If
you are interested in the latest patterning technology you should read
this excellent online publication by Ken Nawa at the Process Integration
Center, Tokyo Electron. Tokyo Electron is one of the top supplier for
wafer based advanced etch, deposition and clean (and more) tools for the
semiconductor industry. Besides the evolution of semiconductor by
scaling technology, he covers all the latest advanced technologies:
- Introduction of advanced patterning technology and challenges
- SADP – Scaling by thin film formation on sidewall
- SAQP – Scaling by extending SADP technology
- SAB – Scaling by etch selectivity to multiple materials
Full article: LINK
(screen dump form tel.com)
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