Game-Changing ALD Breakthrough: KJLC Achieves First Scandium Nitride PEALD Process

Revolutionizing Atomic Layer Deposition: Kurt J. Lesker Company's Groundbreaking ALD Publication

January 08, 2025 | By KJLC Innovate 

In the ever-evolving world of semiconductor technology, innovation is the key to staying ahead. At Kurt J. Lesker Company, we are proud to announce a groundbreaking achievement that promises to revolutionize the field of Atomic Layer Deposition (ALD). Our latest publication, featuring the patented Precursor Focusing Technique (PFT) and Ultra-High Purity (UHP) process capability, marks a significant milestone in our commitment to advancing next-generation applications.

The First of Its Kind: Scandium Nitride by PEALD

For the first time, scandium nitride (ScN) has been successfully deposited using plasma-enhanced atomic layer deposition (PEALD) on silicon, sapphire, and magnesium oxide substrates under UHP conditions. This innovative process utilizes a new scandium precursor, bis(ethylcyclopentadienyl)scandium-chloride [ClSc(EtCp)2], combined with N2-H2 plasma species, allowing for the deposition of high-quality ScN films at relatively low temperatures (200−300°C).

Why This Publication is a Game-Changer

The significance of this publication lies in its potential to transform various advanced electronic applications. The ScN films produced by this process exhibit high crystalline quality and excellent electrical properties, with high mobility and low resistivity. These characteristics make them suitable for a wide range of applications, including thermoelectric devices and as an interlayer for epitaxial gallium nitride (GaN) growth.

Moreover, the ability to conformally coat high aspect ratio (HAR) structures is particularly valuable for applications in 3D embedded memory and piezoelectric microelectromechanical systems (piezoMEMS). Traditional sputtering techniques are not suitable for these applications involving complex 3D architectures, making this new ALD process a significant advancement.

The Commercial Relevance of ScN

Scandium nitride is commercially relevant primarily because it forms a solid solution with aluminum nitride (AlN), resulting in aluminum scandium nitride (Al1-xScxN), which enables ferroelectric switching. Al1-xScxN thin films are traditionally deposited via reactive magnetron sputtering, which yields highly c-axis oriented columnar grains. However, sputtering is not suitable for coating high-aspect ratio (HAR), vertically layered structures such as those desired for use in 3D embedded memory.

Recently, there have been several reports of piezoelectric AlN grown by atomic layer deposition (ALD) techniques that have shown promising crystalline quality and properties. However, there are no reports of ALD Al1-xScxN, principally because there are no reported ALD processes for ScN. This publication addresses this gap, providing a new method for depositing high-quality ScN films.

Looking Ahead

As KJLC continues to push the boundaries of ALD technology, we are excited about the possibilities our new research and development opens up. From thermoelectrics to applications involving high-aspect ratio (HAR) architectures such as 3D embedded memory and piezoMEMS technology, the high crystalline and electrical quality demonstrated here for ScN by PEALD techniques is just the beginning.

Sources:

https://www.lesker.com/blog/revolutionizing-ald-kjlcs-groundbreaking-ald-publication - Blog article

https://www.lesker.com/newweb/vacuum_systems/pdf/jva24-le-gl2025-00618.pdf - Paper Download

Kalpana Systems Unveils Roll-to-Roll Spatial ALD Tools for Solar, Batteries, and Packaging

Kalpana Systems, a Dutch thin film equipment manufacturer, has launched roll-to-roll spatial atomic layer deposition (sALD) tools, targeting industries such as solar PV, organic light-emitting diodes, batteries, and packaging. The technology focuses on depositing high-quality functional thin layers with atomic precision without causing sputter damage, with initial applications in barrier layer deposition. Since its founding in 2021, the company has developed its first operational machine, raising €3.5 million to transition from prototype to commercial production. The sALD technology supports high throughput industrial processes, enabling deposition of multiple layers with web speeds up to 10 m/min and is designed for integration with other deposition techniques. Two models, the K300 and K600, cater to different market needs, with specifications optimized for flexible electronics, solar cells, and high-speed applications like batteries and packaging.

The sALD equipment addresses stability and durability challenges faced by producers of perovskite and organic solar cells, offering cost-effective encapsulation methods. Both K300 and K600 models can process flexible substrates and are programmable for various operational parameters, making them versatile across roll-to-roll production processes. With lead times of 9–12 months, Kalpana Systems offers customizable customer onboarding support. Backed by investors such as Fairtree Elevant Ventures and SIG InnoVentures, the company emphasizes the uniqueness of its roll-to-roll technology in delivering high volume, rapid production, and wide market adoption. These innovations position Kalpana Systems as a competitive player in thin film deposition, advancing the development of efficient and scalable manufacturing solutions.

Kalpana Systems, founded in 2021 and headquartered in Delft, Netherlands, specializes in high-throughput spatial Atomic Layer Deposition (sALD) technology for thin film coatings on flexible substrates.Their innovative Superspatial ALD technology enables cost-effective production of thin films, facilitating the transition from technological promise to commercial application. The company's solutions are designed to advance sectors such as solid-state batteries, environmentally friendly packaging, and perovskite solar cells.

