Showing posts with label Conferences / Workshops. Show all posts
Showing posts with label Conferences / Workshops. Show all posts

Monday, April 15, 2024

Ahead of the 50 Years of ALD celebration in Helsinki, learn about the origins, growth and future of the AVS ALD Conference with Greg Parsons and Steve George

The AVS ALD Conference is the main event for those in Atomic Layer Deposition. The 3-day meeting rotates between the US, Europe and Asia, chock full of interesting parallel sessions, an industry exhibition, and a few sponsored extracurricular activities. In August, the ALD conference will return for the first time in 20 years to Helsinki, Finland, the technologys place of origin. 2024 marks 50 years since Tuomo Suntolas original patent application for ALD, and this year we will celebrate the meteoric rise of the atomic scale process. In this exclusive interview from The ALDepartment, Tyler sits down with two of the founding members of the AVS ALD Conference, Professor Greg Parsons from North Carolina State University, and his PhD advisor at the University of Colorado Boulder, Professor Steven George, to talk about the origins, growth and future of the meeting. Greg and Steve discuss the challenges surrounding the conception of the conference, an unexpected letter from a major ALD company, the enormous success of the 1st conference and how they believe the meeting may change in the future. 


In this Interview: 
00:00 Intro 
01:43 How the conference started 
10:00 An unexpected letter from ASM 
12:16 The first AVS ALD conference 
22:37 Growth and direction 
33:12 Future of AVS ALD
42:16 Reflections and favorite conferences




Friday, March 22, 2024

Surfs are going to be up at the PRiME Symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea. This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.


The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;
2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;
3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;
4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;
5. New precursors and delivery systems;
6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence
7. Coating of nanoporous materials by ALD;
8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;
9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;
10. ALD for energy storage applications;
11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;
12. Area-selective ALD;
13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

List of confirmed invited speakers (from North America, Asia and Europe):

1. Bart Macco, TU Eindhoven, Netherlands, Review of ALD for solar cells
2. Maarit Karppinen, Aalto University, Finland, ALD/MLD for energy / membrane technology
3. Chad Brick, Gelest, USA, Silanes and silazanes precursors for Area Specific Deposition
4. Makoto Sekine, Nagoya Univ., Japan, Low damage ALE of AlGaN
5. Rong Chen, HUST Univ. Wuhan, China, ALD for Cataysis and other applications
6. Mikhael Bechelany, IEM, Montpellier, France, Recent Advancements and Emerging Applications in ALD on High-Porosity Materials
7. Miika Mattinen, Univ Helsinki, Finland, ALD of dichalcogenides for electrocatalysis
8. Bonggeun Shong, Hongik University, Korea, Theory of area-selective ALD
9. Miin-Jang Chen, National Taiwan Univ., Inhibitor-free Area-Selective ALD
10. Hyungjun Kim, Yonsei University, Korea, ALD of “Group 16 Compounds” for Emerging Applications (2D TMDCs)
11. Agnieszka Kurek, Oxford Instruments, United Kingdom, Faster ALD for Emerging Quantum Applications
12. Matthew Metz, Inte, USA, Keynote on "Materials Challenges in Future Semiconductor Devices"
13. Junling Lu, University of Science and Technology of China, ALD for Catalysis
14. Sung Gap Im, KAIST, Korea, Vapor-phase Deposited Functional Polymer Films for Electronic Device Applications
15. Jason Croy, Argonne National Lab, USA, Next-gen batteries & ALD
16. Mark Saly, Applied Materials, USA, Key Challenges in Area Selective Deposition: from R&D Scale to High Volume Manufacturing

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Monday, February 26, 2024

PRiME 2024: A Global Convergence on Atomic Layer Processing Set for Honolulu This October

The PRiME Joint International Meeting, organized by the Electrochemical Society and sister societies from Japan and Korea, will take place from October 6-11, 2024, in Honolulu, Hawaii. Anticipating over 4000 participants, the conference will focus on solid-state science, technology, and electrochemistry. Symposium G01 invites submissions on Atomic Layer Deposition and Etching, covering topics from semiconductor applications to energy storage. The deadline for abstract submission is April 12, 2024. Last year's event saw 78 presentations, indicating a strong interest in the field. For visa, travel information, and participation letters, contact ECS representatives.



Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea.

This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

A list of confirmed invited speakers (from North America, Asia and Europe) will soon be available.

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Symposium organizers:

F. Roozeboom, (lead), University of Twente; e-mail: f.roozeboom@utwente.nl,
S. De Gendt, IMEC & Catholic University Leuven,
J. Dendooven, Ghent University,
J. W. Elam, Argonne National Laboratory,
O. van der Straten, IBM Research,
A. Illiberi, ASM Europe,
G. Sundaram, Veeco,
R. Chen, Huazhong University of Science and Technology,
O. Leonte, Berkeley Polymer Technology,
T. Lill, Clarycon Nanotechnology Research,
M. Young, University of Missouri,
A. Kozen, University of Vermont.

Saturday, January 27, 2024

AlixLabs Celebrates Gold Sponsorship at ALD/ALE 2024 in Helsinki: Honoring Dr. Tuomo Suntola and Embracing Advances in Atomic Layer Etching

 We are proud to be Gold Sponsors of ALD/ALE 2024 in Helsinki, Finland . We look forward to contribute to the conference program and meet you in the exhibition. We especially look forward to join the celebration 50 Years of ALD and honor the inventor and Millennium Prize Winner 2018 Dr. Tuomo Suntola.


It is also a prime event for Atomic Layer Etching this year since our CTO Dr. Dmitry Suyatin and our Advisory Board Member Prof. Fred Roozeboom are co-chairing the ALE Conference!

Please visit The Conference Page for full details: https://ald2024.avs.org/





Tuesday, January 23, 2024

Atomic Scale Innovation Workshop in Copenhagen

PIONEERING ATOMIC SCALE INNOVATION - FROM MATERIALS TO SCALABLE APPLICATIONS

Hosted by ATLANT 3D, this event is a gathering point for industry experts, researchers, and technical professionals, all focused on exploring the vast potential of Atomic Layer Deposition (ALD) and related technologies.

The future of manufacturing lies in precision and sustainability. At ATLANT3D, we are deeply committed to advancing the frontiers of atomic scale manufacturing, unlocking novel avenues for materials development and scalable applications. This conference is our call to arms, bringing together the brightest minds to push the boundaries of what’s possible.




Topics & Highlights:
• ALD's current market and applications in various industries.
• In-depth presentations on advanced materials innovation.
• Interactive discussions on the future of atomic layer processing.

Speakers:
• PROF. DR. Fred Roozeboom, UNIVERSITY OF TWENTE
Topic: “Atomic Layer Deposition: Its Evolution, Diverse Applications, and Future Prospects”.
• DR. Maksym Plakhotnyuk 🇺🇦, CEO & FOUNDER OF ATLANT 3D
Topic: “Atomic Layer Processing: Driving Global Innovation in Advanced Manufacturing”.
• PROF. DR. Erwin Kessels, EINDHOVEN UNIVERSITY OF TECHNOLOGY Topic: “Innovations in Plasma Processing for Nanoscale Fabrication”.
• DR. Mira Baraket, HEAD OF TECHNOLOGY R&D AT ATLANT 3D
Topic: “Advancements in 2D Materials Synthesis Through Atomic Layer Deposition”.
• DR. Alexander Kozen, UNIVERSITY OF VERMONT
Topic: “Progress and Opportunities for Atomic Layer Deposition to Facilitate Next-Generation Batteries”.
• PROF. DR. Julien Bachmann, FAU ERLANGEN-NÜRNBERG
Topic: “Harnessing ALD for Next-Generation Photovoltaics and Electrochemical Energy Storage”.
• DR. Jacques Kools, CEO & FOUNDER AT ENCAPSULIX
Topic: “ALD Deposited Ultrabarriers for Applications in Electronics, Energy, and Medical Fields”.
• DR. Ville Miikkulainen, ALTO UNIVERSITY
Topic: “Photo-assisted ALD: Enabler for Direct-Write ALD”.

