Saturday, December 17, 2022
ALD Stories Podcasts by Tyler Myers
Kokusai Electric relies on patterned 3D substrates in thin film process metrology from Chipmetrics
Friday, December 16, 2022
MIT.nano adds new instruments to create and analyze at the nanoscale from Arradiance
Friday, November 25, 2022
Applied Materials Delivers Strong FY 2022 Numbers including Picosun ALD
LINK: https://ir.appliedmaterials.com/
The company’s uniquely enabling technology and growing installed base will be its key growth drivers as chipmakers accelerate ramping up of new process nodes in R&D for high-volume manufacturing.
Key developments in FY 2022
- Applied Materials acquired Picosun, a Finland-based innovator in atomic layer deposition (ALD) technology. This acquisition broadens Applied’s product portfolio and puts it in a great position to capture a large portion of the specialty semiconductor market in the coming years.
- Collaboration with the Institute of Microelectronics (IME), a research institute under Singapore’s Agency for Science, Technology and Research (A*STAR). IME’s strategic R&D capabilities complement well Applied’s expertise in advanced packaging solutions and will accelerate material, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.
- Introduced new Ioniq™ PVD system to solve wiring resistance challenges of 2D scaling. This new integrated solution offers a significant reduction in electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power.
- Semiconductor Systems revenue increased 15% YoY in FY 2022 to $18,797 million on account of strong orders as customers continued to invest in next-generation technology.
- Applied Materials’ service revenue increased 11% YoY in FY 2022 to $5,543 million, accounting for 21% of the annual net revenue.
- Display and Adjacent Markets revenue decreased 19% YoY in FY 2022 to $ 1,331 million.
- Non-GAAP gross margin was at 46.6% in FY 2022.
- Non-GAAP operating profit grew by over 7% to $7.86 billion.
- Non-GAAP EPS increased nearly 13% to $7.70.
- Total ending backlog increased 62% to $19 billion with Semiconductor Systems backlog increasing 90% to nearly $12.7 billion and services backlog increasing 30% to over $5.6 billion.
- The company generated about $5.4 billion in operating cash flow and over $4.6 billion in free cash flow.
- The company’s installed base grew 8% YoY in FY 2022.
- The number of tools under comprehensive, long-term service contracts grew 16% YoY with the over 90% renewal rate for these agreements demonstrating the value customers see in subscription services.
- New export regulations for US semiconductor technology sold in China reduced Semiconductor Systems and AGS fourth quarter revenue by approximately $280 million.
Tuesday, November 8, 2022
Recent ALD news on shared on Twitter #ALDep
Area Selective ALD of Ruthenium #ALDep #ASDep https://t.co/LInkrCfXNf
— Jonas Sundqvist 🐳 (@jv3sund) November 7, 2022
TOPCon solar cell achieves 24.2% efficiency via new plasma-assisted atomic layer deposition tech from Nantong University, China#ALDep #solar #solarcell #china #photovoltaic https://t.co/VjMBvz8Ib0
— Jonas Sundqvist 🐳 (@jv3sund) November 7, 2022
Researchers at the @HelsinkiALD are developing thin films needed in new types of halide perovskite solar cells, and matching #ALDep processeshttps://t.co/JzBSalKiuN pic.twitter.com/tWv4WMAgvA
— Jonas Sundqvist 🐳 (@jv3sund) November 4, 2022
University of Erlangen demonstrate sALD of Crystalline Metal–Organic Framework Thin Films (MOFs)#ALDep #MOFs https://t.co/cUgGOWkJjl pic.twitter.com/B1l0S4qQM7
— Jonas Sundqvist 🐳 (@jv3sund) November 4, 2022
Abstract submission is now open for the AVS 23rd International Conference on Atomic Layer Deposition (#ALD2023) and the 10th International Atomic Layer Etching Workshop (#ALE2023). Deadline: Feb. 15, 2023. https://t.co/QvY8bu8KPp #ALDep #ALEtch @AVSALD https://t.co/x2MrKttxk9 pic.twitter.com/BgYxx19FHK
— AVS (@AVS_Members) November 2, 2022
SparkNano Raises EUR 5.5M to Scale Spatial Atomic Layer Deposition for Energy Applications in a round led by ALIAD Venture Capital by Air Liquide
SparkNano Raises EUR 5.5M to Scale Spatial Atomic Layer Deposition for Energy Applications in a round led by ALIAD Venture Capital by Air Liquide.
SparkNano - LINK (linkmagazine.nl)
Friday, November 4, 2022
ALD coatings for next-generation solar cells
Members of the research group next to the ALD reactor. Georgi Popov (left), Marianna Kemell, Alexander Weiss and Mariia Terletskaia. (Image: Riitta-Leena Inki)
“As these new types of solar cells can be transparent, they can be installed in, for example, windows. They are also flexible, which increases their uses,” says Senior University Lecturer Marianna Kemell, who heads the research project funded by the Academy of Finland.