In July 2024, Kalpana Systems secured €3.5 million in a Series A funding round led by Fairtree Elevant Ventures, SIG InnoVentures, and the Energy Transition Fund Rotterdam.This investment aims to accelerate the development and commercialization of their sALD technology, positioning the company to meet the growing demand for advanced thin film deposition solutions across various industries.

Skytech Inc. Poised for Record Growth with Advanced ALD and Etching Innovation

Skytech Inc., a leading Taiwanese semiconductor equipment manufacturer, is forecasting a milestone year in 2025, with anticipated revenue growth exceeding 20% year-on-year. The surge is driven by robust demand for advanced chip manufacturing and packaging solutions, including atomic layer deposition (ALD) equipment and chip-on-wafer-on-substrate technologies. Skytech's innovative offerings, such as its highly customizable ALD systems and newly introduced etching solutions like Descum and Plasma Polish, are solidifying its position in the global semiconductor industry. With expanded clean room facilities and a strong product portfolio, Skytech continues to lead in cutting-edge semiconductor technologies while navigating geopolitical challenges with resilience.

Skytech Inc, a Taiwanese semiconductor equipment manufacturer, forecasts at least 20% year-on-year revenue growth in 2025, driven by strong demand for advanced chip manufacturing and new advanced packaging equipment. The company is expanding its clean room facilities in Hsinchu County to meet customer demand and has secured significant orders for atomic layer deposition equipment and tools used in advanced packaging technology, including chip-on-wafer-on-substrate solutions. In the first 10 months of 2024, Skytech’s revenue grew 18.33% to NT$1.69 billion, with net profit rising 64.15% year-on-year to NT$261 million. Semiconductor equipment contributes 50% of Skytech's revenue, while components and parts supply make up the remainder. With a 30% exposure to the Chinese market, Skytech is monitoring geopolitical tensions but remains unaffected by export restrictions.

Skytech develops and manufactures Atomic Layer Deposition (ALD) equipment. In 2019, the company designed its first ALD machine, named Atomila, marking its entry into the ALD equipment market.  Skytech's ALD systems are equipped with six chamber positions and are highly integrated with Equipment Front End Module systems. These systems offer customizable chamber configurations based on customer requirements and include options for pre-treatment or post-treatment of ALD depositions. Depending on temperature and plasma damage concerns, customers can choose between Thermal-ALD or Plasma-Enhanced ALD (PE-ALD) processes. The equipment features a patented gas inlet design and showerhead system to ensure excellent uniformity. Additionally, an optional automatic pick-and-place tool enables coating of different wafer sizes on a 12-inch platform, supporting fab automation.  In 2021, Skytech's ALD equipment was verified and adopted by Epistar, contributing to the commercialization of LED technologies.  

Skytech's ALD systems feature six chamber positions and are highly integrated with Equipment Front End Module (EFEM) for advanced automation. The systems offer customizable chamber configurations tailored to customer requirements and include optional treatment chambers for effective pre-treatment or post-treatment of ALD depositions. Users can choose between Thermal-ALD or Plasma-Enhanced ALD (PE-ALD) processes, depending on temperature and plasma damage concerns. The equipment is equipped with SECS/GEM protocols for seamless fab automation and incorporates a patented gas inlet design and showerhead system to ensure excellent uniformity. Additionally, an optional automatic pick-and-place tool enables coating of different wafer sizes on a 12-inch platform, further enhancing its suitability for automated semiconductor manufacturing.

Skytech's Powder ALD Tool is designed to extend the lifespan and enhance the stability of quantum dots (QDs) by applying Al₂O₃ passivation to protect against oxygen, moisture, and heat. Leveraging Atomic Layer Deposition (ALD), the tool provides sub-nanometer precision and highly conformal coatings under gentle conditions, making it ideal for QD thin films. The tool features an optional ozone generator for diverse oxidation sources, a specialized flow field design for improved powder coating, a uniform chamber temperature maintained by a unique heater design, and support for three sets of precursor/co-precursor pipelines. It is specifically tailored for effective powder coating, ensuring optimal protection for QDs.

In 2023, the company introduced etching systems such as Descum and Plasma Polish, expanding its product line to meet market demands.  These etching solutions are designed to support various semiconductor manufacturing processes, enhancing Skytech's capabilities in the semiconductor equipment industry. 

Sources:

Skytech expects revenue to increase to all-time high - Taipei Times

Jusung Engineering Posts Stellar Q2 Recovery with 207% Sales Surge, Driven by Semiconductor Market Rebound

Jusung Engineering reported a robust financial recovery in the second quarter of 2024, with sales soaring by 207% to 97.3 billion won ($72.0 million) compared to the same period last year, and an operating profit margin of 37%. This turnaround follows a challenging first quarter and is driven by increased orders and deliveries of semiconductor equipment, including a significant contract with SK Hynix for DRAM manufacturing in China. The company's expertise in Atomic Layer Deposition (ALD) technology and its expansion into OLED and solar power sectors position it well for continued growth as the semiconductor market rebounds.

