Tuesday, October 23, 2018

Imec and ASML Enter Next Stage of EUV Lithography Collaboration

Intensified collaboration will advance high-volume production with current EUV lithography and develop future EUV systems

LEUVEN (Belgium) & VELDHOVEN (The Netherlands), OCTOBER 22, 2018 (LINK) —Today, world-leading research and innovation hub in nanoelectronics and digital technologies imec, and ASML Holding N.V. (ASML), the technology and market leader in lithographic equipment, announce the next step in their extensive collaboration. Together, they will accelerate the adoption of EUV lithography for high-volume production, including the current latest available equipment for EUV (0.33 Numerical Aperture, NA). Moreover, they will explore the potential of the next-generation high-NA EUV lithography to enable printing of even smaller nanoscale devices advancing semiconductor scaling towards the post 3 nanometer Logic node. To this end, they will establish a joint high-NA EUV research lab.

Imec and ASML have been conducting joint research for almost thirty years. In 2014, they created a joint research center, the Advanced Patterning Center, to optimize lithography technology for advanced CMOS integration and to prepare the ecosystem to support advance patterning requirements. Now, they bring this cooperation to the next stage with the installation of ASML’s most advanced and high-volume production dedicated EUV scanner (NXE:3400B) in imec’s cleanroom. Utilizing imec’s infrastructure and advanced technology platforms, imec and ASML researchers and partner companies can pro-actively analyze and solve technical challenges such as defects, reliability and yield, and as such accelerate the EUV technology’s industrialization.

Monday, October 22, 2018

Shaanxi Kuntech launch flexible semiconductor service manufacturing Base Project

OLED-Info reports: The press conference for the landing and launching of Shaanxi Kuntech Flexible Semiconductor Service Manufacturing Base Project was grandly held in West Fengxi New City, West Xian Xin New District, Shaanxi province on the morning of October 16, with its theme being Shinning Shaanxi and Shaping the Future World".

Kuntech is the first high-end enterprise in China that focuses on the development and autonomy of flexible semiconductors and advanced display technologies. It develops and actively accumulates intellectual property with the highest intensity focus technology, and achieves technology autonomy and freedom to operate. Facing the huge challenges of future display and semiconductor development, Kuntech Semiconductor continues to innovate and advance in the field of flexible semiconductor display through a series of revolutionary technologies.

It is reported that Shaanxi Kuntech flexible semiconductor service manufacturing base is a major science and technology industry project of Shaanxi Province, China. The total investment of the project is 6 billion USD. The project includes a world-class flexible semiconductor and display technology R&D certification center, a strong and complete flexible semiconductor and display industry chain, and the sixth-generation flexible AMOLED demonstration production line with its production capacity being 30K large substrates per month, featuring three major processes (array, AMOLED EL, flexible module). The size of the substrate is 1500mmx1850mm.
Full story : OLED-Info LINK

Saturday, October 20, 2018

HERALD 3rd ECI workshop: Science communication and mapping a future road for ECIs

[HERALD LINK] Specialized training in science communication and networking for the ECI members and guests, by Dr. Simon Elliott and Dr Fergus McAuliffe(open session)

  • What makes a good networker memorable?
  • How do they seem so carefree and engaging?
  • How do they keep the conversation going in those awkward moments of silence?
This hands-on interactive workshop focusses on our ability to communicate your research and work interests clearly and effectively across many audience types. We delve into body language and active listening to engage different audiences, in either group or networking situations. We share coping mechanisms to survive awkward or challenging interactions. Using theatre games and role-playing exercises, this workshop helps you distill your message, craft a short sharp pitch about what you do and provide you with the tools to keep conversation going.

