Forge Nano Expands ALD Capabilities with New TEPHRA™ Cluster Tool and State-of-the-Art Cleanroom

Forge Nano has significantly expanded its semiconductor atomic layer deposition (ALD) capabilities with the completion of a new 2,000 sq ft cleanroom dedicated to manufacturing its TEPHRA™ ALD cluster tools. This expansion comes in response to increased demand for high-throughput ALD solutions in the 200mm wafer market, particularly for advanced packaging, power semiconductor, and microelectromechanical system (MEMS) applications. The new facility, featuring Class 10 (ISO 4) cleanroom space and a dedicated metrology lab, will enable Forge Nano to accelerate production, conduct customer demonstrations, and validate ALD process integration for commercial-scale adoption.

The TEPHRA™ cluster tool is designed to deliver ultrathin, uniform coatings with 10x the throughput of traditional ALD systems, supporting applications such as conformal metal barrier seed layers for through-silicon and through-glass vias (TSVs and TGVs). With customer tool deliveries expected in early 2025, Forge Nano is inviting industry partners to on-site demonstrations showcasing TEPHRA’s capabilities. This expansion reinforces Forge Nano’s position as a key enabler of next-generation semiconductor manufacturing, offering efficient and scalable ALD solutions for the growing demand in advanced node technologies.

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Blog - Forge Nano