Sources:

Jusung Engineering Reports Robust Q2 Results with 207% Sales Growth - Businesskorea

ACM Research Advances in ALD with Ultra FnA Furnace System for Semiconductor Manufacturing

ACM Research, a US company specializing in wafer cleaning equipment for the semiconductor industry, presents a strong growth opportunity. The company beat Q2 estimates, raised its fiscal year guidance, and is well-positioned to benefit from the expected significant growth in the wafer cleaning equipment market, particularly in China. ACM Research's competitive advantages include high investment in R&D and the ability to provide highly customized solutions. 

The Ultra FnA Furnace System by ACM Research is designed for the precise and uniform deposition of ultra-thin films using thermal Atomic Layer Deposition (ALD), which is essential for advanced integrated circuits (ICs) and compound semiconductor manufacturing as logic nodes shrink. It effectively deposits silicon nitride (SiN) and silicon carbide nitride (SiCN) on high aspect ratio 3D structures, such as FinFETs and nanosheets, ensuring good step coverage and uniformity across wafers. The system boasts superior process control through its innovative hardware and proprietary algorithms, offering high-throughput batch processing, cost-effectiveness, and customization for various advanced semiconductor processes, with the capability to process up to 100 wafers at a time.

ACM Research Advances in ALD with Ultra FnA Furnace 300 mm System for Semiconductor Manufacturing

About ACM Research

ACM Research offers a comprehensive portfolio of tools designed to support various semiconductor manufacturing applications, including ICs, compound semiconductors, wafer-level packaging, and wafer manufacturing. Their advanced product range includes solutions for multiple processing steps such as wet cleaning, electroplating, thermal deposition, ALD, and more. Known for delivering customized, high-performance technology that enhances productivity and efficiency, ACMR is committed to meeting the diverse needs of high-volume manufacturing with a low cost of ownership. With a strong IP portfolio and a global presence, ACMR leverages its extensive industry expertise and international support network to provide innovative solutions and world-class service to customers across Asia, North America, and Europe. Founded in California in 1998, the company operates manufacturing and support facilities in China and South Korea.

Sources:

Ultra FnA ALD Furnace System - ACM Research, Inc.

ACM Research: A Promising Semiconductor Growth Opportunity Outpacing Risks (NASDAQ:ACMR) | Seeking Alpha

Jusung Engineering to Spin Off Semiconductor Business, Aiming for Market Revaluation and Strategic Growth

Jusung Engineering, a a first in Korea’s chipmaking equipment industry, has announced a significant restructuring aimed at enhancing its market valuation and navigating geopolitical risks. The company will spin off its highly successful semiconductor division into a new entity, marking a strategic move to unlock greater value for its shareholders and position itself for future growth.

Chairman Hwang Chul-ju highlighted the undervaluation of Jusung despite its proprietary technologies and leading market position. By creating a new entity for its semiconductor business, Jusung aims to elevate its market cap, which currently lags behind international competitors. The new semiconductor entity, tentatively named Jusung Engineering, will operate independently, allowing it to focus solely on expanding its technological capabilities and market presence.

The spin-off comes as Jusung's semiconductor division continues to excel with its advanced film deposition technologies, including selective semi-spheric silicon deposition and atomic layer deposition (ALD). These technologies are pivotal in the production of DRAM memory, NAND flash, and logic chips. As the demand for more integrated and smaller semiconductor devices grows, Jusung's ALD equipment is set to become increasingly crucial. Additionally, Jusung’s poly etchers, applicable across various semiconductor products, will play a significant role in diversifying the company’s offerings.

Despite achieving annual sales of 200 billion won ($146 million) and holding a market cap of 1.6 trillion won, Jusung's valuation remains significantly lower than its global peers. For instance, Dutch competitor ASM boasts a market cap of 47.3 trillion won. The spin-off is expected to narrow this gap, potentially achieving comparable sales records within five years. 

The decision also aims to mitigate risks from the ongoing US-China rivalry. By separating the semiconductor business, Jusung can better shield its other divisions, including display and solar panel equipment, from potential geopolitical fallout. This strategic insulation ensures that the company’s diverse operations remain resilient in the face of international tensions.

There is speculation about Hwang Eun-seok, the chairman’s son, taking the helm of the new semiconductor entity. With a doctorate in material science and experience at Samsung Semiconductors, Eun-seok is well-prepared for leadership, though Chairman Hwang emphasizes that any succession will be merit-based.

Jusung Engineering's spin-off of its semiconductor business represents a bold move to enhance its market valuation and strategically position itself for sustained growth. By creating a focused, independent entity, Jusung aims to capitalize on its technological strengths and navigate the complexities of the global semiconductor market more effectively. This restructuring is set to unlock new opportunities and reinforce Jusung's standing as a key player in the tech industry.

