ASML has delivered its groundbreaking High-NA EUV lithography scanner, the Twinscan EXE:5000, to Intel Oregon. Marking a significant technological leap, this first-of-its-kind scanner boasts a 0.55 NA lens, enabling 8nm resolution for advanced semiconductor manufacturing. Designed for process technologies beyond 3nm, it promises to enhance chip production efficiency and reduce costs. Intel's early adoption of this state-of-the-art equipment, valued between $300-$400 million, positions them at the forefront of the industry, potentially setting new standards in High-NA manufacturing. This development represents a major milestone in semiconductor technology, signaling a new era of innovation and capability in chip production.
Monday, January 8, 2024
Friday, December 29, 2023
ASML's New Chapter: Navigating Tech Innovation and Geopolitical Shifts Under Christophe Fouquet's Leadership
In an era of significant technological and geopolitical changes, ASML, the number one player in the semiconductor industry, stands at a crossroads. The forthcoming retirement of Martin van den Brink and Peter Wennink, who have jointly steered ASML for over a decade, signals the end of a dynamic period. Van den Brink's leadership in technology development propelled ASML to unparalleled heights in the lithography sector, while Wennink’s diplomatic and financial acumen solidified its market dominance. ASML's impact extends beyond technology; it has become a geopolitical force, enhancing the Netherlands and Europe's strategic significance in global politics.
As ASML approaches its 40th anniversary in April 2024, it confronts a changing landscape. The company has weathered various phases – from early struggles to market leadership, marked by innovations like the PAS 5500 and immersion lithography. Under Van den Brink, ASML prioritized technological advancement, often at the expense of other factors like reliability.
The appointment of Christophe Fouquet as the incoming CEO heralds a new era. Fouquet faces the challenge of maintaining ASML's technological edge while adapting to a market nearing the limits of Moore's Law. The shift in focus from chip performance to system-level advancements requires a nuanced approach. Additionally, as technology matures, reliability and predictability become crucial for maintaining ASML's competitive edge.
The transition from a "firefighter" engineering culture to one emphasizing process and reliability won't be easy. Fouquet must balance innovation with operational efficiency, ensuring ASML remains responsive to market and geopolitical dynamics. This requires a departure from the legacy of Van den Brink, focusing instead on a holistic, structured approach to development and engineering.
Fouquet's tenure will be pivotal in shaping ASML's future. His leadership must navigate the complexities of a highly competitive industry, geopolitical pressures, and the evolving technological landscape. The challenge lies in fostering a culture that values reliability and process without stifling the innovative spirit that has been ASML's hallmark. As the company moves into its fifth decade, its ability to adapt and evolve under Fouquet's guidance will determine its continued success in a rapidly changing world.
Advancing the Microchip Revolution: EUV Lithography's Challenges and Future OutlookExtreme Ultraviolet (EUV) lithography represents a significant advancement in semiconductor manufacturing, enabling the production of more compact and efficient integrated circuits, particularly for 7 nm Logic process nodes and below and leading edge DRAM. This technology, developed and marketed primarily by ASML Holding, uses a highly specialized process involving laser-pulsed tin droplet plasma to etch patterns onto substrates at the 13.5 nm wavelength scale. The progression from early prototypes to more efficient models has been remarkable, with modern EUV systems capable of handling 200 wafers per hour, a substantial improvement from initial prototypes.
Looking into the future, EUV lithography is expected to play a critical role in advancing semiconductor technology, especially as the demand for smaller and more powerful chips increases. However, several technological challenges need addressing continiously to fully harness EUV's potential:
1. Optical Component Durability: The EUV process requires highly specialized and sensitive optical components, including mirrors and photomasks. These components are prone to degradation from exposure to high-energy photons and contaminants. Improving their durability and developing efficient cleaning and maintenance processes are crucial.
2. Throughput Efficiency: While significant improvements have been made, further enhancing the throughput of EUV systems is vital. This includes reducing setup times, increasing the speed of the lithography process, and minimizing downtime due to maintenance or component replacement.