Download brochure:

https://lnkd.in/eyUdPBXj

Special Features:
• Exclusive visit to ATLANT 3D's state-of-the-art A-HUB & Laboratory facilities.
• A social evening for informal networking and collaboration.

Friday, December 1, 2023

ASD2024: Uniting the World of Area Selective Deposition in Historic Old Montreal

Announcement for ASD2024 Workshop

Dates: April 15-16, 2024

Location: Old Montreal, Canada

Welcome and bienvenue to the exciting Area Selective Deposition (ASD) workshop to be held in the picturesque Old Montreal. This two-day event, scheduled for April 15 and 16, offers an enriching platform for both academic and industry professionals to exchange groundbreaking ideas in the field of ASD.


Special Sessions:

1. Pre-Workshop Tutorial: A comprehensive half-day tutorial on April 14 (Sunday afternoon). Note: This session requires an additional fee.

2. Atomic Layer Processing Showcase: A half-day event on April 17 (Wednesday morning), highlighting Canada's advancements in atomic layer processing. This session is included in the conference fee.



Conference Venues:

- Hotel Place d'Armes (55 Rue Saint-Jacques): Main sessions and lunches on Monday and Tuesday will be hosted here. This 4-star hotel is conveniently located near a metro stop.

- Hotel Nelligan (106 Saint-Paul St W): A 4-star boutique hotel, the venue for the opening mixer on Sunday evening and the poster session on Monday evening.

Workshop Highlights:

- Single session format over two days featuring invited and contributed talks.

- A panel discussion focusing on the industrial and academic communication of ASD.

- Networking opportunities with leading experts and peers.

Explore Montreal:

Participants are encouraged to experience the charm of Old Montreal, known for its vibrant restaurants, bars, shopping venues, and historical sites like the Notre Dame Basilica and the port. For sports enthusiasts, the Circuit Gilles Villeneuve offers a unique opportunity for running and cycling.

Organizers:

- Prof. Sean Barry, Carleton University

- Prof. Paul Ragogna, Western University


Scientific Committee:

- Adrie Mackus, Eindhoven University of Technology

- Anjana Devi, Ruhr University Bochum

- Annelies Delabie, IMEC

- Anuja DaSilva, Lam Research

- Dennis Hausmann, Lam Research

- Erwin Kessels, Eindhoven University of Technology

- Gregory Parsons, North Carolina State University

- Han-Bo-Ram Lee, Incheon National University

- Ishwar Singh, IBM

- Keyvan Kashefi, Applied Materials

- Kristen Colwell, Intel

- Mark Saly, Applied Materials

- Marko Tuominen, ASM

- Ralf Tonner-Zech, Wilhelm-Ostwald-Institute für Physikalische und Theoretische Chemie

- Ravi Kanjolia, EMD Electronics

- Robert Clark, TEL

- Sang Hoon Ahn, Samsung Electronics

- Seung Wook Ryu, SK hynix

- Stacey F. Bent, Stanford University

Contact Information:

asd2024.ca

Thursday, November 16, 2023

ALD is coming home 2024!

Announcement for the AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) & 11th International Atomic Layer Etching Workshop (ALE 2024)

Event Overview: The AVS 24th International Conference on ALD along with the 11th International ALE Workshop will be held from August 4-7, 2024, at Messukeskus, Helsinki, Finland. This premier event, alternating annually among the United States, Europe, and Asia since 2001, focuses on the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.


Special Celebration: The conference marks the 50th anniversary of ALD, celebrating the pioneering work of Dr. Tuomo Suntola, who filed the first patent on Atomic Layer Epitaxy in 1974. Dr. Suntola will open the conference with a special address.



Program and Submission Details: The event features pre-conference tutorials and a welcome reception on August 4, followed by sessions and an industry tradeshow from August 5-7. The program chairs include esteemed professionals from the University of Helsinki, the University of Twente, and AlixLabs AB. Key dates for abstract submission, registration, hotel reservations, and manuscript submissions are provided, with the abstract submission deadline being February 15, 2024.