Sources: Jusung, Undervalued no more: Jusung Engineering to spin off chip business (naver.com)

ASM a revenue of €639 million Q12024 - driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

Here are the key points from ASM International NV's financial results for the first quarter of 2024:

The company reported a revenue of €639 million, at the upper end of their guidance, driven significantly by sales in Atomic Layer Deposition (ALD) and Epitaxy (Epi) technologies.

The foundry and memory segments were the leading contributors to revenue. While the combined logic/foundry segment saw a decline year-over-year, it improved from the previous quarter. The automotive semiconductor market showed weakness, whereas the memory market is showing signs of recovery.

• Gross margin increased to 52.9%, largely due to strong sales performance in the Chinese market.
• New orders reached €698 million, marking a 10% increase from the previous year, mainly driven by the foundry sector. The company expects continued demand for gate-all-around technology, with significant orders anticipated in the second half of the year.
• Despite a slowdown in certain segments like power/analog/wafer, ASM International maintains a strong financial position with a cash reserve of €720 million at the end of the quarter. Sales in China are expected to remain robust.

Kokusai Electric Showcased Batch ALD Technology for 40-28nm Nodes at SEMICON China 2024

At SEMICON China 2024, Kokusai Electric Corporation emphasized its strengths in atomic layer deposition (ALD) technology. The company showcased its batch-type ALD systems, which are particularly adept at achieving high-quality, uniform film deposition on multiple wafers simultaneously. This technology ensures excellent film thickness control and good step coverage, crucial for advanced semiconductor manufacturing. As the Chinese market increasingly transitions from chemical vapor deposition (CVD) to ALD due to its precision, Kokusai is poised to meet this rising demand, especially in fields like 3D stacking and miniaturization.

Kokusai highlighted its ALD technology specifically for mature semiconductor technology nodes in the 40 to 28nm range at SEMICON China 2024. This focus addresses the growing demand for precise film quality in these specific nodes within the Chinese market.

Source: Kokusai Electric Zeroes in on Film Quality Improvement | AEI (dempa.net)

ASM International: Spearheading Semiconductor Innovation in ALD, Epitaxy, and CVD Markets

ASM International N.V. (Euronext Amsterdam: ASM) yesterday reported its fourth quarter 2023 operating results (unaudited). Double-digit full-year revenue growth, outperforming softer WFE market in 2023

Investor presentation: 2023_q4_investor-presentation.pdf (asm.com)

“2023 was another successful year for ASM. Sales increased by 13% at constant currencies, despite softening market conditions, and marking the seventh consecutive year of double-digit growth.” said Benjamin Loh, CEO of ASM. “Revenue in Q4 2023 amounted to €633 million, in line with our guidance of €600-640 million and down compared to the level in Q4 2022. Revenue in the quarter was supported by strong sales in the power/analog/ wafer segment. Bookings at €678 million were slightly better than our expectation and were driven by GAA pilot- line orders and continued strength in China demand.

ASM's Leadership in the Growing ALD Market

According to ASM, the single wafer Atomic Layer Deposition (ALD) market is experiencing significant growth, with projections indicating an increase from $2.6 billion in 2022 to a range of $4.2 billion to $5.0 billion by 2027. This growth, characterized by a Compound Annual Growth Rate (CAGR) of 10-14% from 2022 to 2027, underscores the expanding role of ALD technology in semiconductor manufacturing. ASM International, a key player in the semiconductor industry, holds a dominant position in this market, commanding a share of over 55% throughout the forecast period.

Please note that this market assessment, most probably originally from TechInsights (prev. VLSI Research) does not include Large Batch furnace ALD, which historically have been about 30% of the total 300 mm ALD equipment market. The leaders in this segment are Tokyo Electron followed by Kokusai and ASM chose not to compete with its A412 ALD product line.

Driving Forces Behind ALD Market Expansion

The expansion of the ALD market is propelled by a series of technological advancements and increasing demands within the semiconductor sector. Key factors contributing to this growth include the industry's shift towards Gate-All-Around (GAA) technology, the necessity for advanced high-k gate dielectrics, and the precision required for threshold voltage tuning. Additionally, the development of sacrificial layers and the use of high aspect ratio Through-Silicon Vias (TSVs) are critical in advancing semiconductor manufacturing techniques. The application of metals and the adoption of selective ALD processes further accentuate the importance of ALD technology in modern semiconductor fabrication.

ASM's Strategic Positioning and Market Opportunities

ASM is well-positioned to capitalize on the opportunities presented by the burgeoning ALD market. The company's strategic emphasis on innovation, coupled with its comprehensive product portfolio, positions ASM as a frontrunner in meeting the evolving needs of the logic/foundry and memory segments of the semiconductor industry. The transition to advanced manufacturing technologies, such as GAA and high-k metal gate applications, presents significant growth avenues for ALD, with ASM at the forefront of this technological evolution.

