The 2024 1st Asian-Pacific Atomic Layer Deposition (AP-ALD) Conference Shanghai, China, from October 17 to 20, 2024

Following the successes of the previous four international Conferences on ALD Applications and ten China ALD Conferences since 2010. the 2024 1st Asian-Pacific Atomic Layer Deposition (AP-ALD) Conference will be a four-day meeting, dedicated to the fundamentals and applications of Atomic Layer Deposition (ALD) technology in various fields. It will be held in Shanghai, China, from October 17 to 20, 2024. This conference will feature plenary sessions, oral sessions, poster sessions and industrial exhibitions.

The ALD technique has been widely used and explored in numerous fields such as microelectronics, photoelectronics, optical coating, functional nanomaterials, MEMS/NEMS, energy storage, biotechnology, catalysis technology and etc. This is attributed to some unique advantages of ALD, including precise control of nano-scale thickness, superior uniformity across a large area, excellent conformity, relatively low deposition temperature and stoichiometric composition. Especially in the field of microelectronics, ALD has been involved deeply into advanced integrated circuits to prepare high-k/metal gate, spacer, and ultrathin diffusion barriers for Cu interconnects etc. Furthermore, ALD is also receiving great attention for its potential application in photovoltaics, flexible electronics, organic electronics, flat-panel display and other emerging areas.

Invited speakers: Invited Speakers – AP-ALD

Conference Web: AP-ALD – ALD2024

ALD for Industry, March 11-12, 2025 in Dresden

The 8th International Conference “ALD FOR INDUSTRY” will again bridge the gap between fundamental science, industrialization and commercialization of this technology. Atomic layer deposition (ALD) is a process for depositing a variety of thin film materials from the vapor phase of matter. The growth of this technology is not only based in microelectronics applications, but also in areas of industrial Li-Ion batteries, photovoltaics, optics, light, biomedicine and quantum technology.

This event is already establied since 2017 and attracts annually more than 100 participants and numerous exhibitors to visit Dresden. The Conference with Tutorial provides the opportunity to learn more about fundamentals of ALD technology, to get informed about recent progress in the field and to get in contact with industrial and academic partners. Increase your visibility and present your company in our accompanying exhibition.

The next event will take place in March 11 – 12, 2025 in Dresden. Please do not miss the chance to submit your abstract to present your recent research in the field of ALD, show application examples or present accompanying technologies like metrology, combinations of technological approaches like plasma technology or vacuum technologies.

You would like to present your new developments and research results?

Please send your abstract to info@efds.org until September 15, 2024.

The AVS ALD ALE 2024 Conference in Helsinki - Record Breaking Attendance and Deposition Speed of ALD

The AVS ALD ALE 2024 conference in Helsinki, Finland, which took place from August 4-7, 2024, attracted significant attention number of delegates (number still pending) and reporting on social media among professionals in the field of atomic layer deposition and etching. Participants and companies highlighted key moments and innovations presented during the conference.

One of the major highlights shared on platforms like X/Twitter was the celebration of the 50th anniversary of Atomic Layer Deposition (ALD), with special recognition given to Dr. Tuomo Suntola, the pioneer of ALD technology. His opening remarks were highly anticipated and well-received, marking a significant milestone in the field.

#ALDALE2024 Plenary Talk provided by Tuomo Suntola with a full house. 50 Years in the making! @AVS_Members pic.twitter.com/9W106TGSWm

— Heather Korff (@HeatherKorff) August 5, 2024

Attendees shared their experiences from the welcome reception and the technical sessions, with many noting the high caliber of presentations and the importance of networking opportunities provided by the event under the tag #ALDALE2024 (#ALDep - Search / X (twitter.com)). Overall, social media posts reflected an as usual vibrant and engaged ALD & ALE community, excited about the advancements and collaborations emerging at AVS ALD 2024 in Helsinki.