Contact Information: Further details, including the event code of conduct, presentation guidelines, and sponsor and exhibitor information, are available for download. For any additional queries, Della Miller, the Event Manager, can be contacted at della@avs.org. 

For more details, attendees and interested parties are encouraged to visit the official website of AVS.

ald2024 (avs.org)

Thursday, October 19, 2023

ALD TechDay at SEMICON Europa 2023 Hosted by Beneq

Join us for an exclusive expert forum discussing the adoption and applications of Atomic Layer Deposition (ALD) in the semiconductor industry. Powered by Beneq, this event is scheduled for Tuesday, November 14, from 3:00 pm to 5:30 pm at the Internationales Congress Center München (ICM).



Key Insights:

- Learn about the scaling of logic and memory semiconductor devices enabled by ALD.
- Discover ALD's rapid adoption in specialty device fabrication, particularly in wide-bandgap power semiconductors.
- Yole Group's projection reveals a 12% yearly growth in ALD equipment sales, reaching a record $680.5M by 2026.
- Get insights from industry experts, including speakers from Yole Intelligence, Beneq, and imec.
- Engage in discussions with a live panel of innovators and attend keynotes detailing innovative ALD applications, tool solutions, and case examples.

This event is tailored for integrated device manufacturers, foundries, and research and technology organizations. If you're invested in specialty semiconductor devices—from advanced packaging and CMOS image sensors to optoelectronics and power devices—this is an unmissable opportunity.

Attendance is complimentary but by invitation only. If interested, please register through our interest form.

Wrap up the day with the ALD TechDay networking gala dinner, a perfect platform for idea exchange and collaborative exploration.

*About Beneq:* A pioneering leader in atomic layer deposition, Beneq has been at the forefront since 1984. With a vast product range and unique development services, Beneq remains committed to simplifying ALD processes for researchers and shortening the time to market with its state-of-the-art ALD production.

Saturday, September 9, 2023

ATLANT 3D Hosts Workshops Unveiling Atomic Layer Advanced Manufacturing Innovation

Atlant 3D will hold a series of workshops happening from October 7th to 13th. We Open Door to ATLANT 3D to share our cutting-edge innovation in atomic layer processing, and we will show you insights on how atomic layer processing will become an atomic layer advanced manufacturing platform!
ATLANT 3D technology is our proprietary Microreactor 

Dive Deep into the World of Atomic Precision with ATLANT 3D!
Event by ATLANT 3D

Oct 7, 2023, 9:00 AM - Oct 13, 2023, 4:00 PM (CET)

Mårkærvej 2b, Taastrup, Region Hovedstaden, DK, 2630


Direct Atomic Layer Processing (μDALP), which works by sequentially applying reactive gases to a surface via a microreactor/micronozzle and generating self-controlled chemical reactions on the surface. Repeating this process in cycles enables rapid, direct, multi-material, atomically precise patterning and structuring on simple and complex surfaces, including semiconductor wafers and surfaces with existing structures and devices. Integrating multiple micronozzles in a single printhead allows increasingly complex structures to be fabricated through the simultaneous use of different materials and printing resolutions. 

ATLANT 3D equipment is built as modular units which gives compatibility across different platforms and technologies. It can work as a production line based on process modules and as a cluster tool-compatible module unit.



Wednesday, August 30, 2023

Announcement Symposium G01 on “ALD & ALE Applications, #19” at the 244th ECS Meeting in Gothenburg, Sweden, Oct. 8-12, 2023

Announcement Symposium G01 on “ALD & ALE Applications, #19

at the 244th ECS Meeting in Gothenburg, Sweden, Oct. 8-12, 2023

See for detailed information about the 48 symposia, late manuscript submission requirements, and financial assistance: https://www.electrochem.org/244/.


Early (pre-)registration deadline is September 11, 2023.



In the ONLINE PROGRAM you can find symposium G01 on “ALD & ALE Applications, #19” which runs from Monday through Thursday Oct. 9-12 with a total of 77 presentations, incl. 1 keynote and 17 invited speakers. 