3. Pattern Fidelity and Defect Reduction: As circuit patterns become increasingly smaller, maintaining pattern fidelity and reducing defects is challenging. This involves improving the resolution of EUV systems, enhancing photoresist materials to better respond to EUV exposure, and developing more effective methods to mitigate the impact of secondary electrons generated during the lithography process.
EUV Lithography - Balancing Technological Advancements with Energy Challenges
EUV lithography, pivotal in advanced semiconductor manufacturing, faces significant energy consumption challenges. The generation of EUV light, typically via laser-pulsed tin plasma, is inherently energy-intensive. Additionally, maintaining the necessary vacuum environment and cooling systems for these high-precision machines further escalates energy use. As EUV technology becomes more prevalent, especially for producing smaller, more efficient chips, optimizing energy efficiency is critical. Future developments are expected to focus on more efficient light sources, improved system design for energy conservation, and advanced thermal management, aiming to reduce the overall energy footprint of EUV lithography processes.
EUV Lithography's Hydrogen Demand: A Growing Concern in Chip Manufacturing
EUV Lithography, also raises concerns regarding its significant hydrogen consumption. The EUV process relies heavily on hydrogen gas to maintain the cleanliness of the optical elements, particularly for preventing tin deposition on the mirrors. The need for a continuous supply of hydrogen to facilitate this cleaning process contributes to the overall operational costs and resource demands of EUV systems. As EUV technology becomes more widespread in chip manufacturing, addressing the sustainability and efficiency of hydrogen usage will be essential, both from an environmental and economic perspective.
In EUV lithography, managing hydrogen usage presents distinct challenges. The technology requires hydrogen for removing contaminants from critical mirrors, demanding systems capable of handling high volumes while maintaining vacuum integrity. This necessity places a premium on innovative system designs that minimize the footprint and energy consumption associated with hydrogen management, directly impacting the cost and efficiency of semiconductor manufacturing. Safety considerations, given hydrogen's flammability, are paramount. Advanced, fuel-free hydrogen management strategies are employed to ensure safety and environmental compliance. These strategies focus on reducing flammability risks and eliminating the need for additional fuels, thereby minimizing carbon emissions and contributing to sustainable manufacturing practices.
Continued research and development in these areas are essential for the advancement of EUV lithography, ensuring it meets the rapidly evolving demands of the semiconductor industry.
Sources:
Christophe Fouquet’s ASML must reinvent itself – Bits&Chips (bits-chips.nl)
www.imec.be
www.edwards.com
Wikipedia
2023 update to IRDS roadmap reminds key EUV issues.
— Fred Chen (@DrFrederickChen) December 28, 2023
1. EUV dose triples every four nodes => increasing electron blur?
2. EUV cannot replace multiple patterning, even with higher NA.https://t.co/hZzkfKGfyr
Tuesday, September 26, 2023
TechInsights Discovers Micron's Cutting-Edge D1β LPDDR5 16 Gb DRAM Chips in Apple iPhone 15 Pro: Setting a New Standard in Memory Technology
TechInsights has confirmed Micron's cutting-edge D1β LPDDR5 16 Gb DRAM chips in the Apple iPhone 15 Pro, marking the industry's first venture into the D1β generation. These chips are smaller and denser than their predecessors, showcasing significant advancements in DRAM technology. Notably, Micron has achieved this without utilizing Extreme Ultraviolet Lithography (EUVL), a technique employed by competitors like Samsung and SK Hynix for their DRAM processes. This achievement highlights Micron's dedication to pushing the boundaries of DRAM technology, emphasizing innovation and efficiency in the tech landscape. Micron's groundbreaking D1β LPDDR5 16 Gb DRAM chip promises to reshape the future of memory technology, setting a new standard for the industry.
