Monday, February 26, 2024

PRiME 2024: A Global Convergence on Atomic Layer Processing Set for Honolulu This October

The PRiME Joint International Meeting, organized by the Electrochemical Society and sister societies from Japan and Korea, will take place from October 6-11, 2024, in Honolulu, Hawaii. Anticipating over 4000 participants, the conference will focus on solid-state science, technology, and electrochemistry. Symposium G01 invites submissions on Atomic Layer Deposition and Etching, covering topics from semiconductor applications to energy storage. The deadline for abstract submission is April 12, 2024. Last year's event saw 78 presentations, indicating a strong interest in the field. For visa, travel information, and participation letters, contact ECS representatives.

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea.

This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

A list of confirmed invited speakers (from North America, Asia and Europe) will soon be available.

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS ( can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Symposium organizers:

F. Roozeboom, (lead), University of Twente; e-mail:,
S. De Gendt, IMEC & Catholic University Leuven,
J. Dendooven, Ghent University,
J. W. Elam, Argonne National Laboratory,
O. van der Straten, IBM Research,
A. Illiberi, ASM Europe,
G. Sundaram, Veeco,
R. Chen, Huazhong University of Science and Technology,
O. Leonte, Berkeley Polymer Technology,
T. Lill, Clarycon Nanotechnology Research,
M. Young, University of Missouri,
A. Kozen, University of Vermont.

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