Sunday, June 16, 2024
ASML Unveils Hyper-NA EUV: Pioneering New Frontiers in Chip Innovation and Efficiency
Monday, January 8, 2024
Intel Receives ASML's First High-NA EUV Lithography Scanner, Pioneering Next-Gen Semiconductor Manufacturing
ASML has delivered its groundbreaking High-NA EUV lithography scanner, the Twinscan EXE:5000, to Intel Oregon. Marking a significant technological leap, this first-of-its-kind scanner boasts a 0.55 NA lens, enabling 8nm resolution for advanced semiconductor manufacturing. Designed for process technologies beyond 3nm, it promises to enhance chip production efficiency and reduce costs. Intel's early adoption of this state-of-the-art equipment, valued between $300-$400 million, positions them at the forefront of the industry, potentially setting new standards in High-NA manufacturing. This development represents a major milestone in semiconductor technology, signaling a new era of innovation and capability in chip production.
Friday, December 29, 2023
ASML's New Chapter: Navigating Tech Innovation and Geopolitical Shifts Under Christophe Fouquet's Leadership
In an era of significant technological and geopolitical changes, ASML, the number one player in the semiconductor industry, stands at a crossroads. The forthcoming retirement of Martin van den Brink and Peter Wennink, who have jointly steered ASML for over a decade, signals the end of a dynamic period. Van den Brink's leadership in technology development propelled ASML to unparalleled heights in the lithography sector, while Wennink’s diplomatic and financial acumen solidified its market dominance. ASML's impact extends beyond technology; it has become a geopolitical force, enhancing the Netherlands and Europe's strategic significance in global politics.
As ASML approaches its 40th anniversary in April 2024, it confronts a changing landscape. The company has weathered various phases – from early struggles to market leadership, marked by innovations like the PAS 5500 and immersion lithography. Under Van den Brink, ASML prioritized technological advancement, often at the expense of other factors like reliability.
The appointment of Christophe Fouquet as the incoming CEO heralds a new era. Fouquet faces the challenge of maintaining ASML's technological edge while adapting to a market nearing the limits of Moore's Law. The shift in focus from chip performance to system-level advancements requires a nuanced approach. Additionally, as technology matures, reliability and predictability become crucial for maintaining ASML's competitive edge.
The transition from a "firefighter" engineering culture to one emphasizing process and reliability won't be easy. Fouquet must balance innovation with operational efficiency, ensuring ASML remains responsive to market and geopolitical dynamics. This requires a departure from the legacy of Van den Brink, focusing instead on a holistic, structured approach to development and engineering.
Fouquet's tenure will be pivotal in shaping ASML's future. His leadership must navigate the complexities of a highly competitive industry, geopolitical pressures, and the evolving technological landscape. The challenge lies in fostering a culture that values reliability and process without stifling the innovative spirit that has been ASML's hallmark. As the company moves into its fifth decade, its ability to adapt and evolve under Fouquet's guidance will determine its continued success in a rapidly changing world.
Advancing the Microchip Revolution: EUV Lithography's Challenges and Future OutlookExtreme Ultraviolet (EUV) lithography represents a significant advancement in semiconductor manufacturing, enabling the production of more compact and efficient integrated circuits, particularly for 7 nm Logic process nodes and below and leading edge DRAM. This technology, developed and marketed primarily by ASML Holding, uses a highly specialized process involving laser-pulsed tin droplet plasma to etch patterns onto substrates at the 13.5 nm wavelength scale. The progression from early prototypes to more efficient models has been remarkable, with modern EUV systems capable of handling 200 wafers per hour, a substantial improvement from initial prototypes.
Looking into the future, EUV lithography is expected to play a critical role in advancing semiconductor technology, especially as the demand for smaller and more powerful chips increases. However, several technological challenges need addressing continiously to fully harness EUV's potential:
1. Optical Component Durability: The EUV process requires highly specialized and sensitive optical components, including mirrors and photomasks. These components are prone to degradation from exposure to high-energy photons and contaminants. Improving their durability and developing efficient cleaning and maintenance processes are crucial.