- Group training session in RoadMapping the future of ALD research in Europe, working with the output of HERALD summit 2018 to find future roads for the ECI community
- Open ECI session, with focus on peer to peer interaction

Dates: 8 Nov 2018 to 9 Nov 2018
Address: Institute of Electrical Engineering SAS Bratislava Slovakia
URL: http://www.elu.sav.sk/en/contact/

Materials Matters (TM) topical issue on Atomic Layer Deposition

Here is a Materials Matters(TM) topical issue on Atomic Layer Deposition with interesting papers on ALD - especially the one on Group 11 metals. That is ALD of copper, silver and gold by Prof. Barry.

Materials Matters(TM) - Atomic Layer Deposition - Nanomanufacturing with ALD (LINK)
  • NANOCOMPOSITE COATINGS with Tunable Properties Prepared by Atomic Layer Deposition
  • SILICON NITRIDE ATOMIC LAYER DEPOSITION: A Brief Review of Precursor Chemistry
  • GROUP 11 THIN FILMS by Atomic Layer Deposition
  • FEW MONOLAYER ATOMIC LAYER DEPOSITION on Surfaces and Interfaces for Energy Applications

The 4th International Conference on ALD Applications & 2018 China ALD Conference

[www.c-ald.com] This week the 4th International Conference on ALD Applications & 2018 China ALD Conference was held  in Shenzhen, China, from October 14 to 17, 2018.

The four-day meeting was dedicated to the fundamentals and applications of Atomic Layer Deposition (ALD) technology in various fields.This conference will feature plenary sessions, oral sessions, poster sessions and industrial exhibitions.


Full contributed papers will be peer reviewed and published in a special issue Nanoscale Research Letters ((2018 impact factor: 3.125) https://nanoscalereslett.springeropen.com/aald

Samsung Electronics Starts Production of EUV-based 7nm LPP Process

[SAMSUNG news.samsung.com] Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology. The introduction of 7LPP is a clear demonstration of Samsung Foundry’s technology roadmap evolution and provides customers with a definite path to 3nm.

The commercialization of its newest process node, 7LPP gives customers the ability to build a full range of exciting new products that will push the boundaries of applications such as 5G, Artificial Intelligence, Enterprise and Hyperscale Datacenter, IoT, Automotive, and Networking.

“With the introduction of its EUV process node, Samsung has led a quiet revolution in the semiconductor industry,” said Charlie Bae, executive vice president of foundry sales and marketing team at Samsung Electronics. “This fundamental shift in how wafers are manufactured gives our customers the opportunity to significantly improve their products’ time to market with superior throughput, reduced layers, and better yields. We’re confident that 7LPP will be an optimal choice not only for mobile and HPC, but also for a wide range of cutting-edge applications.”

Tuesday, October 9, 2018

Picosun launches new PicoMEDICAL™ solutions specially targeted for healthcare industries

ESPOO, Finland, 9th October 2018 – Picosun Group, a leading, global provider of ALD (Atomic Layer Deposition) thin film coating technology, strengthens its position in the healthcare market with new PicoMEDICAL™ solutions specially developed for the needs of medical device manufacturers. 
ALD technology has the potential to disrupt the whole field of healthcare industries. Ultra-thin, biocompatible and bioactive ALD films manufactured with Picosun’s production ALD equipment already encapsulate surgical implants and improve their adhesion to bone. This speeds up the healing process and protects the patient from possible metal ion leakage from the implant into the body. In pharmaceutical industries, Picosun’s powder ALD technology is used to functionalize the surface of drug particles for controlled drug delivery.

Friday, October 5, 2018

Sequential Infiltration Synthesis - SIS

Wednesday, October 3, 2018

EREZTECH introduces Bridge Forward(TM) solution

EREZTECH introduces Bridge ForwardTM solution - from synthesizing complex molecules with feasibility analysis to executing a scalable route to high volume manufacturing