Sponsors of Symposium G01 on “ALD & ALE Applications, #19”





Tuesday, August 22, 2023

Beneq invites you to ALD TechDay during SEMICON Europa 2023

Beneq invites you to ALD TechDay during SEMICON Europa 2023 in Munich this November! Discover the latest trends and applications in Atomic Layer Deposition (ALD) for specialty semiconductors. Industry leaders and experts will share insights on ALD adoption and its impact.

Don't miss this exclusive forum brought to you by SEMI and Beneq. Register now!




Monday, June 12, 2023

Merck Showcases Expertise in Thin Film Deposition and Atomic Layer Etching at AVS ALD 2023 Conference

Leading scientists and engineers from MERCK present papers on advanced materials and semiconductor processing techniques at AVS ALD/ALE 2023.

Merck, a global science and technology company, is set to participate as a sponsor in the 23rd International Conference on Atomic Layer (ALD/ALE) 2023 organized by the Association for Science and Technology of Materials, Interfaces & Processing (AVS). The conference focuses on the science and technology of atomic layer-controlled deposition of thin films and related topics such as atomic layer etching.

Merck's leading engineers and experts will present their research papers at the conference, covering a wide range of cutting-edge topics. Thong Ngo, a Senior Process Engineer, will discuss the synthesis of 2D MoSe2 by atomic layer deposition on a wafer scale. Randall Higuchi, a Process Engineer, will present an evaluation of Zr and Hf precursors with higher thermal stability for atomic layer deposition of ZrO2 and HfO2 films.

Ravi Kanjolia, a Technology Fellow at Merck, will explore the reverse templating effects of low-resistivity Ru Ald on sputtered Ru, while Haripin Chandra, a Senior R&D Manager, will discuss the properties of VHF PEALD silicon nitride film deposited by precursors with different amino ligands. Martin McBriarty, a Materials Scientist, will present on thermal ALE reactants for semiconductor processing, and Ravi Kanjolia will also discuss crystalline gallium nitride deposition on SiO2/Si by RF-biased atomic layer annealing.


Furthermore, Haripin Chandra will participate in the Emerging Materials Session, focusing on EUV lithography materials. Merck's experts will offer valuable insights and share their expertise with the conference attendees, contributing to the advancement of thin film deposition and atomic layer-controlled processes.


Merck's presence at AVS ALD 2023 demonstrates the company's commitment to advancing technology and providing innovative materials solutions. Attendees will have the opportunity to connect with Merck's experts on-site for personalized advice and support. The conference, being held from July 23 to July 26, 2023, in Bellevue, Washington, promises to facilitate knowledge exchange and foster collaborations among scientists and industry professionals in the field of atomic layer-controlled deposition.

Source: The 23rd International Conference on Atomic Layer (ALD/ALE) 2023 | Merck (merckgroup.com)

Wednesday, May 3, 2023

AVS ALD2023 & ALE2023 Late News Abstracts Due May 5 - May The 4th Be With You!

 

 

 

Technical Program

Late News Abstracts Due May 5

 

 

Hotel Deadline:

June 29

 

 

Early Registration:

June 1

 

 

The AVS 23rd International Conference on Atomic Layer Deposition (ALD 2023) featuring the 10th International Atomic Layer Etching Workshop (ALE 2023) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists.

 

The conference will take place Sunday, July 23-Wednesday, July 26, 2023, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). As in past conferences, the meeting will be preceded (Sunday, July 23) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 24-26) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Late News Abstracts

Due May 5, 2023

Presenters are limited to one oral and one poster presentation. One submission must be to an oral session and one to a poster session. It must be two different abstracts, not the same abstract submitted as both an oral and a poster.

