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IBM and Tokyo Electron (TEL) have renewed their long-standing semiconductor research partnership with a new five-year agreement focused on advancing next-generation semiconductor nodes and chiplet architectures tailored for the demands of generative AI. Building on more than 20 years of collaboration, the companies aim to leverage their complementary strengths—IBM’s semiconductor process integration and TEL’s advanced manufacturing equipment—to develop breakthroughs in performance and energy efficiency, including new approaches to 3D chip stacking and patterning with High NA EUV lithography.
"IBM and Tokyo Electron have built a strong relationship of trust and innovation through years of joint development. We are excited to continue to build on our long-standing partnership with IBM for another five years. This renewed agreement underscores our mutual commitment to advancing semiconductor technologies, including patterning processes with High NA EUV." said Toshiki Kawai, Representative Director, President & CEO Tokyo Electron Limited. "Our collaboration at the has been instrumental in driving innovation, and we look forward to continuing this journey together."
The partnership is anchored at the Albany NanoTech Complex, a world-leading semiconductor R&D ecosystem operated by NY CREATES. This collaboration has already played a key role in positioning the site as the National Semiconductor Technology Center’s EUV Accelerator. IBM and TEL will continue joint research at Albany, accelerating U.S. leadership in chip innovation and enabling critical infrastructure for the generative AI era.
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