(Source Micron.com)
1-BETA includes cool stuff
"While the industry has begun to shift to a new tool that uses extreme ultraviolet light to overcome these technical challenges, Micron has tapped into its proven leading-edge nano-manufacturing and lithography prowess to bypass this still emergent technology. Doing so involves applying the company’s proprietary, advanced multi-patterning techniques and immersion capabilities to pattern these minuscule features with the highest precision," Micron explains. Thy Tran, VP Process Integration, Micron
Sources:
Micron LPDDR5 16 Gb Non-EUVL Chip Found in Apple iPhone 15 Pro | TechInsights
LPDRAM | LPDDR | Micron Technology
Micron Ships World’s Most Advanced DRAM Technology With 1-Beta Node | Micron Technology
Friday, September 22, 2023
ASML's 2023 Outlook: Surging Ahead in Semiconductor Equipment Despite Challenges and Export Controls
In 2023, ASML, the leading semiconductor lithography equipment supplier, is set to achieve remarkable success, outpacing its rivals and emerging as the number 1 provider of Wafer Fabrication Equipment. Boasting an impressive 30% revenue growth forecast for the year, ASML is thriving amidst an industry landscape marked by its consistent performance. With a substantial backlog of cutting-edge Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) systems and surging demand from China, ASML's growth continues despite hurdles like supply chain disruptions and regulatory changes, ASML remains a beacon of innovation and resilience in the semiconductor sector.
By Abhishek Kumar Thakur and Jonas Sundqvist
ASML, a leading supplier of semiconductor equipment, is poised for a significant year in 2023, projected to surpass Applied Materials (AMAT) as the top provider of Wafer Fabrication Equipment. This achievement is attributed to ASML's robust revenue growth, expected to reach a remarkable 30% increase in 2023, while Applied Materials faces a decline of 20% according to Seeking Alpha*. ASML's success can be attributed to a substantial backlog of Deep Ultraviolet (DUV) and Extreme Ultraviolet (EUV) systems, driven by heightened demand in China.
* Fact check: Due to strong DUV revenue and despite the increased uncertainties, ASML expects strong growth for 2023 with a net sales increase towards 30% and a slight improvement in gross margin, relative to 2022. ASML Holding revenue for the twelve months ending June 30, 2023 was $27.293B, a 25.97% increase year-over-year. AMAT revenue is estimated to increase by 2.6% to 26.33 B. Meaning ASML would pass bu end of 2023.
https://finance.yahoo.com/quote/AMAT/analysis/
Despite facing challenges like supply chain disruptions and a factory fire, ASML has consistently ranked among the top three semiconductor equipment suppliers since 2017. Their backlog of EUV systems, combined with growing acceptance of DUV tools, contributes to their strong performance.
However, potential headwinds include supply chain concerns, past issues like the Berlin factory fire, and looming sanctions affecting exports to China. While ASML has addressed some challenges, the possibility of US sanctions in 2024 poses a threat to its growth.
Furthermore, ASML now faces new export controls imposed by the Netherlands, impacting shipments to China. While the company downplays these controls' immediate financial impact, they are expected to affect specific DUV systems, adding to global efforts to limit China's semiconductor advancements.
In this volatile landscape, ASML's ability to adapt to evolving regulations and maintain its technological leadership will be crucial. The impact of these restrictions, especially on shipments to China, could influence the company's growth trajectory in the semiconductor industry. Despite these challenges, ASML remains a prominent player with significant potential in the semiconductor equipment market.
ASML is set to deliver the industry's first High-NA extreme ultraviolet (EUV) lithography scanner by the end of 2023, marking a significant development for advanced chip manufacturing. The Twinscan EXE:5000 pilot scanner with a 0.55 numerical aperture (NA) will enable chipmakers to explore High-NA EUV technology. This innovation is crucial for achieving an 8nm resolution, suitable for manufacturing technologies beyond 5nm nodes. Intel is expected to be the first customer, but integration and adoption details are still uncertain. This advancement requires substantial investments, with reports suggesting costs of $300-400 million per unit.
To add some colour, initially, Intel had plans to employ ASML's High-NA tools for its 18A (1.8 nm) production node, scheduled for high-volume manufacturing in 2025, aligning with ASML's Twinscan EXE:5200 delivery. However, Intel accelerated its 18A production, moving it to the latter part of 2024. This change in strategy involved the use of ASML's Twinscan NXE:3600D/3800E with two exposures and Applied Material's Endura Sculpta pattern-shaping system. The objective was to reduce reliance on EUV double patterning techniques. Applied Materials' Centura Sculpta is a pattern-shaping machine equipped with a unique algorithm that can manipulate patterns produced by an EUV scanner. It has the capability to stretch these patterns in a user-defined direction along the X-axis. This process effectively reduces the space between features and enhances pattern density. This means that moving ahead ASML and Applied Materials are entering an interesting competitive space previously not encountered.