2. Throughput Efficiency: While significant improvements have been made, further enhancing the throughput of EUV systems is vital. This includes reducing setup times, increasing the speed of the lithography process, and minimizing downtime due to maintenance or component replacement.
3. Pattern Fidelity and Defect Reduction: As circuit patterns become increasingly smaller, maintaining pattern fidelity and reducing defects is challenging. This involves improving the resolution of EUV systems, enhancing photoresist materials to better respond to EUV exposure, and developing more effective methods to mitigate the impact of secondary electrons generated during the lithography process.
EUV Lithography - Balancing Technological Advancements with Energy Challenges
EUV lithography, pivotal in advanced semiconductor manufacturing, faces significant energy consumption challenges. The generation of EUV light, typically via laser-pulsed tin plasma, is inherently energy-intensive. Additionally, maintaining the necessary vacuum environment and cooling systems for these high-precision machines further escalates energy use. As EUV technology becomes more prevalent, especially for producing smaller, more efficient chips, optimizing energy efficiency is critical. Future developments are expected to focus on more efficient light sources, improved system design for energy conservation, and advanced thermal management, aiming to reduce the overall energy footprint of EUV lithography processes.
EUV Lithography's Hydrogen Demand: A Growing Concern in Chip Manufacturing
EUV Lithography, also raises concerns regarding its significant hydrogen consumption. The EUV process relies heavily on hydrogen gas to maintain the cleanliness of the optical elements, particularly for preventing tin deposition on the mirrors. The need for a continuous supply of hydrogen to facilitate this cleaning process contributes to the overall operational costs and resource demands of EUV systems. As EUV technology becomes more widespread in chip manufacturing, addressing the sustainability and efficiency of hydrogen usage will be essential, both from an environmental and economic perspective.
In EUV lithography, managing hydrogen usage presents distinct challenges. The technology requires hydrogen for removing contaminants from critical mirrors, demanding systems capable of handling high volumes while maintaining vacuum integrity. This necessity places a premium on innovative system designs that minimize the footprint and energy consumption associated with hydrogen management, directly impacting the cost and efficiency of semiconductor manufacturing. Safety considerations, given hydrogen's flammability, are paramount. Advanced, fuel-free hydrogen management strategies are employed to ensure safety and environmental compliance. These strategies focus on reducing flammability risks and eliminating the need for additional fuels, thereby minimizing carbon emissions and contributing to sustainable manufacturing practices.
Continued research and development in these areas are essential for the advancement of EUV lithography, ensuring it meets the rapidly evolving demands of the semiconductor industry.
Sources:
Christophe Fouquet’s ASML must reinvent itself – Bits&Chips (bits-chips.nl)
www.imec.be
www.edwards.com
Wikipedia
2023 update to IRDS roadmap reminds key EUV issues.
— Fred Chen (@DrFrederickChen) December 28, 2023
1. EUV dose triples every four nodes => increasing electron blur?
2. EUV cannot replace multiple patterning, even with higher NA.https://t.co/hZzkfKGfyr
Friday, November 3, 2023
Dutch Election Frontrunner Advocates for Earlier ASML Export Restrictions to China
Dilan Yesilgoz-Zegerius, the leading candidate in the Dutch elections, has stated that the Netherlands should have responded more swiftly to restrict exports of ASML Holding NV's advanced chipmaking equipment to China. The U.S. has coordinated with the Netherlands and Japan to impose these export bans, which are set to take effect in January, in an effort to prevent China from using the technology to gain a military advantage. ASML, the most valuable Dutch company, has opposed these restrictions.
A recent incident where Chinese company Semiconductor Manufacturing International Corp. used ASML equipment to make advanced processors for Huawei smartphones underscores the urgency and the missed opportunity for earlier action by the Netherlands.
Yesilgoz-Zegerius acknowledged that the Netherlands had been "naive" about its security, emphasizing the need for cooperation with the U.S. to ensure independence from undesirable collaborations. Her stance, however, contrasts with some local lawmakers who criticize the export curbs as an infringement on Dutch sovereignty.