To be more specific, the transition to GAA technology and the expansion in FinFET applications are set to significantly increase ASM's served available market by approximately US$400 million for every 100,000 wafer starts per month (WSPM). According to ASM, the equipment orders started to come in in the 2nd half of 2023. We can assume that this are orders from Samsung, TSMC and Intel. It is however about peculiar since Samsung had 3 nm GAA going already with yield in August 2023 and ASM is describing it as GAA pilot lines. Anyhow, come 2028 when all leading foundries including Rapidus in Japan are up and running GAAFETs, this additional market will be + USD 1.5 B as compared to if it would have been "only" FinFET technology - according to my back of the envelope calculations. For a company like ASM, with just below USD 3 B (2.6 B EUR) annual Revenue 2023 this is a huge thing. If this is not enough to go woah - add to that the GAAFET market is an upwards moving target and will continue to grow and looking ahead stacking of NMOS/PMOS will drive further demand for this type of ALD and Epi processes.

Expansion into the Epitaxy and CVD Markets

The Silicon Epitaxy (Si epi) market is also on a growth trajectory, with forecasts suggesting it will reach between $2.3 billion and $2.9 billion by 2027. ASM aims for a market share target of over 30%, focusing on both leading-edge and non-leading-edge segments. The leading-edge growth is driven by transitions to GAA technology and advancements in high-performance DRAM, while the non-leading-edge growth is buoyed by wafer power analog and strong momentum from ASM's Intrepid ESA. The epitaxy market is expected to see a Compound Annual Growth Rate (CAGR) of 3-8% from 2022 to 2027, with the leading-edge segment outpacing the overall market with a CAGR of 10-15%.

Regarding the SiC market, the investor presentation highlighted significant growth in power/analog/wafer revenue, almost doubling, primarily driven by robust demand in China. This growth was positively impacted by the consolidation of LPE (SiC Epitaxy), with sales comfortably exceeding the target of more than €130 million in 2023. This indicates ASM's strong performance in the SiC market and its successful integration and expansion in SiC epitaxy, aligning with the broader industry trend towards more advanced and efficient semiconductor materials.

Chemical Vapor Deposition (CVD) technology is another area of focus for ASM, particularly in the context of transitioning to new materials like Molybdenum, which is replacing traditional materials such as CVD Tungsten and PVD Copper in interconnect applications. This shift is indicative of the evolving needs within the semiconductor manufacturing process and highlights ASM's adaptability to changing market dynamics.

In summary, ASM's strategic initiatives in ALD, Epitaxy, and CVD technologies underscore the company's commitment to innovation and leadership within the semiconductor equipment market. Through a combination of market foresight, technological prowess, and strategic investments, ASM is well-positioned to capitalize on the growth opportunities presented by the evolving semiconductor landscape. 

Significant Investment in ALD Technology for MicroLED & AR: Oxford Instruments' Pioneering Role

Oxford Instruments, a renowned name in the realm of technology, has recently made a significant contribution to the advancement of MicroLED and Augmented Reality (AR) devices. The company has supplied its state-of-the-art Atomic Layer Deposition (ALD) technology to a leading UK manufacturer. This move is set to revolutionize the way we experience consumer-immersive reality products and display devices.

The Rise of MicroLED and AR

The demand for wearable devices with compact form factors and high-definition displays is skyrocketing. This trend is driving extensive research and development in the industry. MicroLEDs stand out in this arena for their ability to offer incredibly small die pitch sizes (less than 10 µm), enabling the miniaturization of wearable display devices without compromising image resolution. However, as pitch sizes shrink, the challenges in manufacturing increase, particularly regarding the damage caused during mesa formation and isolation steps. This damage can significantly impede device performance.

Oxford Instruments' Breakthrough with Plasma ALD

At the 2023 International Conference on Nitride Semiconductors (ICNS) in Fukuoka, Japan, the spotlight was on Plasma ALD technology, provided by Oxford Instruments. This technology has been hailed for its ability to mitigate damage and substantially boost external quantum efficiency – a critical measure of material performance. The Plasma ALD technology from Oxford Instruments, especially their high-K passivation solution, is optimized for smaller dies, enhancing performance in devices like head-mounted displays for virtual reality and smartwatches.

Oxford Instruments' ASP tool for PEALD offers precise, plasma-enhanced thin-film deposition, ideal for semiconductor, photonics, and microLED applications.

Klaas Wisniewski, Oxford Instruments' Strategic Business Development Director, expressed excitement about their Plasma ALD technology's growing market presence. "Our low-damage Plasma ALD technology, especially on our 200 mm capable platform, has been instrumental in doubling the external quantum efficiency for some of our customers at ICNS," said Wisniewski.

Looking Forward: Photonics West 2024

Oxford Instruments is not resting on its laurels. As a leader in compound semiconductor processing equipment, the company is set to participate in Photonics West 2024 in San Francisco. There, Oxford Instruments will showcase its latest optoelectronics processes for augmented, virtual, and mixed reality, as well as quantum and data transfer applications critical for AI and machine learning. This event will be an excellent opportunity for industry professionals to learn how Oxford Instruments' etch, deposition, and Ion Beam process solutions can enhance their projects, ensuring higher efficiency and lower costs.