ASMLs Products
As an background, ASML specializes in the production of cutting-edge lithography systems crucial for semiconductor manufacturing. Their product portfolio includes the following key offerings:
Extreme Ultraviolet (EUV) Lithography Machines: ASML's EUV lithography machines are at the forefront of semiconductor manufacturing technology. These machines use extremely short wavelengths of light to create intricate patterns on silicon wafers, enabling the production of advanced and smaller semiconductor chips. EUV technology is essential for next-generation processors and memory chips.
Deep Ultraviolet (DUV) Lithography Machines: DUV lithography systems are another vital component of ASML's product lineup. They use longer wavelengths of light compared to EUV and are employed for a wide range of semiconductor applications, including memory and logic chip production. ASML's DUV systems are known for their precision and reliability.
TWINSCAN Series: Within the DUV lithography category, ASML offers the TWINSCAN series, which includes machines like the TWINSCAN NXT:2000i, NXT:2050i, and NXT:2100i. These systems are designed for immersion lithography, where the wafer and the lens are submerged in a liquid, enhancing precision and resolution.
EUV High Numerical Aperture (NA) Systems: ASML has been advancing its lithography machines by increasing the numerical aperture (NA), a key parameter that affects resolution. High-NA systems are capable of printing even smaller features on semiconductor wafers, enabling the production of highly advanced chips.
ASML's lithography machines are considered critical infrastructure for semiconductor manufacturing, and the company's technological leadership in this area has positioned it as a dominant player in the industry. The company's ability to innovate and adapt its lithography systems to meet the ever-increasing demands of semiconductor manufacturers has been a key factor in its success and growth prospects. However, the recent export controls and geopolitical pressures, particularly concerning shipments to China, introduce additional challenges and uncertainties for ASML and its specialized products.
Sources:
ASML Hit With New Dutch Limits on Chip Gear Exports to China - Bloomberg
ASML To Top WFE Semiconductor Equipment In 2023, Topping Applied Materials | Seeking Alpha
ASML to ship first pilot tool in its next product line in 2023, CEO says | Reuters
ASML to Deliver First High-NA EUV Tool This Year (anandtech.com)
EUV Alternative Speeds Up Chip Production - EE Times
Wednesday, September 6, 2023
ASML Remains on Track to Deliver High NA EUV Machines in 2023
Thursday, August 24, 2023
TSMC Marks Major Milestone: First EUV Machine Installed in Arizona Fab, Job Opportunities Open
Taiwan Semiconductor Manufacturing Co. (TSMC) has achieved a significant milestone in its Arizona manufacturing venture by installing its inaugural extreme ultraviolet lithography (EUV) machine. This advanced machine, procured from Dutch semiconductor equipment leader ASML Holding NV, is a pivotal asset for TSMC's future high-end chip production endeavors.
EUV technology is a critical aspect of semiconductor fabrication, facilitating the printing of intricate designs on microchips significantly smaller than a human hair. TSMC's achievement underscores its commitment to innovation and technological leadership.
While the installation of the EUV machine marks a remarkable accomplishment, TSMC acknowledges that the setup of the new fab in Arizona involves numerous additional tasks. The company emphasized the need for approximately 2,000 skilled workers to handle the installation of various equipment pieces and services in the complex. This requirement stems from TSMC's unique tool configurations and specifications.
TSMC, recognized as the world's largest contract chip manufacturer, is channeling substantial investments amounting to $40 billion into constructing two wafer fabs in Phoenix. The first facility will employ the advanced 4-nanometer process, while the second, already under construction, will utilize the more sophisticated 3-nanometer process. This latter technology has already entered mass production in Taiwan.