As she vies to become the Netherlands' first female prime minister and the first refugee to hold the position, Yesilgoz-Zegerius has made headlines with her tough stance on immigration, opposing a parliamentary motion that reduces tax benefits for expats and arguing for a significant reduction in migrant numbers. Her comments have sparked debate among Dutch tech companies like ASML, which rely on international expertise and have expressed concerns about the tightening of such tax benefits.
Source:
ASML China Export Curbs Too Late, Yesilgoz-Zegerius Says - Bloomberg
Thursday, October 19, 2023
ASML and Lam Research Navigate US Chip Restrictions with Continued Focus on China
The evolving landscape of the global semiconductor industry, marked by the escalating US chip curbs, has seen two industry leaders, ASML and Lam Research, maintain a significant focus on the Chinese market. ASML, the Dutch semiconductor behemoth, has reported a remarkable surge in its sales to China. As they dominate the market for DUV lithography machines, essential for chip production, sales to China for ASML soared to €2.44 billion ($2.58 billion) in the recent quarter, nearly doubling the figures from the previous one. Meanwhile, Lam Research, a US chipmaking equipment supplier for CVD, ALD and Etch, is experiencing a year-on-year decline in revenue by 31.4% to $3.5 billion in the quarter ending Sept. 24, remains buoyant about the Chinese market. With China accounting for a staggering 48% of its total revenue, up from 30% the previous year and 26% in the preceding quarter, CEO Tim Archer remains optimistic. He emphasized that the new U.S. export restrictions brought no unforeseen challenges and anticipates sustainable business growth in China, citing the country's long-term objectives.
Photo : ASML on X
However, it's not all smooth sailing. As the US and the Netherlands tighten their grip on chip equipment exports in an attempt to curb China's burgeoning semiconductor industry, challenges arise for these giants. Notably, Lam Research's shares fell by over 5% in extended trading after Archer's announcement. Furthermore, even though both ASML and Lam Research foresee continued demand from China, the trajectory remains uncertain with the intricate web of export controls and regulations. Still, with giants like KLA, Applied Materials, Tokyo Electron, and the aforementioned firms steering the ship, the semiconductor industry remains hopeful about navigating these turbulent waters.
ASML ArFi vs EUV sales by quarter pic.twitter.com/upEE0vXwpO— Fred Chen (@DrFrederickChen) October 18, 2023
Sources:
ASML stays optimistic on China as sales surge amid U.S. chip curbs - Nikkei Asia
Lam Research sees no material impact from new U.S. chip curbs - Nikkei Asia
Friday, September 22, 2023
ASML's 2023 Outlook: Surging Ahead in Semiconductor Equipment Despite Challenges and Export Controls
In 2023, ASML, the leading semiconductor lithography equipment supplier, is set to achieve remarkable success, outpacing its rivals and emerging as the number 1 provider of Wafer Fabrication Equipment. Boasting an impressive 30% revenue growth forecast for the year, ASML is thriving amidst an industry landscape marked by its consistent performance. With a substantial backlog of cutting-edge Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) systems and surging demand from China, ASML's growth continues despite hurdles like supply chain disruptions and regulatory changes, ASML remains a beacon of innovation and resilience in the semiconductor sector.
By Abhishek Kumar Thakur and Jonas Sundqvist
ASML, a leading supplier of semiconductor equipment, is poised for a significant year in 2023, projected to surpass Applied Materials (AMAT) as the top provider of Wafer Fabrication Equipment. This achievement is attributed to ASML's robust revenue growth, expected to reach a remarkable 30% increase in 2023, while Applied Materials faces a decline of 20% according to Seeking Alpha*. ASML's success can be attributed to a substantial backlog of Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) systems, driven by heightened demand in China.
* Fact check: Due to strong DUV revenue and despite the increased uncertainties, ASML expects strong growth for 2023 with a net sales increase towards 30% and a slight improvement in gross margin, relative to 2022. ASML Holding revenue for the twelve months ending June 30, 2023 was $27.293B, a 25.97% increase year-over-year. AMAT revenue is estimated to increase by 2.6% to 26.33 B. Meaning ASML would pass bu end of 2023.
https://finance.yahoo.com/quote/AMAT/analysis/
Despite facing challenges like supply chain disruptions and a factory fire, ASML has consistently ranked among the top three semiconductor equipment suppliers since 2017. Their backlog of EUV systems, combined with growing acceptance of DUV tools, contributes to their strong performance.