“We identified suitable chemicals and were able to design a reaction that enabled us to create a metal iodide coating through deposition for the first time. We were able to demonstrate that this can actually be done through atomic layer deposition. The first successful trial was carried out with lead iodide, which was then processed into CCH₃NH₃PbI₃ perovskite through a further reaction,” Popov says. “The research article was published in the refereed Chemistry of Materials scholarly journal. Later on, we also developed ALD processes for caesium iodide and CsPbI₃ perovskite.”
“If at some point we start making tandem solar cells, which combine a silicon cell and a perovskite cell, we know how to make that perovskite. We are developing the recipes and the chemistry used to grow perovskite,” Popov says.
“The current plants manufacturing solar cells in China and elsewhere are able to adjust their equipment to produce ALD-coated solar cells,” says Popov.
“We are developing the future technical solutions that will gradually replace and supplement current production. In the future, fewer resources will be needed for production, and, thanks to increasingly effective cells, less surface area as well. When solar cells can be installed on uneven surfaces in addition to even ones, we no longer need to build solar parks in fields, as fields are needed for other purposes,” Popov notes.
“The best part of silicon-based cells is that they last roughly 20 to 30 years and will continue to function even after that, albeit possibly less efficiently. Since solar cells produced with the PERC technique are the current state of the art, and they are available, it is advisable to acquire as many of them as possible. They will pay for themselves,” Senior University Lecturer Kemell says.
Samsung use NCD ALD for wirebonding alternatives to expensive Gold
University of Erlangen demonstrate sALD of Crystalline Metal–Organic Framework Thin Films (MOFs)
Solution Atomic Layer Deposition of Smooth, Continuous, Crystalline Metal–Organic Framework Thin Films
Chem. Mater. 2022, XXXX, XXX, XXX-XXX
Publication Date:November 2, 2022
https://doi.org/10.1021/acs.chemmater.2c01102
Monday, October 10, 2022
Samco launches new ICP Tornado Plasma ALD system
“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.
NCD’s ALD technology and equipment for oxidation barrier of copper-based substrates
Copper is a metal used widely as the main material of Printed Circuit Board (PCB) and Lead Frame. But it is required to protect the oxidation because copper is easily oxidized in the condition of humidity, temperature, and pH, etc.
Electroless Nickel Immersion Gold (ENIG), Organic
Solderability Preservative (OSP), Immersion Sn or Ag (ImSn or ImAg) is
generally used to prevent oxidation of opened copper area after Solder Masking
in PCBs. The lead Frame is protected from oxidizing by plating Au, Ag, Pd, and Ni
after Lead Frame forming.
Recently, many groups have studied about preventing
oxidation on the surface of copper by various corrosion protection layers of
ALD metal oxides. Especially, Appling Al2O3 layer to the oxidation barrier is
actively being researched.
< Surface images and TEM & EDS of Cu plates coated by ALD thin films after annealing test >
After depositing Al2O3 layers on Cu-plated plates with various film thicknesses and process temperatures, the oxidation and corrosion behavior of the coated copper was examined with different annealing times in the oven. There was no oxidation before annealing, but after annealing for 1hr, as the sample’s thickness lowered and process temperature decreased, the oxidation happened and increased gradually. There was no oxidation on the plates coated with 50~60 ALD cycles and at process temperatures of 70~100℃ after annealing for 5hr, and oxidation didn’t occur only in the case of 60 cycles and 100℃ after annealing for 24hr.
To analyze the change of the structure and confirm the oxidation
behavior, TEM and EDS were measured on 5 and 10nm Al2O3 coated Cu plates at 100℃.
The results showed that a thick Cu oxide layer was built by combining Cu coming
out through the 5nm Al2O3 layer and outer oxygen after annealing.
On the other side, in the case of depositing 10nm Al2O3 film,
the ALD layer was maintained after annealing, so Cu oxide layer wasn’t built on the
surface. Therefore it confirmed that 10nm ALD Al2O3 layer showed an excellent
corrosion barrier.
< ALD equipment for Lead Frame and PCB >
Copper-based PCBs and Lead Frames for semiconductors may have great properties to prevent humidity and oxygen by ALD-coated corrosion barriers.
NCD has high volume and large area ALD equipment and
technology for this kind of application. ALD tools for Lead Frames could be
used by adding a dedicated transfer module on the base of Lucida GSH Series. And
NCD has been developing new ALD equipment, Lucida GP Series, for large and
flexible PCB substrates. NCD would extend the new ALD application area continuously
through constant R&D.
Source:
http://www.ncdtech.co.kr/2018/bbs/board.php?bo_table=eng_board_05&wr_id=57
Wednesday, October 5, 2022
Ascent Funds Invests in Forge Nano Atomic Armor for Lithium-Ion Batteries & Hydrogen Fuel Cells
Tuesday, October 4, 2022
ASM International has completed the acquisition of Italian Silicon Carbide Equipment Manufacturer LPE S.p.A.
Thursday, September 29, 2022
The Semiconductor Climate Consortium founded by SEMI and memebers
Global fab equipment spending is expected to increase 9% YOY to a new all-time high of US$99 billion in 2022

Wednesday, September 28, 2022
ALD Enabling Quartz Part Recycling for Semiconductor Processing Equipment
Monday, September 26, 2022
Wafer scale microwire (TMW) solar cell with 21.1% efficiency using NCD ALD tool (Lucida D200)
Crystalline silicon TMW solar cells are considered a potential alternative to conventional solar cells as these devices require thinner silicon wafers instead of the industry standard 160 µm thick wafers. “This could reduce manufacturing capital expenditure by 48% and module cost by 28%,” the Korean group claims.
A 10 nm-thick Al2O3 passivation layer was deposited on the front side of the wafer using ALD (Lucida D200, NCD) as reported in the publication below.
Choi, D., Hwang, I., Lee, Y., Lee, M., Um, H. D., & Seo, K. (2022). Wafer‐Scale Radial Junction Solar Cells with 21.1% Efficiency Using c‐Si Microwires. Advanced Functional Materials, 2208377.
The new Girard Perregaux Tourbillon with Three Flying Bridges Bucherer BLUE coloured by Atomic Layer Deposition
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Meet Atlant3D Technologies with CEO Maksym Plakhotnyuk
Bottom-up PEALD of SiO2 by growth inhibition for seamless gap-fill process
Bottom-up plasma-enhanced atomic layer deposition of SiO2 by utilizing growth inhibition using NH3 plasma pre-treatment for seamless gap-fill process
AlixLabs proudly announce its Advisory Board
Atomic Layer Deposition (ALD) - Compound Semiconductor magazine interview with Beneq
Richard Stevenson, Editor of Compound Semiconductor magazine, talks to Mikko Söderlund, Beneq's Head of Sales for its Semiconductor ALD Business Unit, about the phenomenal interest in this sector.
Thursday, September 22, 2022
Oxford Instruments and ITRI report GaN HEMT device performance by ALD and ALE
GaN HEMT device performance - Oxford Instruments and ITRI announce breakthrough development in GaN HEMT device performance

Monday, September 19, 2022
New 2022 Critical Materials Reports from TECHCET
Sunday, September 18, 2022
Imec´s sustainable-semiconductor program is a success right away!
- Less than a year after its official launch, some of the leading consumer electronics and semiconductor manufacturing players have signed up as partners in imec’s program for Sustainable Semiconductor Technologies and Systems (SSTS).
- Apple joined the program Apple joins Imec's new Sustainable Semiconductor research program | iMore
- The program assesses the environmental impact of new technologies, identifies high-impact problems, and defines semiconductor manufacturing solutions with less environmental impact.
- In this way, the program gathers the semiconductor value chain to jointly target net-zero emissions for chip manufacturing.
- One good reason for success is most probably that Lars-Åke Ragnarsson from Sweden is the program director of sustainable semiconductor technologies and systems (SSTS) at imec.
Samsung to focus on treatment of gas used in chip production to achieve net-zero emissions
"Treatment of gas used to manufacture semiconductor chips is our biggest focus in our spending (to achieve net-zero emissions)," Song Doo-guen, executive vice president and head of the Environment & Safety Center at Samsung Electronics, told reporters at a briefing in Seoul.
- Samsung has pledged a 7 trillion won ($5 billion) investment to achieve its climate ambitions, and announced that it had recently joined RE100, a coalition comprising 380 global enterprises committed to becoming 100 percent renewable.
- Alongside the plan to cut direct carbon emissions, Samsung has also laid out a raft of plans to reduce indirect emissions, mainly by pursuing ultralow-power chip products.
- Other eco-conscious plans it has drawn up include capping the maximum use of freshwater to 300,000 tons a day by 2030 and eradicating gaseous and liquid pollutants by 2040 with treatment technology.
Inside TSMC, the Taiwanese chipmaking giant that’s building a new plant in Phoenix
“This project is designed as a 5 nm fab. Actually, it’s a copy from the fab we have in Taiwan,” Chen said.
We got an exclusive tour inside Taiwanese chipmaking giant TSMC's $12 billion fabrication plant outside Phoenix, Arizona. Watch the full video here: https://t.co/00keVTCxah pic.twitter.com/JV2ceg6l6v
— CNBC (@CNBC) September 17, 2022