Showing posts with label CMCFabs. Show all posts
Showing posts with label CMCFabs. Show all posts

Wednesday, March 24, 2021

Intel is spending $20 billion to build two new chip plants in Arizona

Intel announced on Tuesday that it will spend $20 billion to build two major factories in Arizona. The news comes amid a worldwide chip shortage that is snarling industries from automobiles to electronics and worries the U.S. is falling behind in semiconductor manufacturing. The announcement signals that Intel will continue to focus on manufacturing.

Next chance to get deep insights to Intel quality demands and advanced metrology & analytic for the material supply chain will be at the CMC2021 Conference, broadcasted from San Diego, USA, APril 14-15:

KEYNOTE : Jeanne Yuen-Hum, Vice President of Manufacturing & Operations, and Director of Global Supply-Chain Quality & Reliability, Intel Corporation "The Cost of Quality"

Alex Tregub, PhD Staff Engineer Intel Corporation "From Egyptian Royal Cubit to SEMI Guides for CMP consumables – Industry Standards"

Thursday, March 18, 2021

Get your ALD-VIP Coupon Code for The Critical Materials Conference CMC2021, 14-15 April 2021

Hey ALD Folks The Critical Materials Conference CMC2021, 14-15 April is coming up with some really powerful guest that will give you deep insights beyond the typical ALD conference offering on topics lie the semiconductor and global economics, Logic Foundry High Volume Manufacturing, Cost of Quality, Metrology and Big Data Machine Learning and Data Crunching for Plasma ALD.

ALD-VIP Coupon Code: Connect2Techcet-75

Carefully selected and invited talks for the ALD-community!
  • Keynote: Jeanne Yuen-Hum, Vice President of Manufacturing & Operations, and Director of Global Supply-Chain Quality & Reliability, Intel Corporation on "The Cost of Quality"
  • G. Dan Hutcheson & Risto Puhakka, CEO & President, VLSI Research Post Pandemic – Semiconductor Industry Trends, Chaos or Order?
  • David Thompson, PhD, Managing Director, Chemistry & Device Materials, Applied Materials Maximizing Chemical Utilization & Quality in Precursor Delivery
  • Lian-Chen Chi 紀良臻, PhD, Nano-Materials Center Manager, TSMC Materials Quality vs. Technology Ing. Kutup Kurt, PhD, Head of Data Science, MERCK EMD/Versum Power of Hybrid Approach for Data-driven Process Optimization in Semiconductors Industry
  • Hugh Gotts, PhD, International Fellow, Air Liquide ALD & CVD Precursors Metrology and Analytics Trends- Driving toward PPQ
  • Tsuyoshi Moriya, PhD, MBA, VP Advanced Data Planning, Corporate Innovation Division, TEL The Impact of Machine Learning on Processes & Materials

As a bonus the 1st day we will have a virtual round table discussion on Materials Roadmaping in the industry. All participants are welcome to join.

Conference web for registration and agenda: https://cmcfabs.org/agenda-2021/



Friday, November 6, 2020

Refreshing Material Advances for Logic, Memory, and Packaging5th CMC Conference "After-Hours" Available up to December 11

How to keep semiconductor fabs supplied with critical materials despite a pandemic and trade wars was discussed by >250 industry experts gathered in virtual space October 21-22 during the 5th annual Critical Materials Council (CMC) Conference. CMC Fab Members and Associate Supplier Members were joined by leading industry analysts, educators, and investors in discussing business and technology trends in the value-chain for advanced packaging, logic, and memory. The "after-hours" virtual conversations will continue through December 11th using the conference app and website, and new people can join in through November 16th.

"There were a lot good topics especially on materials challenges for leading edge technology and heterogeneous integration, global issues on material supplies, and emerging materials development," commented Dr. Lihong Cao, Director of Engineering and Technical Marketing at ASE, and Session 4 presenter.



