Surfs are going to be up at the PRiME Symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea. This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

List of confirmed invited speakers (from North America, Asia and Europe):

1. Bart Macco, TU Eindhoven, Netherlands, Review of ALD for solar cells

2. Maarit Karppinen, Aalto University, Finland, ALD/MLD for energy / membrane technology

3. Chad Brick, Gelest, USA, Silanes and silazanes precursors for Area Specific Deposition

4. Makoto Sekine, Nagoya Univ., Japan, Low damage ALE of AlGaN

5. Rong Chen, HUST Univ. Wuhan, China, ALD for Cataysis and other applications

6. Mikhael Bechelany, IEM, Montpellier, France, Recent Advancements and Emerging Applications in ALD on High-Porosity Materials

7. Miika Mattinen, Univ Helsinki, Finland, ALD of dichalcogenides for electrocatalysis

8. Bonggeun Shong, Hongik University, Korea, Theory of area-selective ALD

9. Miin-Jang Chen, National Taiwan Univ., Inhibitor-free Area-Selective ALD

10. Hyungjun Kim, Yonsei University, Korea, ALD of “Group 16 Compounds” for Emerging Applications (2D TMDCs)

11. Agnieszka Kurek, Oxford Instruments, United Kingdom, Faster ALD for Emerging Quantum Applications

12. Matthew Metz, Inte, USA, Keynote on "Materials Challenges in Future Semiconductor Devices"

13. Junling Lu, University of Science and Technology of China, ALD for Catalysis

14. Sung Gap Im, KAIST, Korea, Vapor-phase Deposited Functional Polymer Films for Electronic Device Applications

15. Jason Croy, Argonne National Lab, USA, Next-gen batteries & ALD

16. Mark Saly, Applied Materials, USA, Key Challenges in Area Selective Deposition: from R&D Scale to High Volume Manufacturing

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Laser Slicing Technique Revolutionizes GaN Substrate Recycling, Paving the Way for Cost-Effective Vertical Power MOSFETs

A study led by Takashi Ishida and colleagues explored a recycling process for gallium nitride (GaN) substrates using a laser slicing technique, aiming to reduce the cost of GaN vertical power MOSFETs. GaN is noted for its potential in high-power applications due to its superior electrical properties compared to silicon. The cost of GaN devices, while expected to be lower than silicon carbide (SiC) devices, is significantly impacted by the expensive GaN substrates. The proposed recycling process involves the use of laser slicing to separate used GaN substrates into thin device chips and a remaining substrate portion, which can then be smoothed, polished, and reused for further device fabrication.

The research demonstrated that the electrical properties of devices fabricated on recycled GaN substrates, specifically lateral MOSFETs and vertical PN diodes, showed no degradation compared to those on new substrates. This indicates that the recycling process does not adversely affect the substrate's quality or the performance of subsequent devices. The study's findings suggest that this recycling method could be a viable strategy to lower the production costs of GaN-based power devices, potentially facilitating their broader adoption in high-power applications.

Source: Demonstration of recycling process for GaN substrates using laser slicing technique towards cost reduction of GaN vertical power MOSFETs - IOPscience

Tokyo Electron ALD of AlN Thin Films Report Unprecedented Uniformity on Large Batch 200 mm Tool

In the rapidly evolving world of semiconductor technology, achieving high uniformity in thin films is important for enhancing production yield and device performance. In a study led by Partha Mukhopadhyay and his team at Tokzo Electron has made significant strides in this domain, using ALD of aluminum nitride (AlN) thin films on a 200 mm large batch furnace platform. AlN is particularly relevant for gallium nitride (GaN)-based power industry, where AlN's wide bandgap, high dielectric constant, and superior thermal conductivity make it an ideal choice for various applications, including UV LEDs, transistors, and micro-electromechanical systems.

The study's focus lies in its ability to maintain extraordinary uniformity across large batches of 200 mm wafers, achieving a thickness variation of less than 0.5 Å. This level of uniformity was obtained by optimizing the ALD process in a reactor capable of handling over 100 wafers, marking a significant achievement in high-volume production environments. The research examined the effects of deposition temperatures, film thicknesses, and different substrate types, including Si, quartz, and GaN/Si(111), on the material and optical properties of the AlN films.

One of the key findings was the identification of an optimal narrow temperature window between 300°C and 350°C for the deposition process, with 350°C being the sweet spot. The study also delved into the nuanced challenges of nucleation on different substrates, revealing that substrate-inhibited growth and a non-linear deposition rate are pivotal factors to consider. This understanding is crucial for maintaining uniformity in extremely thin films, which are sensitive to the underlying substrate's crystal orientation.

From a compositional standpoint, the development showcased the high purity of the AlN films, with negligible carbon and oxygen contamination. This purity is essential for the semiconductor industry, particularly for applications where chemical stability is critical. The study's rigorous material analysis, which included techniques like XPS and TEM, provided in-depth insights into the AlN films' structural and compositional integrity.

Optically, the AlN films demonstrated a bandgap of 5.8 eV, a key attribute for their use in optoelectronic applications. The research also highlighted the refractive index's dependence on film thickness and deposition temperature, offering valuable data for the design and optimization of optical devices.

In summary, this study represents a significant progress in ALD of AlN thin films, combining high throughput with exceptional film uniformity and quality. 

Source: Nucleation of highly uniform AlN thin films by high volume batch ALD on 200 mm platform | Journal of Vacuum Science & Technology A | AIP Publishing

Aalto University in Finland Wins Major Grant for Eco-Friendly Semiconductor Technology

Aalto University, in close collaboration with key industry players including Applied Materials in Finland (Picosun), PiBond, and Volatec, has been awarded a significant grant by Business Finland for their groundbreaking project titled “New chemistries for resource-efficient semiconductor manufacturing”. This initiative is a part of the larger "Chip Zero" Ecosystem, spearheaded by Picosun, aiming to revolutionize the semiconductor industry by developing chips that boast zero lifetime emissions—a first in Finland's tech landscape.

Led by Professors Maarit Karppinen and Antti Karttunen from Aalto's Department of Chemistry and Materials Science, the project seeks to address the pressing environmental concerns associated with semiconductor manufacturing. With the industry's carbon footprint and resource consumption at an all-time high, this co-innovation venture promises to pave the way for more sustainable production methods.

Dr. Ramin Ghiyasi working in the CHEMI-SEMI project holding a silicon wafer after atomic layer deposition, Department of Chemistry and Material Science

The project's goals are ambitious yet crucial. By innovating new chemical processes and materials, the team aims to minimize the environmental impact of semiconductor fabrication. This includes the development of novel, eco-friendly precursors and solvents, enhancing material purification, and advancing recycling practices, as highlighted by Dr. Marja Tiitta from Volatec.

Dr. Thomas Gädda of PiBond emphasizes the importance of collaborative efforts in achieving these sustainability targets, underscoring the project's reliance on a synergy of expertise from academia and industry. This collaborative framework is expected to yield advancements in chemical usage, process optimization, and energy efficiency in semiconductor manufacturing.

With its comprehensive approach, combining experimental research with computational modeling, the project aspires not only to innovate within the confines of semiconductor technology but also to set a new standard for environmentally conscious manufacturing practices in the industry.

Source: Significant Grant for Greener Semiconductor Technology from Business Finland | Aalto University