However, potential headwinds include supply chain concerns, past issues like the Berlin factory fire, and looming sanctions affecting exports to China. While ASML has addressed some challenges, the possibility of US sanctions in 2024 poses a threat to its growth.
Furthermore, ASML now faces new export controls imposed by the Netherlands, impacting shipments to China. While the company downplays these controls' immediate financial impact, they are expected to affect specific DUV systems, adding to global efforts to limit China's semiconductor advancements.
In this volatile landscape, ASML's ability to adapt to evolving regulations and maintain its technological leadership will be crucial. The impact of these restrictions, especially on shipments to China, could influence the company's growth trajectory in the semiconductor industry. Despite these challenges, ASML remains a prominent player with significant potential in the semiconductor equipment market.
ASML is set to deliver the industry's first High-NA extreme ultraviolet (EUV) lithography scanner by the end of 2023, marking a significant development for advanced chip manufacturing. The Twinscan EXE:5000 pilot scanner with a 0.55 numerical aperture (NA) will enable chipmakers to explore High-NA EUV technology. This innovation is crucial for achieving an 8nm resolution, suitable for manufacturing technologies beyond 5nm nodes. Intel is expected to be the first customer, but integration and adoption details are still uncertain. This advancement requires substantial investments, with reports suggesting costs of $300-400 million per unit.
To add some colour, initially, Intel had plans to employ ASML's High-NA tools for its 18A (1.8 nm) production node, scheduled for high-volume manufacturing in 2025, aligning with ASML's Twinscan EXE:5200 delivery. However, Intel accelerated its 18A production, moving it to the latter part of 2024. This change in strategy involved the use of ASML's Twinscan NXE:3600D/3800E with two exposures and Applied Material's Endura Sculpta pattern-shaping system. The objective was to reduce reliance on EUV double patterning techniques. Applied Materials' Centura Sculpta is a pattern-shaping machine equipped with a unique algorithm that can manipulate patterns produced by an EUV scanner. It has the capability to stretch these patterns in a user-defined direction along the X-axis. This process effectively reduces the space between features and enhances pattern density. This means that moving ahead ASML and Applied Materials are entering an interesting competitive space previously not encountered.
ASMLs Products
As an background, ASML specializes in the production of cutting-edge lithography systems crucial for semiconductor manufacturing. Their product portfolio includes the following key offerings:
Extreme Ultraviolet (EUV) Lithography Machines: ASML's EUV lithography machines are at the forefront of semiconductor manufacturing technology. These machines use extremely short wavelengths of light to create intricate patterns on silicon wafers, enabling the production of advanced and smaller semiconductor chips. EUV technology is essential for next-generation processors and memory chips.
Deep Ultraviolet (DUV) Lithography Machines: DUV lithography systems are another vital component of ASML's product lineup. They use longer wavelengths of light compared to EUV and are employed for a wide range of semiconductor applications, including memory and logic chip production. ASML's DUV systems are known for their precision and reliability.
TWINSCAN Series: Within the DUV lithography category, ASML offers the TWINSCAN series, which includes machines like the TWINSCAN NXT:2000i, NXT:2050i, and NXT:2100i. These systems are designed for immersion lithography, where the wafer and the lens are submerged in a liquid, enhancing precision and resolution.
EUV High Numerical Aperture (NA) Systems: ASML has been advancing its lithography machines by increasing the numerical aperture (NA), a key parameter that affects resolution. High-NA systems are capable of printing even smaller features on semiconductor wafers, enabling the production of highly advanced chips.
ASML's lithography machines are considered critical infrastructure for semiconductor manufacturing, and the company's technological leadership in this area has positioned it as a dominant player in the industry. The company's ability to innovate and adapt its lithography systems to meet the ever-increasing demands of semiconductor manufacturers has been a key factor in its success and growth prospects. However, the recent export controls and geopolitical pressures, particularly concerning shipments to China, introduce additional challenges and uncertainties for ASML and its specialized products.
