Tokyo Electron has introduced Acrevia, a state-of-the-art gas cluster beam (GCB) system aimed at refining patterns created by EUV lithography. This advanced tool is set to reduce the necessity for EUV double patterning, thereby improving chipmaking yields and lowering production costs. Acrevia addresses critical challenges such as line edge roughness (LER), a common issue in lithography that affects the precision of pattern edges and overall chip performance. By optimizing pattern sidewalls through precise etching, Acrevia promises to significantly enhance within-wafer uniformity and mitigate LER, contributing to higher yield and better chip reliability. While not replacing High-NA EUV lithography, Acrevia marks a substantial leap forward in semiconductor manufacturing innovation.
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