2020 CMC Conference New Session on Advanced Packaging Materials - CHIPS & EMIB for SiP

San Diego, CA, December 17: The Critical Materials Council (CMC) of semiconductor fabricators and TECHCET announce a new addition to the 2020 CMC Conference:  Advanced Packaging Materials. Scheduled for April 23-24 in Hillsboro, Oregon, the 5th CMC Conference, will explore actionable technical and value-chain trends of critical materials for global semiconductor fabs and feature keynotes from leaders in semiconductor technology and materials. The conference keynote address this year will be: "Critical Materials Pushing the Limits for Semiconductor Manufacturing" by Bruce Tufts, Vice President of Technology and Director of Fab Materials Organization, Intel Corp. Sessions will cover:  I. Global Value-chain Issues, Including Economics and Regulations, II. Immediate Challenges of Materials & Manufacturing, III. Emerging Materials in R&D and Pilot Fabrication, and   New this year is a fourth session, IV. Advanced Packaging Materials Lead by Session Chairman Jim Hannah, Product Development and Applications Manager of SEH, the Advanced Packaging Materials Session will address, system level performance scaling issues and the increased reliance on packaging. As explained by Mr. Hannah, “We see the lines starting to blur between packaging and the back-end wiring on-chip. The CMC Conference will cover both current challenges and future requirements of packaging materials needed to support this middle-ground." A keynote address on “The Future of Silicon as a Packaging Material" for this new session will be provided by Dr. Subramanian Iyer, principle of UCLA’s Center for Heterogeneous Integration and Performance Scaling (CHIPS) consortium, IEEE Fellow, IBM Fellow, IIT Distinguished Alumnus, and UCLA Distinguished Chancellor's Professor of both Electrical and Computer Engineering and Materials Science and Engineering.

Dr. Lauren Link, Intel's Technical Program Manager, Substrate Business Group, will present on materials to enable Embedded Multi-die Interconnect Bridge (EMIB) connections between silicon chiplets in advanced Heterogeneous Integration (HI) System-in-Package (SiP) products. CMC member companies will be attending the public CMC Conference, which follows the annual members-only CMC meeting to be sponsored by Intel and held April 21-22. Conference attendees will include industry experts handling supply-chains, business-development, R&D, and product management, as well as academics and analysts. Business drives our world, but technology enables the profitable manufacturing of semiconductor devices and facilitates the introduction of new materials. To submit a paper for consideration, send a 1-page abstract focusing on critical materials supply dynamics by January 15, 2020 to  cmcinfo@techcet.com For more information and registration: cmcfabs.org/cmc-conference-2020

For more information on CMCFabs or CMC Associate Memberships, please contact Diane Scott at dscott@techcet.com. For information on sponsoring the CMC Conference please contact Yvonne Brown at ybrown@techcet.com, +1-480-382-8336 x1.

CMC Fab members include:

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