Sources:
ASML Hit With New Dutch Limits on Chip Gear Exports to China - Bloomberg
ASML To Top WFE Semiconductor Equipment In 2023, Topping Applied Materials | Seeking Alpha
ASML to ship first pilot tool in its next product line in 2023, CEO says | Reuters
ASML to Deliver First High-NA EUV Tool This Year (anandtech.com)
EUV Alternative Speeds Up Chip Production - EE Times
Wednesday, September 6, 2023
ASML Remains on Track to Deliver High NA EUV Machines in 2023
Thursday, August 24, 2023
TSMC Marks Major Milestone: First EUV Machine Installed in Arizona Fab, Job Opportunities Open
Taiwan Semiconductor Manufacturing Co. (TSMC) has achieved a significant milestone in its Arizona manufacturing venture by installing its inaugural extreme ultraviolet lithography (EUV) machine. This advanced machine, procured from Dutch semiconductor equipment leader ASML Holding NV, is a pivotal asset for TSMC's future high-end chip production endeavors.
EUV technology is a critical aspect of semiconductor fabrication, facilitating the printing of intricate designs on microchips significantly smaller than a human hair. TSMC's achievement underscores its commitment to innovation and technological leadership.
While the installation of the EUV machine marks a remarkable accomplishment, TSMC acknowledges that the setup of the new fab in Arizona involves numerous additional tasks. The company emphasized the need for approximately 2,000 skilled workers to handle the installation of various equipment pieces and services in the complex. This requirement stems from TSMC's unique tool configurations and specifications.
TSMC, recognized as the world's largest contract chip manufacturer, is channeling substantial investments amounting to $40 billion into constructing two wafer fabs in Phoenix. The first facility will employ the advanced 4-nanometer process, while the second, already under construction, will utilize the more sophisticated 3-nanometer process. This latter technology has already entered mass production in Taiwan.
The presence of skilled workers has been a contentious topic linked to the Arizona project. TSMC Chairman Mark Liu explained that a deficiency in experts capable of properly installing equipment at the Arizona site has led to a delay in mass production, now projected for 2025 rather than late 2024.
However, TSMC's approach to addressing this shortfall has sparked debates. The company's bid to bring in around 500 Taiwanese workers on temporary E-2 visas has faced resistance from local unions, who assert that prioritizing American jobs is paramount, especially considering the significant subsidies TSMC seeks under the CHIPS and Science Act. This legislation, signed by President Joe Biden, encourages semiconductor investments in the United States.
US Senator Mark Kelly of Arizona emphasized that the visa applications will be evaluated in accordance with established laws and procedures. As TSMC navigates these challenges, its progress in Arizona remains a focal point in the semiconductor industry's dynamic landscape.
TSMC installs first EUV machine in U.S.; job opening ads posted - Focus Taiwan
Friday, June 30, 2023
U.S. and Netherlands Tighten Restrictions on Chipmaking Equipment Sales to China, Impacting ALD and ASM International
The United States and the Netherlands are set to impose stricter restrictions on the sale of chipmaking equipment to China, aiming to prevent the use of foreign technology for military strengthening. In their efforts to curb China's access to advanced semiconductor technology, the Dutch government plans to restrict equipment from ASML, the leading chip equipment maker in the Netherlands, while the U.S. plans to further withhold Dutch equipment from specific Chinese fabs. These measures will impact atomic layer deposition (ALD) firm ASM International as well.
Besides ASM and Lithography, ASM International and ALD is of national interest to The Netherlands. During the recent Royal State Visit of King Willem-Alexander and Queen Máxima of the Netherlands to imec, ASM, a long-standing partner of imec, was in attendance. With over 30 years of partnership, ASM has made significant investments in research and development and maintains a substantial on-site team at imec known in the industry as ASM B or ASM Belgium. During the visit, ASM had the opportunity to highlight its role in the semiconductor ecosystem of both the Netherlands and Belgium, emphasizing how this collaboration connects Europe to advanced semiconductor manufacturing activities on a global scale. (Source: ASM LinkedIn)
ASML, Europe's largest chip equipment company, dominates in lithography, a crucial step in the chip manufacturing process. The Dutch government intends to announce new regulations, including a licensing requirement, for ASML's deep ultraviolet (DUV) semiconductor equipment. ASML's more sophisticated extreme ultraviolet (EUV) lithography machines are already restricted and have never been shipped to China. The U.S. is expected to identify specific Chinese facilities, possibly including those operated by SMIC, China's largest chipmaker, in a new rule that restricts foreign equipment containing any U.S. parts. ASM International, an ALD firm, is also likely to be impacted by the new Dutch regulations.