Dr. Lauren Link of Intel discussed the need to find ways to integrate more front-end fabrication materials into packaging. The challenge is doing so in a cost-effective manner, without over-specifying materials and process requirements.

CMC-Oregon-Header

5th Annual CMC Conference "After-hours" Starting Now!

Didn't Catch the Conference "Live"? No Worries! Register Today and Get Access to the recordings, Connect attendees, Engage in Q&A!

Registration Open until November 16

Access Presentations thru December 12

Tuesday, April 28, 2020

CMC Workshop Flags Looming Shortages of IPA and Sulfuric Critical Materials

Council (CMC) of semiconductor fabricators & suppliers is now meeting several times a month to mitigate potential supply-chain disruptions. The last meetings exposed likely shortages in iso-propyl alcohol (IPA) and sulfuric acid looming just over the business horizon due to the COVID-19 pandemic. The CMC has now opened attendance at monthly COVID-19 Briefings and Virtual Workshops to pre-registrants for the 2020 CMC Conference, happening October 22-23 in Hillsboro, Oregon. 
Fabs and suppliers say that the supply-chain for semiconductor-grade IPA has capacity to meet current global requirements (Figure). 
However, due to COVID-19, some of the industrial IPA supply-chain is re-directed to healthcare and consumer distribution, increasing overall demand. Spot prices for this critical material have reportedly increased a staggering 30% month-over-month (MoM). IPA depends on propene feedstock from oil refiners, and the current economic slowdown has reduced oil demand to such an extent that refineries are being idled. TECHCET has put up "cautionary flags" to watch for 2H20 shortages of IPA and sulfuric acid, as per the latest quarterly update to TECHCET's Wet Chemicals & Specialty Cleans analysis.

ABOUT TECHCET: TECHCET CA LLC is an advisory service firm focused on process materials supply-chains, electronic materials technology, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the Critical Material Reports™ for the Critical Materials Council (CMC), covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about these reports or CMC subscription membership please contact info@techcet.com, +1-480-332-8336, or go to www.techcet.com

Wednesday, December 18, 2019

2020 CMC Conference New Session on Advanced Packaging Materials - CHIPS & EMIB for SiP




San Diego, CA, December 17: The Critical Materials Council (CMC) of semiconductor fabricators and TECHCET announce a new addition to the 2020 CMC Conference

Advanced Packaging Materials. Scheduled for April 23-24 in Hillsboro, Oregon, the 5th CMC Conference, will explore actionable technical and value-chain trends of critical materials for global semiconductor fabs and feature keynotes from leaders in semiconductor technology and materials. The conference keynote address this year will be:

"Critical Materials Pushing the Limits for Semiconductor Manufacturing"
by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp.

Sessions will cover: 
I. Global Value-chain Issues, Including Economics and Regulations,
II. Immediate Challenges of Materials & Manufacturing,
III. Emerging Materials in R&D and Pilot Fabrication, and
  New this year is a fourth session,
IV. Advanced Packaging Materials

Lead by Session Chairman Jim Hannah, Product Development and Applications Manager of SEH, the Advanced Packaging Materials Session will address, system level performance scaling issues and the increased reliance on packaging. As explained by Mr. Hannah, “We see the lines starting to blur between packaging and the back-end wiring on-chip. The CMC Conference will cover both current challenges and future requirements of packaging materials needed to support this middle-ground."

A keynote address on “The Future of Silicon as a Packaging Material" for this new session will be provided by Dr. Subramanian Iyer, principle of UCLA’s Center for Heterogeneous Integration and Performance Scaling (CHIPS) consortium, IEEE Fellow, IBM Fellow, IIT Distinguished Alumnus, and UCLA Distinguished Chancellor's Professor of both Electrical and Computer Engineering and Materials Science and Engineering.


Dr. Lauren Link, Intel's Technical Program Manager, Substrate Business Group, will present on materials to enable Embedded Multi-die Interconnect Bridge (EMIB) connections between silicon chiplets in advanced Heterogeneous Integration (HI) System-in-Package (SiP) products.