The presence of skilled workers has been a contentious topic linked to the Arizona project. TSMC Chairman Mark Liu explained that a deficiency in experts capable of properly installing equipment at the Arizona site has led to a delay in mass production, now projected for 2025 rather than late 2024.
However, TSMC's approach to addressing this shortfall has sparked debates. The company's bid to bring in around 500 Taiwanese workers on temporary E-2 visas has faced resistance from local unions, who assert that prioritizing American jobs is paramount, especially considering the significant subsidies TSMC seeks under the CHIPS and Science Act. This legislation, signed by President Joe Biden, encourages semiconductor investments in the United States.
US Senator Mark Kelly of Arizona emphasized that the visa applications will be evaluated in accordance with established laws and procedures. As TSMC navigates these challenges, its progress in Arizona remains a focal point in the semiconductor industry's dynamic landscape.
TSMC installs first EUV machine in U.S.; job opening ads posted - Focus Taiwan
An Update on Directed Self-Assembly (DSA) for Advancing Micro and Nano Fabrication
DSA has emerged as a groundbreaking technique for mass-producing micro to nano devices and materials with precision and efficiency. This method harnesses the inherent properties of materials to assemble them into intricate structures, revolutionizing manufacturing processes across various industries.
DSA leverages block co-polymer morphology to create patterns, enhancing feature control and shape accuracy. This involves guiding the assembly of micro and nano particles to achieve desired structures, made possible by the precise control of surface interactions and polymer thermodynamics. The key advantage of DSA is its ability to create structures at remarkably small scales, enabling advancements in diverse fields.
In the semiconductor industry, DSA offers a new perspective on lithography challenges. Despite initial setbacks, DSA is being revisited to address critical issues such as stochastic defects in extreme ultraviolet (EUV) lithography. These defects, which can contribute significantly to patterning errors, have led semiconductor manufacturers to explore DSA as a solution to rectify these problems. Notably, DSA is not replacing traditional methods but rather enhancing them. It is being integrated with existing manufacturing processes to enable increased resolution and precision, all while reducing costs.
However, challenges persist in integrating DSA into high-volume manufacturing. Defect control remains a primary concern, as the technology strives to meet industry standards of minimal defectivity. Common defects include line bridging, collapse, bubbles, and dislocations. Efforts are ongoing to optimize annealing temperature, etching methods, and film thickness to reduce these defects. Another challenge is the complexity of pattern inspection, which demands accurate metrology methods. Researchers are exploring machine learning-based approaches to automate the inspection process and achieve higher throughput.
Despite these challenges, DSA is being applied to various applications beyond semiconductors. Tissue engineering benefits from the precision of directed assembly, enabling the controlled organization of cells into desired micro-structures. In nanotechnology, DSA facilitates the creation of precise nanostructures, leading to advancements in areas such as graphene nanoribbon arrays and thin-film quantum materials.
Revolutionizing EUV Lithography with Directed Self-Assembly (DSA)
EUV lithography has revolutionized semiconductor manufacturing but comes with its share of challenges, particularly in addressing line roughness and stochastic defects. DSA has now gained attention as a potential game-changer to tackle these issues in EUV lithography.
Recent research from Imec sheds light on the promising synergy between EUV and DSA in overcoming lithography challenges. In the study titled "EUV Lithography Line Space Pattern Rectification Using Block Copolymer Directed Self-Assembly: A Roughness and Defectivity Study," led by Julie Van Bel and team, the researchers explored the combination of DSA with EUV. Their findings indicate that this integration surpasses DSA processes based on Immersion lithography, offering lower line width roughness and freedom from dislocation defects.
Another study, "Mitigating Stochastics in EUV Lithography by Directed Self-Assembly," led by Lander Verstraete and collaborators, delved into the application of DSA to mitigate stochastic defects in EUV processing.
For contact arrays, the combination of EUV and DSA demonstrates improved Local Critical Dimension Uniformity (LCDU) and Pattern Placement Error. This advancement also enables the use of a lower dose, contributing to enhanced precision and efficiency in semiconductor manufacturing.