In conclusion, Oxford Instruments' investment in ALD technology for MicroLED and AR is a game changer, marking a significant step forward in the evolution of consumer electronics and immersive reality experiences.

NCD supplied repeated ALD equipment for special protective coating

NCD Co., Ltd. has again supplied large-scale productive ALD equipment to a Korean customer. It is for special coating parts used in semiconductor equipment to protect from corrosion and plasma arcing. This contracted equipment is the improved Lucida GSH Series ALD, which is capable of coating more and heavier products at once than the existing equipment. So the customer is able to obtain the greater increased productivity and reduced coating costs.

As semiconductor devices become smaller and more integrated, particles and byproducts that were not a problem before can significantly affect device performance, so the cleaning cycle and life time of parts used in semiconductor equipment are becoming shorter.

Lucida GSH Series ALD

Therefore, atomic layer deposition protective coating on parts can be a very effective solution, and high-quality, uniform atomic layer coating can achieve the effect of increasing the usage time of expensive parts in semiconductor equipment without cleaning and replacement.

Previously, atomic layer deposition protective coating was widely applied to expensive parts such as showerheads and ESCs, but recently, it has been applied to various semiconductor equipment parts with complex gas paths, quartz products with complicated shapes, and high-purity precursor canisters that require the lowest impurity control. The scope of application is gradually increasing so we will look forward to steady and continued expansion of products and markets in this application field.

This repeated contract confirms once again the excellence of NCD's industrial atomic layer deposition technology and equipment to its customers, and it showed NCD to have occupied the leader on the gradually expanding market of atomic layer deposition equipment for part protection coating. NCD will continue to pioneer new atomic layer deposition markets based on its best technology and customer trust.

ASM International Announces $300M Expansion in Arizona, Boosted by Dutch-U.S. Collaboration with Prime Minister Mark Rutte's Support

ASM International N.V. is set to expand its U.S. operations with a €300 million investment in a new facility in Scottsdale, Arizona. This expansion, covering more than 20 acres, aims to bolster their research, technology development, and manufacturing capabilities in the semiconductor industry. The state-of-the-art site, spanning 250,000 square feet, will host various functions, emphasizing renewable energy and sustainability.

A rendering of the new ASM HQ (source ASM America)

This move marks a significant step in reinforcing Arizona's position as a hub for semiconductor innovation and highlights the strong Arizona-Netherlands partnership. Notably, Mark Rutte, Prime Minister of the Netherlands, emphasized the importance of this expansion in strengthening cross-border collaborations and the global semiconductor value chain. The initiative is viewed as pivotal in fostering Dutch-U.S. partnerships and propelling advancements in the industry.

“Arizona and the U.S. are valuable partners in the Netherlands’ mission to co-create solutions that promote innovation and partnerships in the global semiconductor value chain,” said Mark Rutte, Prime Minister of the Netherlands. “It is through these types of cross-border collaborations that we are shaping the future of advancements in this growing industry.”

The new facility will create approximately 500 new jobs over six years, focusing on engineering and research roles. ASM's commitment to sustainability is evident in its plans for LEED certification and water reuse programs. Additionally, the company has formed partnerships with local organizations for environmental conservation efforts, showcasing its dedication to community and environmental stewardship. This expansion by ASM International is set to significantly enhance semiconductor technology and innovation, highlighting the growing synergy between the U.S. and the Netherlands in this vital sector.

Source:

Press releases | ASM

Launch of the Oxford Instruments Innovation Centre: Advancing Scientific Research and Collaboration

The Oxford Instruments Innovation Centre, a state-of-the-art facility, has been launched at its High Wycombe site. This Centre consolidates Oxford Instruments' analytical innovations, aligning with its mission of fostering a greener, healthier, more connected society. The inauguration welcomed dignitaries like Countess Howe, Lord-Lieutenant of Buckinghamshire, and Cllr. Paul Turner, Mayor of High Wycombe, alongside prominent figures from academia and industry. Dr. Ian Wilcock, Managing Director, led the opening, showcasing the Centre's role in advancing scientific research in various fields. The facility, a collaboration hub, allows access to cutting-edge technology and expertise. Oxford Instruments, a pioneer since 1959 and a significant contributor to Nobel-prize winning research, continues to impact science, particularly in material analysis, underlining its global technological leadership.

Source: Oxford Instruments Launches Innovation Centre - Oxford Instruments (oxinst.com)

Congratulations to Jusung Engineering on 30 Years of Pioneering Innovation and Market Leadership in ALD, Semiconductor, Display, and Solar Technologies!