Nowadays, leading technology nodes for Logic, DRAM, and NAND/3D NAND rest upon continuously increasing use of ALD & CVD in HVM. The basic layers and their applications, products and respective precursors are listed in the table below:
Layer Application Product Precursors (examples)
Al2O3 High-k, liner, etch stop, mask Logic, DRAM, NAND TMA, AlCl3
HfO2 High-k, mask Logic, DRAM HfCl4, TEMAHf, Hf-Cp´s
ZrO2 High-k, mask Logic, DRAM ZrCl4, TEMAZr, Zr-Cp´s
La2O3 High-k Logic La(THD)3
TiN Electrode, barrier, mask Logic, DRAM, NAND TiCl4, TDMAT, TEMAT
TaN Electrode, barrier Logic, DRAM TaF5, TaCl5, PDMAT
Co Barrier/seed, contact Logic CTTBA, CoCOCp
Ru Electrode, barrier/seed, contact Logic, (DRAM) RuCp´s, RuO4
W, WN, WC Electrode, barrier/seed, contact Logic, DRAM, NAND WF6, WCl6, W-MO

This involves a huge mix of resources including stakeholders within the fab organizations as well as external partners and suppliers from the supply chain, ranging from universities and research institutes to material suppliers, chemical and gas companies, wafer processing equipment and sub-component manufacturers, and companies facilitating R&D for the semiconductor industry.

This involves a huge mix of resources including stakeholders within the fab organizations as well as external partners and suppliers from the supply chain, ranging from universities and research institutes to material suppliers, chemical and gas companies, wafer processing equipment and sub-component manufacturers, and companies facilitating R&D for the semiconductor industry.

Few companies are capable of creating new molecules from the conception and then bringing it into HVM ; EREZTECH is one of these companies with proven track record in the semiconductor industry.

Being a single source from R&D to HVM, EREZTECH enables clients to achieve thorough control and enhanced visibility, and also helping accelerate the organometallic project. 

Leveraging the Ereztech Bridge Forward™ solution, they specialize in collaborating with results-driven clients to achieve long-term project success. From synthesizing complex molecules with feasibility analysis to executing a scalable route to high volume manufacturing.

As mentioned above, a key to success in organometallic R&D is a risk-sharing partnership. Ereztech has a network of 50+ experienced research chemists specialized in the synthesis of custom metal-organics. Having developed 500 new methods for organometallic synthesis, the EREZTECH research team continues to enrich their catalog with 800+ high purity compounds, including: 
  • Acetates
  • Acetylacetonates
  • Alkenes/Dienes
  • Carbonyls
  • Cyclopentadiene derivatives
  • Metal-alkyl and –hydride bonds
  • Phosphine 

Ereztech’s Bridge Forward™ solution is a proven process for helping clients achieve project objectives with successfully synthesizing and scaling-up complex chemicals. After developing on-demand custom precursor, their solution incorporates the following key steps:

  • Deliver 25 g of test batches for thorough review and feasibility analysis.
  • Produce pilot batches to further refine the compound to meet your purity standards and specifications.
  • Develop pre-production ramp-up, including vetting of supply chain partners and optimization of logistics
  • Produce high volumes (e.g., thousands of kilograms) of metal-organics to defined project specifications and our stringent ship-to-control standards.
After a detailed and thorough approval process, sometimes change in unavoidable - for instance, change in regulations or a replacement of a supplier.

EREZTECH stays prepared for the potential change required with their comprehensive Change Management Program that:
  • Minimizes undesirable impacts on manufacturing systems, with special care for reliability and stability of production processes.
  • Ensures the thorough technical review and accuracy of all modifications — and their test procedures — prior to making any changes.
  • Maximizes staff planning for a smooth change transition, including employee training before the change is implemented.

Recent examples of precursor scale-ups attained by EREZTECH include:

  • Scaling Up Cobalt Octacarbonyl and Its Derivatives  : LINK
  • Innovative Approach to Scaling Up Silicon Tetraiodide (SiI4) : LINK

Products – visit the EREZTECH periodic table [LINK]

Request an Ereztech Custom Synthesis [LINK]

 by Nick Kim, licensed from CartoonStock #332183