The 2024 Chairs for ALD Prof. Mikko Ritala and Prof. Markku Leskelä and for ALE Prof. Fred Roozeboom and Dr. Dmitry Suyatin. In the middle ASM Internationals former CTO Ivo Raaijmakers and on the rigt Dr. Tuomo Suntola, The ALD Inventor himself. LINK

The largest group photo at the ALD/ALE 2024 backdrop by registration - Helsinki University! LINK

A Crowded House for the Plenary by Dr. Suntola. LINK

Congratulations to ALD Innovator Awardee Annalise Delabie also presenting to a full house! LINK

Plenary talk by Ivo Raaijmakers, The leading ALD company ASM International. LINK

Best poster ALD 2024 Award by BALD Engineering. Thermal Ru without desalination by Parmish Kaur. LINK

One of numerous Finnish Sauna Events LINK

ALD Tough Guys and social events. LINK

Additionally, the leading ALD & ALE companies showcased their latest advancements. For example, Lotus Applied Technology drew attention for their presentation on ultra-high-speed ALD film growth, achieving deposition rates of 30 Å/second while maintaining film uniformity. This breakthrough was a trending topic among attendees, reflecting the ongoing innovation in the ALD sector.

Lotus Applied Technology reported: The research on ultra-high-speed spatial Plasma-Enhanced Atomic Layer Deposition (PEALD) introduces a novel approach to separating ALD half-reactions by leveraging a unique plasma-based mechanism. Instead of traditional differential flow and pumping, the process utilizes a gas shroud surrounding the plasma electrode, which facilitates the neutralization of oxidation radicals, preventing interaction with metal precursor vapors within the reactor. This method effectively separates the reactive species and allows for high deposition rates, achieving coating speeds over 25 angstroms per second for SiO₂ films. The process also includes innovations to reduce ozone byproducts, such as using carbon dioxide as the plasma gas and applying an active catalyst in the exhaust path​ (Lotus Applied Technology | Home).

At the end the AVS ALD ALE 2025 was presented: The AVS 25th International Conference on Atomic Layer Deposition (ALD 2025) featuring the 12th International Atomic Layer Etching Workshop (ALE 2025) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists. The conference will take place Sunday, June 22-Wednesday, June 25, 2025, at the International Convention Center Jeju (ICC Jeju), Jeju Island, South Korea. ald2025 (avs.org)

ALD Program Chair:
Prof. Han-Bo-Ram (Boram) Lee
(Incheon National University, South Korea)


ALE Program Chair:
Prof. Heeyeop Chae
(Sungkyunkwan University, South Korea)

The 2024 Chairs handing over to the 2025 Chairs in Korea. LINK

AVS ALD/ALE conference returns to Helsinki after 20 years to celebrate 50 years of ALD!

The AVS 24th International Conference on Atomic Layer Deposition (ALD 2024), alongside the 11th International Atomic Layer Etching Workshop (ALE 2024), will be held from August 4-7, 2024, at Messukeskus in Helsinki. Organized by the American Vacuum Society (AVS), the event returns to Helsinki after 20 years to mark the 50th anniversary of Dr. Tuomo Suntola's pioneering work on ALD. Dr. Suntola, who received the Millennium Technology Prize in 2018 for his contributions to ALD, will deliver the opening remarks. Professors Mikko Ritala and Markku Leskelä from the Department of Chemistry serve as the program chairs for this year's conference.

The ALD conference, focusing on the science and technology of atomic layer controlled deposition and etching of thin films, alternates between the United States, Europe, and Asia. The last Helsinki event in 2004 celebrated 30 years of ALD. This year's conference is expected to break attendance records with nearly one thousand participants and received an unprecedented 502 abstracts. The event highlights significant industry involvement, with 55% participation from industry representatives last year

The plenary talk will be given by Dr. Ivo J. Raaijmakers of ASM, The Netherlands, emphasizing the long-standing collaboration between the University of Helsinki and ASM. Countries contributing the most abstracts include the United States, South Korea, Germany, Finland, the Netherlands, and Japan.

ALD/ALE conference returns to Helsinki after 20 years | Faculty of Science | University of Helsinki

Conference page: ald2024 (avs.org)

Fundamentals of ALD course – 6-7 June 2024, University of Bath, UK

The "Fundamentals of ALD" course, scheduled for June 6-7, 2024 at the University of Bath, UK, targets newcomers and professionals seeking to deepen their understanding of atomic layer deposition (ALD). It will cover the theoretical and practical aspects of ALD, including surface chemistry, process configurations, reactor design, and material properties. Professors Gregory Parsons, Seán Barry, and Erwin Kessels will lead the course, offering both foundational insights and advanced techniques relevant to laboratory and industrial applications.