The U.S. and Dutch measures aim to prevent China from gaining access to advanced chipmaking technology that could be used for military purposes. These actions reflect the ongoing tensions between the U.S. and China regarding national security concerns and technological competition. While the exact details and timing of the restrictions may change, the increasing limitations on chipmaking equipment sales are expected to have significant implications for the global semiconductor industry and the supply chain dynamics in the coming months.
Sources:
US, Dutch set to hit China's chipmakers with one-two punch | Daily Mail Online
State visit to Belgium – programme | News item | Royal House of the Netherlands (royal-house.nl)
Saturday, November 28, 2020
Applied Materials will regain its No. 1 ranking in the semiconductor equipment market in 2020 from ASML
- Atomic Layer Deposition
- MOCVD
- Furnace
- Dielectric Etch
- Spray Processing
- Dielectric Etch (including ALE)
- Wet Stations
1. Move in to top 3 spot in ALD2. Take number 2 spot in Furnace business
Thursday, April 2, 2020
TSMC hit by 3nm delay fears over Covid-19 Lock-downs
Below a comparison of the Covid-19 daily new confirmed deaths, which is the only comparable parameter to use due to different testing capabilities and frequencies, in time and nation to nation. As can be seen the situation in Asian is under control after the gotten hit by the first wave of the Coronavirus. The European situation is stabilizing: Italy, Netherlands, Germany France, others look similar and are flattening the curve. In The USA situation is escalating. Many nations in Europe are forecasting a lift of Lockdown in May but are very careful, as an example Germany will decide in 19 April how to proceed according to Chancellor Dr. Angela Merkel.
BALD Engineering AB continues to monitor the Covid-19 situation due to lockdowns that affect the the semiconductor industry – Stay Safe!
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By Abhishekkumar Thakur, Jonas Sundqvist
Saturday, January 4, 2020
EUV - The Extreme Physics Pushing Moore’s Law to the Next Level
By Abhishekkumar Thakur
Saturday, December 14, 2019
IEDM 2019 News - Intel roadmap to 1.4 nm by 2029
Saturday, March 16, 2019
VLSIresearch released its list of the top Semiconductor Equipment Suppliers for 2018 shown big wins for Japanese OEMs
Tuesday, October 23, 2018
Imec and ASML Enter Next Stage of EUV Lithography Collaboration
Intensified collaboration will advance high-volume production with current EUV lithography and develop future EUV systems
LEUVEN (Belgium) & VELDHOVEN (The Netherlands), OCTOBER 22, 2018 (LINK) —Today, world-leading research and innovation hub in nanoelectronics and digital technologies imec, and ASML Holding N.V. (ASML), the technology and market leader in lithographic equipment, announce the next step in their extensive collaboration. Together, they will accelerate the adoption of EUV lithography for high-volume production, including the current latest available equipment for EUV (0.33 Numerical Aperture, NA). Moreover, they will explore the potential of the next-generation high-NA EUV lithography to enable printing of even smaller nanoscale devices advancing semiconductor scaling towards the post 3 nanometer Logic node. To this end, they will establish a joint high-NA EUV research lab.Imec and ASML have been conducting joint research for almost thirty years. In 2014, they created a joint research center, the Advanced Patterning Center, to optimize lithography technology for advanced CMOS integration and to prepare the ecosystem to support advance patterning requirements. Now, they bring this cooperation to the next stage with the installation of ASML’s most advanced and high-volume production dedicated EUV scanner (NXE:3400B) in imec’s cleanroom. Utilizing imec’s infrastructure and advanced technology platforms, imec and ASML researchers and partner companies can pro-actively analyze and solve technical challenges such as defects, reliability and yield, and as such accelerate the EUV technology’s industrialization.