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ALD for Industry | International Conference & ExhibitionMarch 11 - 12, 2025 | Dresden, Germany
+++ Poster Submission, Early Bird Registration & Exhibition Booking +++
Deadline: January 31, 2025
Atomic Layer Deposition is an important technology for surface modification and structuring. Again we will discuss recent developents and applications of the technology in March in Dresden. Already 26 speakers confirmed their contributions. Check the first anounnced talks and use the earyl bird registration until January 31, 2025.
Also Poster Submissions and booking of exhibition places is possible until January 31, 2025. Present your services and products to the ALD Community and become visible to interested people.
More information you can find the the ALD Website: https://lnkd.in/eKt86GV7
Program Preview
We are pleased to announce first speakers of the upcoming event. A complete porgram will be published in January 2025Fundamentals of atomic layer deposition: a tutorial| Riikka Puurunen, Aalto University, Sweden
- Industrial batch ALD for optical applications | Shuo Li, Afly Solution Oy, Finland
- Direct Processing by µDALP™. Precision Coatings for Next Gen Devices | Maksym Plakhotnyuk, ATLANT 3D, Denmark
- Nanoscale solid-state lithium-ion electrolytes enabled by atomic layer deposition | Messaoud Bedjaoui, CEA Leti, France
- Fabrication of Surface Relief Gratings using ALD-based Technologies to Overcome the Challenges of Reactive Ion Etching of TiO2 | Mathias Franz, Fraunhofer ENAS, Germany
- Monitoring and optimisation of ALD processes with Remote Plasma Optical Emission Spectroscopy | Erik Cox, Gencoa Ltd, UK
- Optimizing Plasma-Assisted Atomic Layer Deposition using Impedans RFEAs | Angus McCarter, Impedans Ltd., UK
- Improving atomic layer deposition process of silicon oxide (SiO2) and aluminum oxide (Al2O3) | Long Lei, Fraunhofer IMPS, Germany
- Introducing a Surface Acoustic Wave-Based Miniaturized Aerosol Source for Controlled Liquid Precursor Delivery in ALD Processes | Mehrzad Roudini, Leibniz IFW, Germany
- Challenges and Solutions in ALD of Thermal Budget Sensitive Ferroelectric Materials | Bart Vermeulen, Ferroelectric Memory Co GmbH, Germany
- ALD for Nanoparticles: From Fundamentals to Industrial Applications | Rong Chen, University of Science and Technology HUST, China
- Recent developments and emerging applications in atmospheric-pressure ALD on high-porosity membranes | Fred Roozeboom, University of Twente, Netherlands
- Past, present and future of ALD from an industrial perspective | Jan Willem Maes, ASM, Belgium
- Advanced in-situ QCM process monitoring | Martin Knaut, ALS Metrology UG, Germany
- Cryogenic Atomic Layer Etching (Cryo-ALE) of low-k dielectrics like SiO2, and GaN etching. | Rémi Dussart, Université d´Orleans, France
- ALD for Memory Applications: a matter of details | Laura Nyns, IMEC, Belgium
- Spatial ALD of IrO2 and Pt films for green H2 production by PEM electrolysis | Paul Poodt, SparkNano B. V., The Netherlands
- APECS Pilot Line – Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems | Wenke Weinreich, Fraunhofer IPMS, Germany
Program Committee
- Sean Barry, Carleton University, Canada
- Gloria Gottardi, Fondazione Bruno Kessler, Italy
- Christoph Hossbach, Applied Materials / Picosun Europe, Germany
- Martin Knaut, TU Dresden, Germany
- Laura Nyns, IMEC, Belgium
- Fred Roozeboom, University Twente, Netherlands
- Jonas Sundqvist, Alixlabs, Sweden
POSTER Exhibition
The Poster Submission is open until January 31, 2025. Please send us an Abstract for your Poster Application. PO001 | Deposition of High Quality Aluminium Fluoride Layers through Optimization of a PEALD Process using Al(CH3)3 and SF6 | Fabian Steger, RhySearch, Buchs, Austria PO002 | Evaluating the Enhanced Fire Resistance of Polyamide Fabric through Dual-Layer Treatment with ALD-ZnO and DOPO-Based Silane | Sebastian Lehmann, Leibniz IFW, Germany
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