Imec's research underscores the potential of DSA to revolutionize EUV lithography by addressing line roughness and stochastic defects. The successful integration of EUV and DSA holds the promise of enhancing semiconductor manufacturing processes, achieving higher precision, and enabling the production of advanced devices with improved quality. As researchers continue to refine these methods, the collaboration between EUV and DSA is set to shape the future of lithography and microfabrication.
In conclusion, DSA is revitalizing micro and nano fabrication by offering accurate and efficient methods for mass production. While challenges like defect control and metrology persist, DSA's potential to shape the future of industries such as semiconductors, biomedicine, and nanotechnology is undeniable. As research continues to refine DSA processes and overcome hurdles, its role in advancing technology and innovation is set to expand further.
Directed Self-Assembly Finds Its Footing (semiengineering.com)
Friday, June 30, 2023
U.S. and Netherlands Tighten Restrictions on Chipmaking Equipment Sales to China, Impacting ALD and ASM International
The United States and the Netherlands are set to impose stricter restrictions on the sale of chipmaking equipment to China, aiming to prevent the use of foreign technology for military strengthening. In their efforts to curb China's access to advanced semiconductor technology, the Dutch government plans to restrict equipment from ASML, the leading chip equipment maker in the Netherlands, while the U.S. plans to further withhold Dutch equipment from specific Chinese fabs. These measures will impact atomic layer deposition (ALD) firm ASM International as well.
Besides ASM and Lithography, ASM International and ALD is of national interest to The Netherlands. During the recent Royal State Visit of King Willem-Alexander and Queen Máxima of the Netherlands to imec, ASM, a long-standing partner of imec, was in attendance. With over 30 years of partnership, ASM has made significant investments in research and development and maintains a substantial on-site team at imec known in the industry as ASM B or ASM Belgium. During the visit, ASM had the opportunity to highlight its role in the semiconductor ecosystem of both the Netherlands and Belgium, emphasizing how this collaboration connects Europe to advanced semiconductor manufacturing activities on a global scale. (Source: ASM LinkedIn)
ASML, Europe's largest chip equipment company, dominates in lithography, a crucial step in the chip manufacturing process. The Dutch government intends to announce new regulations, including a licensing requirement, for ASML's deep ultraviolet (DUV) semiconductor equipment. ASML's more sophisticated extreme ultraviolet (EUV) lithography machines are already restricted and have never been shipped to China. The U.S. is expected to identify specific Chinese facilities, possibly including those operated by SMIC, China's largest chipmaker, in a new rule that restricts foreign equipment containing any U.S. parts. ASM International, an ALD firm, is also likely to be impacted by the new Dutch regulations.
The U.S. and Dutch measures aim to prevent China from gaining access to advanced chipmaking technology that could be used for military purposes. These actions reflect the ongoing tensions between the U.S. and China regarding national security concerns and technological competition. While the exact details and timing of the restrictions may change, the increasing limitations on chipmaking equipment sales are expected to have significant implications for the global semiconductor industry and the supply chain dynamics in the coming months.
Sources:
US, Dutch set to hit China's chipmakers with one-two punch | Daily Mail Online
State visit to Belgium – programme | News item | Royal House of the Netherlands (royal-house.nl)
Tuesday, June 13, 2023
EUV Lithography Embraces Sustainability with Hydrogen Recycling System
Edwards Vacuum and Imec Develop Reverse Fuel Cell to Recycle Contaminated Hydrogen in Chip Manufacturing
“It’s similar to a fuel cell, in reverse.”—Anthony Keen, Edwards Vacuum
Tuesday, May 2, 2023
TechInsights found Samsung DRAM chips in Samsung Galaxy S23 with Five EUV mask layers
TechInsights found Samsung DRAM chips in Samsung Galaxy S23 with Five EUV mask layers. These are from DRAM wafers produced in the so-called D1a node (or D1α, α as in alpha)
👉https://t.co/oSv4yiHJiB
— TechInsights (@techinsightsinc) May 1, 2023
Get your products to market faster: @TechInsightsinc found next-gen #DRAM found in the #GalaxyS23. @Samsung is the first company to apply five #EUV lithography masks on DRAM D1a, the first node to fully adopt EUVL for #DRAM. Learn more. #semiconductor pic.twitter.com/2Pqg7gKuE9
This is in line with a previous press release from Samsung (2020) so no real surprise here: Samsung Announces Industry’s First EUV DRAM with Shipment of First Million Modules – Samsung Global Newsroom
"EUV to be fully deployed from 4th-gen 10nm-class DRAM (D1a) next year"
EUV will be fully deployed in Samsung’s future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.