Jusung Engineering, celebrating its 30th anniversary, is a leader in semiconductors, displays, and solar equipment. Founded in 1993, the company has seen considerable growth through innovation, achieving record sales and operating profits last year. It specializes in semiconductor equipment for memory and non-memory sectors, leveraging advanced ALD technology. In displays, Jusung is diversifying equipment for various panel sizes, while in solar, it's innovating with high-efficiency solar cells. The company is investing in future growth, with new R&D and manufacturing facilities, focusing on technological independence. It holds over 3,000 patents, with 65% of its workforce in R&D, investing 15-20% of sales in technology development. The CEO attributes their success to relentless innovation and a unique path, with plans to maintain leadership in future technologies and expand into global markets. Despite recent challenges, Jusung remains optimistic, prioritizing innovation and market creation.

The Jusung Engineering headquarters in Gwangju, Korea 출처 : Businesskorea (https://www.businesskorea.co.kr)

Fullarticle and interview:

Jusung Engineering Leading in Semiconductor, Display, Solar by Innovating with Atomic Layer Deposition - Businesskorea

Kokusai Electric's Stellar Tokyo IPO: A Surge in Stock, High Hopes for the Future

Kokusai Electric's stock rose 28% in its Tokyo debut after KKR sold its shares for $724 million, marking Japan's largest IPO in five years. Closing at 2,350 yen, Kokusai's valuation reached $3.61 billion. This was the biggest Tokyo listing since SoftBank Corp. in 2018. KKR reduced its stake from 73.2% to 47.7%. Analysts noted a challenging market for chip-related stocks but anticipate a rebound for Kokusai. The company specializes in machines for silicon wafer films, with major clients like Samsung. Despite a predicted profit drop, Kokusai's President sees growth potential by 2025. KKR's previous sale attempt to Applied Materials was unsuccessful. The IPO saw huge interest, with foreign investors oversubscribing by over 10 times.

Source: Kokusai Electric shares jump 28% in Tokyo debut - Nikkei Asia

Kokusai Electric's Upcoming IPO: A Strategic Move in the Booming Semiconductor Market

Kokusai Electric is set to go public on the Tokyo Stock Exchange on October 25th, with an indicative share price of 1,890 yen per share. The IPO aims to raise 111.2 billion yen ($749.88 million) to fund research investment in the chipmaking equipment market. This move also serves as a partial exit for KKR, which previously purchased Hitachi's electronic equipment unit in 2017 and later spun off Kokusai.

In 2019, KKR attempted to sell Kokusai to Applied Materials for $3.5 billion, but the deal fell through due to regulatory hurdles in China. Applied Materials subsequently acquired a 15% shareholding in Kokusai. Kokusai Electric specializes in semiconductor manufacturing equipment, particularly in Atomic Layer Deposition (ALD) technology, with a strong market position, including a 23% share of the global ALD equipment market in 2020.

Kokusai Electric's ALD equipment portfolio includes products like TSURUGI-C²® for 300mm wafers and VERTRON® Revolution for 200mm wafers, known for their high performance and productivity. The company's main customers for ALD equipment include Samsung, SK Hynix, Micron, and Intel. Kokusai Electric's IPO is scheduled for September 23, 2023.

ATLANT 3D Hosts Workshops Unveiling Atomic Layer Advanced Manufacturing Innovation

Atlant 3D will hold a series of workshops happening from October 7th to 13th. We Open Door to ATLANT 3D to share our cutting-edge innovation in atomic layer processing, and we will show you insights on how atomic layer processing will become an atomic layer advanced manufacturing platform!

ATLANT 3D technology is our proprietary Microreactor 

Dive Deep into the World of Atomic Precision with ATLANT 3D!
Event by ATLANT 3D

Oct 7, 2023, 9:00 AM - Oct 13, 2023, 4:00 PM (CET)

Mårkærvej 2b, Taastrup, Region Hovedstaden, DK, 2630

ATLANT 3DEvent linkhttps://share-eu1.hsforms.com/1iMhfw9vDTNutLAZcImhj_Af3elp

Direct Atomic Layer Processing (μDALP), which works by sequentially applying reactive gases to a surface via a microreactor/micronozzle and generating self-controlled chemical reactions on the surface. Repeating this process in cycles enables rapid, direct, multi-material, atomically precise patterning and structuring on simple and complex surfaces, including semiconductor wafers and surfaces with existing structures and devices. Integrating multiple micronozzles in a single printhead allows increasingly complex structures to be fabricated through the simultaneous use of different materials and printing resolutions. 

ATLANT 3D equipment is built as modular units which gives compatibility across different platforms and technologies. It can work as a production line based on process modules and as a cluster tool-compatible module unit.

SkyWater Installs Advanced Atomic Layer Deposition System from Picosun

SkyWater Technology (SkyWater Technology | U.S. Semiconductor Manufacturer) has announced the installation of an Atomic Layer Deposition (ALD) system, the Applied Picosun MorpherTM, to offer advanced semiconductor processing capabilities to its customers. ALD is a precise method for depositing ultra-thin, uniform, and conformal material layers, making it ideal for applications like sensors and emerging memory technologies. SkyWater's Technology as a Service (TaaS) model allows customers to access this technology for developing and producing innovative technologies. The ALD tool has two thermal batch chambers for depositing metals and oxides, ensuring high-quality and repeatable results. This move aims to meet the increasing demand for ALD applications in semiconductor processing, particularly in areas such as biosensors, photonics, and extreme CMOS applications.