The course will run from noon-to-noon across two days, featuring seven detailed lectures interspersed with Q&A sessions and a mixer event on the first evening. Registration is open until May 24, 2024, with fees varying for industry professionals, academia members, and students. The event will take place in the “6 West South” building at the University of Bath, and participants are advised to arrange their own accommodation, with several hotel suggestions provided near the venue.

Link: Fundamentals of ALD course –  6-7 June 2024, University of Bath, UK – ALDAcademy

Ahead of the 50 Years of ALD celebration in Helsinki, learn about the origins, growth and future of the AVS ALD Conference with Greg Parsons and Steve George

The AVS ALD Conference is the main event for those in Atomic Layer Deposition. The 3-day meeting rotates between the US, Europe and Asia, chock full of interesting parallel sessions, an industry exhibition, and a few sponsored extracurricular activities. In August, the ALD conference will return for the first time in 20 years to Helsinki, Finland, the technologys place of origin. 2024 marks 50 years since Tuomo Suntolas original patent application for ALD, and this year we will celebrate the meteoric rise of the atomic scale process. In this exclusive interview from The ALDepartment, Tyler sits down with two of the founding members of the AVS ALD Conference, Professor Greg Parsons from North Carolina State University, and his PhD advisor at the University of Colorado Boulder, Professor Steven George, to talk about the origins, growth and future of the meeting. Greg and Steve discuss the challenges surrounding the conception of the conference, an unexpected letter from a major ALD company, the enormous success of the 1st conference and how they believe the meeting may change in the future. 

In this Interview: 

00:00 Intro 

01:43 How the conference started 

10:00 An unexpected letter from ASM 

12:16 The first AVS ALD conference 

22:37 Growth and direction 

33:12 Future of AVS ALD

42:16 Reflections and favorite conferences

Surfs are going to be up at the PRiME Symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea. This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

List of confirmed invited speakers (from North America, Asia and Europe):

1. Bart Macco, TU Eindhoven, Netherlands, Review of ALD for solar cells

2. Maarit Karppinen, Aalto University, Finland, ALD/MLD for energy / membrane technology

3. Chad Brick, Gelest, USA, Silanes and silazanes precursors for Area Specific Deposition

4. Makoto Sekine, Nagoya Univ., Japan, Low damage ALE of AlGaN

5. Rong Chen, HUST Univ. Wuhan, China, ALD for Cataysis and other applications

6. Mikhael Bechelany, IEM, Montpellier, France, Recent Advancements and Emerging Applications in ALD on High-Porosity Materials

7. Miika Mattinen, Univ Helsinki, Finland, ALD of dichalcogenides for electrocatalysis

8. Bonggeun Shong, Hongik University, Korea, Theory of area-selective ALD

9. Miin-Jang Chen, National Taiwan Univ., Inhibitor-free Area-Selective ALD

10. Hyungjun Kim, Yonsei University, Korea, ALD of “Group 16 Compounds” for Emerging Applications (2D TMDCs)

11. Agnieszka Kurek, Oxford Instruments, United Kingdom, Faster ALD for Emerging Quantum Applications

12. Matthew Metz, Inte, USA, Keynote on "Materials Challenges in Future Semiconductor Devices"

13. Junling Lu, University of Science and Technology of China, ALD for Catalysis

14. Sung Gap Im, KAIST, Korea, Vapor-phase Deposited Functional Polymer Films for Electronic Device Applications

15. Jason Croy, Argonne National Lab, USA, Next-gen batteries & ALD

16. Mark Saly, Applied Materials, USA, Key Challenges in Area Selective Deposition: from R&D Scale to High Volume Manufacturing

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

PRiME 2024: A Global Convergence on Atomic Layer Processing Set for Honolulu This October

The PRiME Joint International Meeting, organized by the Electrochemical Society and sister societies from Japan and Korea, will take place from October 6-11, 2024, in Honolulu, Hawaii. Anticipating over 4000 participants, the conference will focus on solid-state science, technology, and electrochemistry. Symposium G01 invites submissions on Atomic Layer Deposition and Etching, covering topics from semiconductor applications to energy storage. The deadline for abstract submission is April 12, 2024. Last year's event saw 78 presentations, indicating a strong interest in the field. For visa, travel information, and participation letters, contact ECS representatives.