 

 

 

Key Deadlines:

Late Abstract Deadline:

May 5, 2023

Early Registration Deadline: June 1, 2023

Hotel Reservation Deadline: June 29, 2023

Manuscript Deadline: November 1, 2023

 

 

 

ALD Plenary Speaker

Markku Leskelä

(University of Helsinki, Finland)

 

ALE Plenary Speaker

Tristan Tronic

(Intel, USA)

 

 

ALD Program Chairs

 

Program Chair:

Seán Barry

(Carleton University, Canada)

 

Program Co-Chair:

Scott Clendenning

(Intel, USA)

ALE Program Chairs

 

Program Chair:

Jane Chang

(University of California,

Los Angeles, USA)

 

Program Co-Chair:

Steve George

(University of Colorado at Boulder, USA)

 

Program Co-Chair:

Thorsten Lill

(Lam Research, USA)

Wednesday, April 19, 2023

Call for Papers on ALD & ALE Applications, at ECS Fall Meeting / Gothenburg Oct. 2023 ►►DEADLINE EXPIRES APRIL 21◄◄

Call for Papers on ALD & ALE Applications, at ECS Fall Meeting / Gothenburg Oct. 2023 ►►DEADLINE EXPIRES APRIL 21◄◄

The Electrochemical Society (ECS) conference is an international event running every spring and fall, and gathering 2000-4000 participants and 30-40 exhibitors both from academia and industry.

The conference has a strong focus on emerging technology and applications in both electrochemistry and solid-state science & technology.





This fall the event will be held as 244th ECS Meeting on Oct. 8-12, 2023 in Gothenburg (Sweden).

The full program as well as information on travel assistance for students can be found on https://www.electrochem.org/244.

 

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 19” encourage you to submit your abstracts on the following (and closely related) topics:

 

1.   Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2.   Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3.   Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4.   Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5.   New precursors and delivery systems;

6.   Optical and photonic applications;

7.   Coating of nanoporous materials by ALD;

8.   MLD and hybrid ALD/MLD;

9.   ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

 

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 21, 2023 via the ECS website: Abstract submission instruction

 

List of invited speakers

·   Johan Swerts, (Imec, Belgium) KEYNOTEALD challenges and opportunities in the light of future trends in electronics

·   Stephan Wege (Plasway Technology, Germany), Reactor design for combined ALD & ALE

·   Masanobu Honda (TEL, Japan), Novel surface reactions in low-temperature plasma etching

·   Barbara Hughes, (Forge Nano, USA), Dual Coatings, Triple the Benefit; Atomic Armor for Better Battery Performance

·   Juhani Taskinen, (Applied Materials-Picosun, Finland), ALD for biomedicine

·   Alex Kozen (Univ. of Maryland, USA), ALD for improved Lithium Ion Batteries

·   Malachi Noked (Bar-Ilan Univ., Israel), ALD/MLD for batteries

·   Yong Qin (Chinese Academy of Sciences), ALD for catalysis

·   Jan Macák, (Univ. of Pardubice, Czechia), ALD on nanotubular materials and applications

·   Bora Karasulu, Univ. of Warwick, UK), Atomistic Insights into Continuous and Area-Selective ALD Processes: First-principles Simulations of the Underpinning Surface Chemistry

·   Ageeth Bol (Univ. Michigan, USA), ALD on 2D materials

·   Pieter-Jan Wyndaele (KU Leuven-imec, Belgium), Enabling high-quality dielectric passivation on Monolayer WS2 using a sacrificial Graphene Oxide template

·   Elton Graugnard (Boise State Univ., USA), Atomic Layer Processing of MoS2

·   Han-Bo-Ram Lee (Incheon National Univ., Korea), Area-Selective Deposition using Homometallic Precursor Inhibitors

·   Ralf Tonner (Univ. Leipzig, Germany), Ab initio approaches to area-selective deposition

·   Nick Chittock (TU Eindhoven, Netherlands), Utilizing plasmas for isotropic Atomic Layer Etching

·   Heeyeop Chae (Sungkyunkwan Univ., Korea), Plasma-enhanced Atomic Layer Etching for Metals and Dielectric Materials

·   Charles Winter (Wayne State Univ., USA), New Precursors and Processes for the Thermal ALD of Metal Thin Films

·   Anjana Devi, Ruhr Univ. Bochum, Germany), Novel precursors dedicated for Atomic Layer Processing

 

Visa and travel

For more information, see: www.electrochem.org/244/visa-travel/

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter from the site of the Electrochemical Society.

 

We are looking forward to meeting you in Gothenburg !