SkyWater Minnesota Fab (SkyWater)

SkyWater Technology is a leading U.S.-based semiconductor manufacturer with a unique Technology as a Service (TaaS) model. They offer a wide range of semiconductor solutions, serve various industries, and emphasize innovation and quality. Their expertise spans diverse semiconductor categories, from mixed-signal CMOS to photonics, and they are accredited as a Category 1A Trusted Foundry by the Defense Microelectronics Activity (DMEA).

The Morpher ALD tool is designed for precise and controlled deposition of thin material layers, making it suitable for various semiconductor applications. It is configured with two thermal batch chambers, one for depositing metals and another for depositing oxides, allowing for flexibility and efficiency in semiconductor fabrication processes. This tool is being installed at SkyWater Technology to provide their customers with access to ALD capabilities for developing and producing advanced semiconductor technologies.

Source: Press Releases | SkyWater Technology

Netherlands' chip tool export controls take effect for DUV Lithography and ALD

The Netherlands has enacted new export controls on cutting-edge chipmaking technology, joining the US and Japan in regulating these crucial tools. The new move, effective from September 1, targets advanced chip manufacturing equipment used in processes like deep ultraviolet (DUV) lithography and atomic layer deposition (ALD) - an add-on to previous EUV Lithography export restrictions. 

Dutch company ASML, a global leader in chipmaking equipment, will continue shipments of some advanced machines this year, but starting January 1, it expects limited export licenses for systems bound for domestic Chinese customers. 

The Dutch government says it is a matter of the country's security. "We've taken this step on national security grounds," Liesje Schreinemacher, the minister for foreign trade and development cooperation, said of the new rules.

ASM International, a Dutch company, holds a significant position in the ALD market. Renowned for its ALD equipment, ASM International plays a vital role in semiconductor manufacturing by enabling precise and thin material layering on wafers. This technology is essential for advanced chip production, impacting various industries. Its role emphasizes the impact of export controls on crucial semiconductor processes and global technology supply chains.

The regulations, driven by national security concerns, cover tools vital for producing memory chips, processors, and sensors. Chinese chipmakers have reportedly accelerated purchases of equipment ahead of the rules taking effect. China's responses include its own export curbs and efforts to bolster domestic semiconductor capabilities. The situation reflects the evolving landscape of technology export controls and their impact on international supply chains.

Source:

Netherlands' chip tool export controls take effect: 4 things to know - Nikkei Asia

ALD (Atomic Layer Deposition) | ASM

TRION Battery and Forge Nano Partner to Advance Lithium-Ion Battery ALD Tech

TRION Battery Technologies and Forge Nano have teamed up to revolutionize lithium-ion battery performance. This strategic partnership combines Forge Nano's Atomic Layer Deposition (ALD) coating technology with TRION's innovative SX-silicon materials to enhance batteries for aerospace, defense, and other high-demand markets.

TRION Battery Technologies and Forge Nano have signed a Memorandum of Understanding (MoU) to jointly develop lithium-ion battery solutions. This collaboration marks the beginning of a journey toward improved battery performance.

Forge Nano's ALD material coatings have shown significant improvements on various battery electrode materials. The partnership aims to achieve similar breakthroughs by combining these coatings with TRION's SX-silicon materials. TRION's SX-silicon has successfully overcome challenges associated with silicon use in batteries, achieving impressive milestones.

This partnership caters to demanding markets like defense, aerospace, and electric mobility. As batteries become vital in these sectors, the collaboration promises to showcase the strengths of both technologies.

The partnership accelerates TRION's SX-silicon commercialization strategy, reinforcing its value proposition to cell manufacturers. Forge Nano sees the partnership as aligning with their target markets and aims to establish a strong US supply chain.

The MoU outlines joint testing of ALD coatings on TRION's SX-silicon. The partnership aims to extend battery life, improve energy density, and enhance overall safety and efficiency in lithium-ion batteries.

TRION Battery and Forge Nano's partnership is set to reshape lithium-ion battery technology. By combining their expertise and materials, they're on a path to enhance battery capabilities for critical industries. This collaboration demonstrates the potential of synergy in driving technological advancement

TRION Battery Technologies and Forge Nano are poised to revolutionize lithium-ion battery safety and performance through their strategic collaboration. Integrating Forge Nano's advanced Atomic Layer Deposition (ALD) technology, known as Atomic Armor®, with TRION's innovative SX-silicon materials, the partnership aims to enhance battery capabilities for aerospace, defense, and beyond. By creating protective ALD coatings on electrode surfaces, they prevent degradation, improve heat dissipation, and mitigate reactivity during thermal runaway. This innovative approach not only promises higher performance but also addresses critical safety concerns, solidifying their position as pioneers in the realm of advanced battery technology.

ATOMIC LAYER DEPOSITION FOR AUTOMOTIVE BATTERIES - Forge Nano.