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea.

This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

A list of confirmed invited speakers (from North America, Asia and Europe) will soon be available.

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS (Francesca.Spagnuolo@electrochem.org) can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact travelgrant@electrochem.org.

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Symposium organizers:

F. Roozeboom, (lead), University of Twente; e-mail: f.roozeboom@utwente.nl,
S. De Gendt, IMEC & Catholic University Leuven,
J. Dendooven, Ghent University,
J. W. Elam, Argonne National Laboratory,
O. van der Straten, IBM Research,
A. Illiberi, ASM Europe,
G. Sundaram, Veeco,
R. Chen, Huazhong University of Science and Technology,
O. Leonte, Berkeley Polymer Technology,
T. Lill, Clarycon Nanotechnology Research,
M. Young, University of Missouri,
A. Kozen, University of Vermont.

AlixLabs Celebrates Gold Sponsorship at ALD/ALE 2024 in Helsinki: Honoring Dr. Tuomo Suntola and Embracing Advances in Atomic Layer Etching

 We are proud to be Gold Sponsors of ALD/ALE 2024 in Helsinki, Finland . We look forward to contribute to the conference program and meet you in the exhibition. We especially look forward to join the celebration 50 Years of ALD and honor the inventor and Millennium Prize Winner 2018 Dr. Tuomo Suntola.

It is also a prime event for Atomic Layer Etching this year since our CTO Dr. Dmitry Suyatin and our Advisory Board Member Prof. Fred Roozeboom are co-chairing the ALE Conference!

Please visit The Conference Page for full details: https://ald2024.avs.org/

Atomic Scale Innovation Workshop in Copenhagen

PIONEERING ATOMIC SCALE INNOVATION - FROM MATERIALS TO SCALABLE APPLICATIONS

Hosted by ATLANT 3D, this event is a gathering point for industry experts, researchers, and technical professionals, all focused on exploring the vast potential of Atomic Layer Deposition (ALD) and related technologies.

The future of manufacturing lies in precision and sustainability. At ATLANT3D, we are deeply committed to advancing the frontiers of atomic scale manufacturing, unlocking novel avenues for materials development and scalable applications. This conference is our call to arms, bringing together the brightest minds to push the boundaries of what’s possible.

Registration adn information: ATLANT 3D Events: Join Us at Top Conferences and Events Worldwide

Topics & Highlights:
• ALD's current market and applications in various industries.
• In-depth presentations on advanced materials innovation.
• Interactive discussions on the future of atomic layer processing.

Speakers:
• PROF. DR. Fred Roozeboom, UNIVERSITY OF TWENTE
Topic: “Atomic Layer Deposition: Its Evolution, Diverse Applications, and Future Prospects”.
• DR. Maksym Plakhotnyuk 🇺🇦, CEO & FOUNDER OF ATLANT 3D
Topic: “Atomic Layer Processing: Driving Global Innovation in Advanced Manufacturing”.
• PROF. DR. Erwin Kessels, EINDHOVEN UNIVERSITY OF TECHNOLOGY Topic: “Innovations in Plasma Processing for Nanoscale Fabrication”.
• DR. Mira Baraket, HEAD OF TECHNOLOGY R&D AT ATLANT 3D
Topic: “Advancements in 2D Materials Synthesis Through Atomic Layer Deposition”.
• DR. Alexander Kozen, UNIVERSITY OF VERMONT
Topic: “Progress and Opportunities for Atomic Layer Deposition to Facilitate Next-Generation Batteries”.
• PROF. DR. Julien Bachmann, FAU ERLANGEN-NÜRNBERG
Topic: “Harnessing ALD for Next-Generation Photovoltaics and Electrochemical Energy Storage”.
• DR. Jacques Kools, CEO & FOUNDER AT ENCAPSULIX
Topic: “ALD Deposited Ultrabarriers for Applications in Electronics, Energy, and Medical Fields”.
• DR. Ville Miikkulainen, ALTO UNIVERSITY
Topic: “Photo-assisted ALD: Enabler for Direct-Write ALD”.