Friday, March 3, 2023
Applied Materials’ Pattern-Shaping Technology - Centura Sculpta
- Directed ribbon-beam capability for novel etching applications
Tuesday, August 30, 2022
Comparison confirms that SMIC reaches 7nm without access to western equipment & technologies
Similarities with TSMC 7nm have been found
Thursday, July 14, 2022
Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem
Collaboration provides robust chemical supply chain for global chipmakers using the breakthrough technology and supports R&D for next-generation EUV applications
Friday, April 30, 2021
The US Patent Office has approved AlixLabs’ patent application for nanofabrication by ALE Pitch Splitting (APS)
Friday, February 26, 2021
Tech Insights Teardown: Samsung’s D1z DRAM with EUV Lithography
Reuters: SK Hynix signs five-year deal worth $4.3 billion with ASML to secure EUV scanners
Thursday, February 11, 2021
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging with High-NA EUV Interference Lithography
Source: LINK
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By Abhishekkumar Thakur
Thursday, January 21, 2021
Master Thesis in Nanotechnology with Alixlabs in Sweden on Atomic Level Fragmentation
Tuesday, October 6, 2020
Imec demonstrates CNT pellicle utilization on EUV scanner
LEUVEN (Belgium, LINK) October 6, 2020 — Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, announced today promising results in extreme ultraviolet (EUV) reticle protection. Multiple CNT-based pellicles were mounted on reticles and exposed in the NXE:3300 EUV scanner at imec, demonstrating the successful fabrication and scanner handling of full-field CNT-based pellicles. The tested pellicles had a single-pass EUV transmission up to 97%. The impact on imaging was found to be low and correctable based on critical dimension (CD), dose, and transmission measurements.
A pellicle is a membrane used to protect the photomask from contamination during high-volume semiconductor manufacturing. It is mounted a few millimeters above the surface of the photomask so that if particles land on the pellicle, they will be too far out of focus to print. Developing such an EUV pellicle is very challenging, since 13.5nm light is absorbed by most materials. In addition, stringent thermal, chemical, and mechanical requirements must be achieved. Such highly transparent pellicle is critical to enable high yield and throughput in advanced semiconductor manufacturing.
Imec has leveraged partners in the semiconductor industry, materials companies and fundamental research to develop an innovative EUV pellicle design with potential to survive scanner powers beyond 600 Watts
“Imec has leveraged partners in the semiconductor industry, materials companies and fundamental research to develop an innovative EUV pellicle design with potential to survive scanner powers beyond 600 Watts,” said Emily Gallagher, principal member of technical staff at imec. “We have seen tremendous progress in carbon nanotube membrane development in the past year and, based on strong collaborations with our partners, are confident it will result in a high-performance pellicle solution in the near future.”
CNTs are one-atom-thick carbon sheets rolled into tubes. The CNTs can be single-, double- or multi-walled and can vary in diameter and in length. These engineered CNTs can be arranged in different configurations to form membranes of different densities. Since 2015, imec has been working with selected CNT suppliers (Canatu Oy and Lintec of America, Inc., Nano-Science & Technology Center) to develop membranes that meet the EUV pellicle targets for properties like transmittance, thermal durability, permeability, and strength and to enable the imaging results reported today. Future work will focus on achieving acceptable lifetimes for high volume manufacturing of these pellicles in scanners.
Thursday, May 21, 2020
Reuters: Samsung Electronics builds sixth domestic contract chip-making line
Saturday, January 4, 2020
EUV - The Extreme Physics Pushing Moore’s Law to the Next Level
By Abhishekkumar Thakur