CMC member companies will be attending the public CMC Conference, which follows the annual members-only CMC meeting to be sponsored by Intel and held April 21-22. Conference attendees will include industry experts handling supply-chains, business-development, R&D, and product management, as well as academics and analysts. Business drives our world, but technology enables the profitable manufacturing of semiconductor devices and facilitates the introduction of new materials.

To submit a paper for consideration, send a 1-page abstract focusing on critical materials supply dynamics by January 15, 2020 to

For more information and registration:


 For more information on CMCFabs or CMC Associate Memberships, please contact Diane Scott at dscott@techcet.com. For information on sponsoring the CMC Conference please contact Yvonne Brown at ybrown@techcet.com, +1-480-382-8336 x1.

CMC Fab members include:


Copyright 2019 TECHCET CA LLC all rights reserved

Wednesday, May 8, 2019

4th CMC Conference Enabled Critical Information and Connections

Fab materials event in Albany, New York area April 25-26 featured GlobalFoundries keynote and Intel and TI presentations. Plan now for the 2020 April 23-24 event in Hillsboro, Oregon. 

(SAN DIEGO (PRWEB) May 07, 2019) Over 150 leading executives and managers within the semiconductor manufacturing ecosystem gathered on April 25th and 26th in the Albany area of New York state for an important event on fabrication (fab) materials. The fourth-annual Critical Materials Council (CMC) Conference, produced by TECHCET, included topical presentations, a fab tour, exhibits by specialty materials suppliers, and networking roundtable discussions to learn about best-practices in a pre-competitive environment. Folks who missed attending the event this year can register to access the posted presentations for a nominal fee at https://cmcfabs.org/cmc-conference-2019/.

The event opened again, as in each of the prior three years, on an extremely strong business and technology keynote address by an executive from one of the CMC Fab member companies. The 2019 CMC Conference keynote was given by Dr. John Pellerin, Deputy CTO and VP of Worldwide R&D, GlobalFoundries. Pellerin talked about how demand for new high-volume manufacturing (HVM) semiconductor devices over the next few years will drive needs for increased numbers of new specialty materials as well as volumes of existing materials in his presentation on "Materials Challenges & Opportunities in Differentiated Technologies."

In the first session of the event covering global supply-chain issues of economics and regulations, G. Dan Hutcheson, CEO of VLSI Research, presented on "Slowdown: When did it start? What drove it? And When will the recovery come?" Hutcheson showed data from leading economic indicators that the recent decline in global semiconductor fab industry revenues due to memory chip prices may have already turned around.

TECHCET Sr. Analysts Dr. Jonas Sundqvist and Terry Francis presented updated information on demand drivers and forecasts for ALD/CVD precursors and Rare Earths, respectively. Sundqvist--also leader of the Thin Film Technologies Group at Fraunhofer IKTS--focused on how new 3D memory and logic chips demand more deposition precursors such that chemical volume growth will outpace that of silicon wafers, shown in the Figure. Francis showed how "Rare Earth" elements are not so rare at the elemental level, but complex dynamics between mining and refining and capitalism have led to a situation where mainland China currently controls most of the market for elements such as lanthanum (used in advanced ICs to create CMOS logic gates). Deep dives into all such materials matters are found in the TECHCET Critical Materials Reports (CMR), and you can find all of them online at https://techcet.com/shop/

Global semiconductor silicon quarterly wafer shipments 2015-2019 in millions of square inches (MSI). (Source: TECHCET)
The 2020 spring CMC Conference is scheduled for April 24-25 in Hillsboro, Oregon. The CMC Fab members and Associate members will again gather for two days of private face-to-face meetings before attending the public CMC Conference.

In addition to the annual spring CMC Conference in the US, there is also an annual fall CMC Seminar in Asia. The 2019 CMC Seminar will be held on October 17 in Taoyuan, Taiwan. For more information on CMC events see https://techcet.com/cmc-events/.