Download brochure:
https://lnkd.in/eyUdPBXj

Special Features:
• Exclusive visit to ATLANT 3D's state-of-the-art A-HUB & Laboratory facilities.
• A social evening for informal networking and collaboration.

ASD2024: Uniting the World of Area Selective Deposition in Historic Old Montreal

Announcement for ASD2024 Workshop

Dates: April 15-16, 2024

Location: Old Montreal, Canada

Welcome and bienvenue to the exciting Area Selective Deposition (ASD) workshop to be held in the picturesque Old Montreal. This two-day event, scheduled for April 15 and 16, offers an enriching platform for both academic and industry professionals to exchange groundbreaking ideas in the field of ASD.

Special Sessions:

1. Pre-Workshop Tutorial: A comprehensive half-day tutorial on April 14 (Sunday afternoon). Note: This session requires an additional fee.

2. Atomic Layer Processing Showcase: A half-day event on April 17 (Wednesday morning), highlighting Canada's advancements in atomic layer processing. This session is included in the conference fee.

Conference Venues:

- Hotel Place d'Armes (55 Rue Saint-Jacques): Main sessions and lunches on Monday and Tuesday will be hosted here. This 4-star hotel is conveniently located near a metro stop.

- Hotel Nelligan (106 Saint-Paul St W): A 4-star boutique hotel, the venue for the opening mixer on Sunday evening and the poster session on Monday evening.

Workshop Highlights:

- Single session format over two days featuring invited and contributed talks.

- A panel discussion focusing on the industrial and academic communication of ASD.

- Networking opportunities with leading experts and peers.

Explore Montreal:

Participants are encouraged to experience the charm of Old Montreal, known for its vibrant restaurants, bars, shopping venues, and historical sites like the Notre Dame Basilica and the port. For sports enthusiasts, the Circuit Gilles Villeneuve offers a unique opportunity for running and cycling.

Organizers:

- Prof. Sean Barry, Carleton University

- Prof. Paul Ragogna, Western University

Scientific Committee:

- Adrie Mackus, Eindhoven University of Technology

- Anjana Devi, Ruhr University Bochum

- Annelies Delabie, IMEC

- Anuja DaSilva, Lam Research

- Dennis Hausmann, Lam Research

- Erwin Kessels, Eindhoven University of Technology

- Gregory Parsons, North Carolina State University

- Han-Bo-Ram Lee, Incheon National University

- Ishwar Singh, IBM

- Keyvan Kashefi, Applied Materials

- Kristen Colwell, Intel

- Mark Saly, Applied Materials

- Marko Tuominen, ASM

- Ralf Tonner-Zech, Wilhelm-Ostwald-Institute für Physikalische und Theoretische Chemie

- Ravi Kanjolia, EMD Electronics

- Robert Clark, TEL

- Sang Hoon Ahn, Samsung Electronics

- Seung Wook Ryu, SK hynix

- Stacey F. Bent, Stanford University

Contact Information:

asd2024.ca

ALD is coming home 2024!

Announcement for the AVS 24th International Conference on Atomic Layer Deposition (ALD 2024) & 11th International Atomic Layer Etching Workshop (ALE 2024)

Event Overview: The AVS 24th International Conference on ALD along with the 11th International ALE Workshop will be held from August 4-7, 2024, at Messukeskus, Helsinki, Finland. This premier event, alternating annually among the United States, Europe, and Asia since 2001, focuses on the science and technology of atomic layer controlled deposition of thin films and atomic layer etching.

Special Celebration: The conference marks the 50th anniversary of ALD, celebrating the pioneering work of Dr. Tuomo Suntola, who filed the first patent on Atomic Layer Epitaxy in 1974. Dr. Suntola will open the conference with a special address.

Program and Submission Details: The event features pre-conference tutorials and a welcome reception on August 4, followed by sessions and an industry tradeshow from August 5-7. The program chairs include esteemed professionals from the University of Helsinki, the University of Twente, and AlixLabs AB. Key dates for abstract submission, registration, hotel reservations, and manuscript submissions are provided, with the abstract submission deadline being February 15, 2024.

Contact Information: Further details, including the event code of conduct, presentation guidelines, and sponsor and exhibitor information, are available for download. For any additional queries, Della Miller, the Event Manager, can be contacted at della@avs.org. 

For more details, attendees and interested parties are encouraged to visit the official website of AVS.

ald2024 (avs.org)

ALD TechDay at SEMICON Europa 2023 Hosted by Beneq

Join us for an exclusive expert forum discussing the adoption and applications of Atomic Layer Deposition (ALD) in the semiconductor industry. Powered by Beneq, this event is scheduled for Tuesday, November 14, from 3:00 pm to 5:30 pm at the Internationales Congress Center München (ICM).

Key Insights:

- Learn about the scaling of logic and memory semiconductor devices enabled by ALD.

- Discover ALD's rapid adoption in specialty device fabrication, particularly in wide-bandgap power semiconductors.

- Yole Group's projection reveals a 12% yearly growth in ALD equipment sales, reaching a record $680.5M by 2026.

- Get insights from industry experts, including speakers from Yole Intelligence, Beneq, and imec.

- Engage in discussions with a live panel of innovators and attend keynotes detailing innovative ALD applications, tool solutions, and case examples.

This event is tailored for integrated device manufacturers, foundries, and research and technology organizations. If you're invested in specialty semiconductor devices—from advanced packaging and CMOS image sensors to optoelectronics and power devices—this is an unmissable opportunity.

Attendance is complimentary but by invitation only. If interested, please register through our interest form.

Wrap up the day with the ALD TechDay networking gala dinner, a perfect platform for idea exchange and collaborative exploration.

*About Beneq:* A pioneering leader in atomic layer deposition, Beneq has been at the forefront since 1984. With a vast product range and unique development services, Beneq remains committed to simplifying ALD processes for researchers and shortening the time to market with its state-of-the-art ALD production.

ATLANT 3D Hosts Workshops Unveiling Atomic Layer Advanced Manufacturing Innovation

Atlant 3D will hold a series of workshops happening from October 7th to 13th. We Open Door to ATLANT 3D to share our cutting-edge innovation in atomic layer processing, and we will show you insights on how atomic layer processing will become an atomic layer advanced manufacturing platform!

ATLANT 3D technology is our proprietary Microreactor 

Dive Deep into the World of Atomic Precision with ATLANT 3D!
Event by ATLANT 3D

Oct 7, 2023, 9:00 AM - Oct 13, 2023, 4:00 PM (CET)

Mårkærvej 2b, Taastrup, Region Hovedstaden, DK, 2630

ATLANT 3DEvent linkhttps://share-eu1.hsforms.com/1iMhfw9vDTNutLAZcImhj_Af3elp

Direct Atomic Layer Processing (μDALP), which works by sequentially applying reactive gases to a surface via a microreactor/micronozzle and generating self-controlled chemical reactions on the surface. Repeating this process in cycles enables rapid, direct, multi-material, atomically precise patterning and structuring on simple and complex surfaces, including semiconductor wafers and surfaces with existing structures and devices. Integrating multiple micronozzles in a single printhead allows increasingly complex structures to be fabricated through the simultaneous use of different materials and printing resolutions. 

ATLANT 3D equipment is built as modular units which gives compatibility across different platforms and technologies. It can work as a production line based on process modules and as a cluster tool-compatible module unit.

Announcement Symposium G01 on “ALD & ALE Applications, #19” at the 244th ECS Meeting in Gothenburg, Sweden, Oct. 8-12, 2023

Announcement Symposium G01 on “ALD & ALE Applications, #19”

at the 244^th ECS Meeting in Gothenburg, Sweden, Oct. 8-12, 2023

See for detailed information about the 48 symposia, late manuscript submission requirements, and financial assistance: https://www.electrochem.org/244/.

Early (pre-)registration deadline is September 11, 2023.

In the ONLINE PROGRAM you can find symposium G01 on “ALD & ALE Applications, #19” which runs from Monday through Thursday Oct. 9-12 with a total of 77 presentations, incl. 1 keynote and 17 invited speakers. 

See for the schedule: G01 - Atomic Layer Deposition and Etching Applications 19

Sponsors of Symposium G01 on “ALD & ALE Applications, #19”

Beneq invites you to ALD TechDay during SEMICON Europa 2023

Beneq invites you to ALD TechDay during SEMICON Europa 2023 in Munich this November! Discover the latest trends and applications in Atomic Layer Deposition (ALD) for specialty semiconductors. Industry leaders and experts will share insights on ALD adoption and its impact.

Don't miss this exclusive forum brought to you by SEMI and Beneq. Register now!

LINK: https://hubs.li/Q01_B2Fh0

Merck Showcases Expertise in Thin Film Deposition and Atomic Layer Etching at AVS ALD 2023 Conference

Leading scientists and engineers from MERCK present papers on advanced materials and semiconductor processing techniques at AVS ALD/ALE 2023.

Merck, a global science and technology company, is set to participate as a sponsor in the 23rd International Conference on Atomic Layer (ALD/ALE) 2023 organized by the Association for Science and Technology of Materials, Interfaces & Processing (AVS). The conference focuses on the science and technology of atomic layer-controlled deposition of thin films and related topics such as atomic layer etching.

Merck's leading engineers and experts will present their research papers at the conference, covering a wide range of cutting-edge topics. Thong Ngo, a Senior Process Engineer, will discuss the synthesis of 2D MoSe2 by atomic layer deposition on a wafer scale. Randall Higuchi, a Process Engineer, will present an evaluation of Zr and Hf precursors with higher thermal stability for atomic layer deposition of ZrO2 and HfO2 films.

Ravi Kanjolia, a Technology Fellow at Merck, will explore the reverse templating effects of low-resistivity Ru Ald on sputtered Ru, while Haripin Chandra, a Senior R&D Manager, will discuss the properties of VHF PEALD silicon nitride film deposited by precursors with different amino ligands. Martin McBriarty, a Materials Scientist, will present on thermal ALE reactants for semiconductor processing, and Ravi Kanjolia will also discuss crystalline gallium nitride deposition on SiO2/Si by RF-biased atomic layer annealing.

Furthermore, Haripin Chandra will participate in the Emerging Materials Session, focusing on EUV lithography materials. Merck's experts will offer valuable insights and share their expertise with the conference attendees, contributing to the advancement of thin film deposition and atomic layer-controlled processes.

Merck's presence at AVS ALD 2023 demonstrates the company's commitment to advancing technology and providing innovative materials solutions. Attendees will have the opportunity to connect with Merck's experts on-site for personalized advice and support. The conference, being held from July 23 to July 26, 2023, in Bellevue, Washington, promises to facilitate knowledge exchange and foster collaborations among scientists and industry professionals in the field of atomic layer-controlled deposition.

Source: The 23rd International Conference on Atomic Layer (ALD/ALE) 2023 | Merck (merckgroup.com)

AVS ALD2023 & ALE2023 Late News Abstracts Due May 5 - May The 4th Be With You!

 

Technical Program Late News Abstracts Due May 5   Hotel   Hotel Deadline: June 29 Program   View Online Scheduler View PDF Register   Early Registration: June 1     The AVS 23rd International Conference on Atomic Layer Deposition (ALD 2023) featuring the 10th International Atomic Layer Etching Workshop (ALE 2023) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and atomic layer etching. Since 2001, the ALD conference has been held alternately in the United States, Europe and Asia, allowing fruitful exchange of ideas, know-how and practices between scientists.   The conference will take place Sunday, July 23-Wednesday, July 26, 2023, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). As in past conferences, the meeting will be preceded (Sunday, July 23) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 24-26) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+. Late News Abstracts Due May 5, 2023 Presenters are limited to one oral and one poster presentation. One submission must be to an oral session and one to a poster session. It must be two different abstracts, not the same abstract submitted as both an oral and a poster.   Submit     Key Deadlines: Late Abstract Deadline: May 5, 2023 Early Registration Deadline: June 1, 2023 Hotel Reservation Deadline: June 29, 2023 Manuscript Deadline: November 1, 2023       ALD Plenary Speaker Markku Leskelä (University of Helsinki, Finland)   ALE Plenary Speaker Tristan Tronic (Intel, USA)     ALD Program Chairs   Program Chair: Seán Barry (Carleton University, Canada)   Program Co-Chair: Scott Clendenning (Intel, USA)   ALE Program Chairs   Program Chair: Jane Chang (University of California, Los Angeles, USA)   Program Co-Chair: Steve George (University of Colorado at Boulder, USA)   Program Co-Chair: Thorsten Lill (Lam Research, USA)