Saturday, February 24, 2018

CMC Conference 2018 - a Critical Event for Semiconductor Materials

Critical Event for Semiconductor Materials
CMC Conference Update
This year's Critical Materials Conference features: 
Keynote Speaker: David Bloss, VP, Technology and Manufacturing Group Director, Lithography Technology Sourcing, Global Supply Management, Intel Corporation, presenting 
"Patterning Challenges and Fab Materials for Future ICs"
Also Featuring:   
  • Glen Wilk, VP, ALD Products, ASM
    • "ALD Materials Integration Challenges"
  • Risto Puhakka, President, VLSI Research
    • "OEM Markets and Materials Trends"
  • Michelle Garza, Sr. R&D Chemist, Fujimi
    • "Cobalt CMP Post Cleans; Wet Cleans Compatibility"
  • Ken Unfried, Sr. Technologist, Linde
    • "Neon and Xenon Recycling"
  • Dave Thompson, Director, Applied Materials
    • "Ruthenium Integration"
and the popular Not-so-unusual Round Table Session - a highly differentiated program, with networking opportunities for all attendees. 
The CMC Conference provides:
* Updates on market dynamics and regulations
* Trends in the profitable control of all fab materials
* Technology forecasts for future critical materials

Register now for the early-bird rate of $375 by March 15th:
Click here for the updated agenda
Schedule Details:
Welcome Reception April 25th evening
Sessions I & II, April 26th
Session III, April 27 morning 
Welcome reception, lunch on 26th & coffee/tea breaks are included.

The conference follows the CMC Fabs F2F meeting (on April 24-25) and CMC Members only (Associates and Fabs) Joint Session (on April 25, 2-5pm), located nearby at NXP. For more information about these meetings and/or the Conference, please contact Meena Sher by email by clicking here.
Early-Bird Registration by March 15
Standard Price $450

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