About CMC:
The Critical Materials Council (CMC) of Semiconductor Fabricators (CMCFabs.org) is a membership-based organization that works to anticipate and solve critical materials issues in a pre-competitive environment. The CMC is a business unit of TECHCET, and includes materials supplier Associate Members.

About TECHCET:
TECHCET CA LLC is an advisory services firm focused on process materials supply-chains, electronic materials business, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports™, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about reports, market briefings, CMC membership, or custom consulting please contact info(at)cmcfabs(dot)org, +1-480-332-8336, or go to http://www.techcet.com or http://www.cmcfabs.org.

Wednesday, April 10, 2019

In 2-Weeks: 2019 CMC Conference Highlights ALD/CVD Market and Technology Trends


In 2-Weeks: 2019 CMC Conference Highlights ALD/CVD  Market and Technology Trends 

 The upcoming CMC Conference, April 25-26, in Saratoga Springs, New York, will feature the latest forecasts on market drivers, trade issues, and technical issues facing precursors and other global materials supply-chains.  As shown below, CAGR for metal precursors is expected to exceed 11% through 2021.  Technology and Market Trends on atomic layer deposition (ALD) and chemical vapor deposition (CVD) precursors for IC fabs will be presented and discussed at this year's conference.

The Emerging Session will include: 
  • Dr. Jonas Sundqvist, Sr. Technology Analyst of TECHCET and Group Leader of Fraunhofer Institute will be revealing TECHCET's "Market and Technology Trend Forecasts for ALD & CVD Metal and Dielectric Precursors." (Sample shown below.) 
  • Dr. Matthew Stephens, VP of Sales and Product Management for Air Liquide, will provide a presentation on "Economic Considerations of ALD Precursor Selection."
  • Dr. David Thompson, Managing Director of Chemistry for Applied Materials, will present on "Preparing Supply-Chains and Managing Risk for an Uncertain Future on Emerging Devices."
  

Deputy CTO & VP of Worldwide R&D, GlobalFoundries  
 "Materials Challenges & Opportunities in Differentiated Technologies" 

 
3-Dynamic Sessions:
  1. Global Materials Supply-Chain and Market Issues
  2. Immediate challenges of materials & manufacturing 
  3. Emerging materials in R&D and pilot fabrication
Register now by clicking on the links, above, or go to: https://cmcfabs.org/cmc-conference-2019/

The public CMC Conference follows private CMC face-to-face meetings to be held April 23-24, 2019 at GlobalFoundries in Malta, New York.

Look Who's Coming - leading fabs, equipment & materials companies:
·        Samsung
·        Texas Instruments
·        GlobalFoundries
·        TowerJazz Panasonic
·        KFMI
·        Fraunhofer
·        Wonik
·        Ereztech
·        Matheson/TNSC
·        Linde
·        Inpria
·        IMEC
·        VLSI Research
·        SACHEM
·        Niacet
·        Grikin
·        Aveni
·        Silar Labs
·        ATI Metals
·        Momentive
 
·  STMicroelectronics
·  ON Semiconductor
·  Broadcom
·  TEL Technology Cntr
·  Umicore
·  Kinik
·  Revera/Nova
·  TECHCET
·  Strem Chemicals
·  Grikin
·  ATI Metals
·  Cryoin
·  MGC Pure Chemicals
·  Electronic Fluorocarbons
·  ShinHao Materials
·  Applied Seals
·  Peroxychem
·  Messer
·  MPD Chemicals
·  Mott Filters

·        Intel
·        Micron
·        Cypress
·        3M
·        IBM
·        Entegris
·        Air Liquide
·        Versum Materials
·        Air Products
·        Greene Tweed
·        Eastman
·        GrandiT
·        Edwards Vacuum
·        Mega Fluid Systems
·        Zing Semiconductor
·        Schrodinger
·        Boulder Scientific
·        Johnson Matthey
·        Veeco
·        ...and More!

2019 CMC Conference Sponsors: