Revolutionizing Silicon Photonics: First Electrically Pumped Group IV Laser Achieved for Seamless Integration on Silicon Chips

Researchers have achieved a groundbreaking milestone in silicon photonics by developing the first electrically pumped Group IV laser, made from silicon-germanium-tin layers directly grown on silicon wafers. This innovation paves the way for cost-effective, energy-efficient photonic integrated circuits in next-gen silicon chips.

The breakthrough in silicon photonics achieved by an international research team marks a transformative step in the materials and manufacturability of photonic devices. By developing the first electrically pumped continuous-wave laser made entirely of Group IV materials—silicon, germanium, and tin—the researchers overcame a long-standing challenge in integrating efficient light sources directly into silicon-based technologies. This laser is built using ultrathin layers of silicon-germanium-tin and germanium-tin, grown directly on silicon wafers. Its compatibility with conventional CMOS processes promises seamless integration into existing silicon manufacturing workflows, reducing costs and enhancing scalability. Unlike traditional lasers based on III-V materials, which are costly and complex to integrate with silicon, this innovation makes use of widely available Group IV elements, providing an energy-efficient and manufacturable solution for on-chip photonics.

This laser not only operates with a low current of 5 milliamperes at 2 volts but also features a sophisticated multi-quantum well structure and ring geometry to minimize power consumption and heat generation. Though the device currently functions at cryogenic temperatures, its development path mirrors earlier advancements in germanium-tin lasers that achieved room-temperature operation within a few years. The laser’s manufacturability is further underscored by its growth on standard silicon wafers, aligning with industry-standard processes. This achievement is poised to catalyze the adoption of low-cost photonic integrated circuits (PICs) in microchips, meeting the growing demand for energy-efficient hardware in AI and IoT applications while paving the way for advances in optical data transmission and next-generation silicon photonics.

Sources:

Silicon Photonics Breakthrough: The “Last Missing Piece” Now a Reality