in Israel as Chipmakers Move Beyond East Asia - Bloomberg

Israel Is an Important Link in the Global Chip Supply Chain - Bloomberg

Kiryat Gat - Wikipedia

New US Roadmap Identifies Critical Semiconductor Research Priorities

Advancing semiconductor research is essential to continued innovation in the chip industry and throughout our economy. As ever-shrinking semiconductor components face fundamental physical limits, next-gen breakthroughs are unachievable without major advancements. To help address this challenge, Semiconductor Research Corporation (SRC) today unveiled the Microelectronics and Advanced Packaging (MAPT) Roadmap, which defines critical chip research priorities and technology challenges that must be addressed to support the “seismic shifts” outlined in the Decadal Plan for Semiconductors released by SRC and SIA in January 2021.

The Decadal Plan identified five seismic shifts in the industry related to smart sensing, memory and storage, communication, security, and energy efficient computing. The MAPT Roadmap continues the spirit of the Decadal Plan and discusses how to achieve its system-level goals, outlining the implementation plan for the semiconductor industry. The fundamental research that will transform these obstacles is focused on advanced packaging, 3D integration, electronic design automation, nanoscale manufacturing, new materials, and energy-efficient computing. The MAPT Roadmap is framed around fundamental and practical limits of information and communications technology sustainability: energy sustainability, environmental sustainability, and workforce sustainability.

Federal government and private sector investments in semiconductor R&D have propelled the rapid pace of innovation in the U.S. semiconductor industry, spurring tremendous growth throughout the U.S. and global economies. Using the MAPT Roadmap as a guide, we must sustain and expand public and private investments in chip research to help unlock the transformative technologies of the future.

Source: SIA, Erik Hadland, Director of Technology Policy New Roadmap Identifies Critical Semiconductor Research Priorities - Semiconductor Industry Association (semiconductors.org)

U.S. and Netherlands Tighten Restrictions on Chipmaking Equipment Sales to China, Impacting ALD and ASM International

The United States and the Netherlands are set to impose stricter restrictions on the sale of chipmaking equipment to China, aiming to prevent the use of foreign technology for military strengthening. In their efforts to curb China's access to advanced semiconductor technology, the Dutch government plans to restrict equipment from ASML, the leading chip equipment maker in the Netherlands, while the U.S. plans to further withhold Dutch equipment from specific Chinese fabs. These measures will impact atomic layer deposition (ALD) firm ASM International as well.

Besides ASM and Lithography, ASM International and ALD is of national interest to The Netherlands. During the recent Royal State Visit of King Willem-Alexander and Queen Máxima of the Netherlands to imec, ASM, a long-standing partner of imec, was in attendance. With over 30 years of partnership, ASM has made significant investments in research and development and maintains a substantial on-site team at imec known in the industry as ASM B or ASM Belgium. During the visit, ASM had the opportunity to highlight its role in the semiconductor ecosystem of both the Netherlands and Belgium, emphasizing how this collaboration connects Europe to advanced semiconductor manufacturing activities on a global scale. (Source: ASM LinkedIn)

ASML, Europe's largest chip equipment company, dominates in lithography, a crucial step in the chip manufacturing process. The Dutch government intends to announce new regulations, including a licensing requirement, for ASML's deep ultraviolet (DUV) semiconductor equipment. ASML's more sophisticated extreme ultraviolet (EUV) lithography machines are already restricted and have never been shipped to China. The U.S. is expected to identify specific Chinese facilities, possibly including those operated by SMIC, China's largest chipmaker, in a new rule that restricts foreign equipment containing any U.S. parts. ASM International, an ALD firm, is also likely to be impacted by the new Dutch regulations.

The U.S. and Dutch measures aim to prevent China from gaining access to advanced chipmaking technology that could be used for military purposes. These actions reflect the ongoing tensions between the U.S. and China regarding national security concerns and technological competition. While the exact details and timing of the restrictions may change, the increasing limitations on chipmaking equipment sales are expected to have significant implications for the global semiconductor industry and the supply chain dynamics in the coming months.

Sources:

US, Dutch set to hit China's chipmakers with one-two punch | Daily Mail Online

State visit to Belgium – programme | News item | Royal House of the Netherlands (royal-house.nl)