Tuesday, April 20, 2021
Spatial atomic layer deposition system FHR.Star.400x300-SALD delivered
Saturday, April 17, 2021
Unraveling the different causes behind ferroelectricity in HfO2
Interplay between oxygen defects and dopants: effect on structure and performance of HfO2-based ferroelectrics
Monica Materano et alInorg. Chem. Front., 2021, Advance Article https://doi.org/10.1039/D1QI00167A
Friday, April 16, 2021
ALD coating for delayed drug delivery via the lungs for the treatment of respiratory diseases by Astra Zeneca and TU Delft
- electronic implants (IC, BioMEMS, Pacemaker)
- prosthetic implants (spine, trauma, hip, knee, dental)
- active pharmaceuticals ingredients for delayed drug delivery
Thursday, April 15, 2021
BENEQ P800 coating batches of 300 mm showerhead plates for advanced semiconductor wafer processing equipment
How it is done - Here a cool video of a BENEQ P800 coating 300 mm showerhead plates for some advanced semiconductor wafer processing equipment.
Wednesday, April 14, 2021
Kurt J Lesker installs an ALD150LE system at the University of Minnesota Nano Centre
Characterization of Annealing and Dopant Activation Processes Using Differential Hall Effect Metrology (DHEM) by Active Layer Parametrics (ALP) Inc.
Above, cross-sectional TEM images of the P ion-implanted samples after annealing and corresponding depth profiles from DHEM.
Tuesday, April 13, 2021
Picosun increases efficiency for LED and OLED production
Monday, April 12, 2021
Announcing ALD Russia 2021 Saint Petersburg, Russia 27–30 September 2021.
Spatial Atomic Layer Deposition (SALD): Essential for today's and future battery production
The full story can be found here published by Brainport, NL: LINK
Friday, April 9, 2021
BENEQ P800 Upgrade - Proven Batch ALD for High Volume Production
BENEQ has freshened up its true ALD workhorse the P800 Batch reactor, which probably has the biggest load size in the industry.
PDF Product description for download: LINK
Thursday, April 8, 2021
Pegasus Chemicals announce a new supply site in The EU in Sweden
UK ALD and CVD Precursor supplier Pegasus Chemicals announce a new supply site in Europe in Värmdö, Sweden Pegasus Chemicals AB thru a long-term collaboration with Fab Support AB - the biggest supplier of CVD and ALD precursor in North Europe. The location is very close to BALD Engineering HQ also in Värmdö! Welcome to Sweden and Värmdö in the Stockholm Archipelago!
Why China denied Applied Materials take over of Hitachi Kokusai
ALD/CVD Metal Precursors US$640M Market Booming to US$910M in 2024
Wednesday, April 7, 2021
Ascensus acquires a global leader in high-purity specialty chemicals and CVD/ALD precursors Strem Chemicals, Inc.
Tuesday, April 6, 2021
Abstract submission April 23 (EXTENDED) - 240th ECS Meeting Topic Close-up: Atomic Layer Deposition Applications
Status & Challenges in today's Atomic Layer Processing market Jonas Sundqvist, TECHCET LLC CA, San Diego USA and BALD Engineering Värmdö, Sweden
Symposium focus: The organizers of symposium G01, “Atomic Layer Deposition Applications 17,” encourage abstract submissions on the following (and closely related) topics:
- Semiconductor CMOS applications: development and integration of ALD (atomic layer deposition) high-k oxides and metal electrodes with conventional and high-mobility channel materials;
- Volatile and non-volatile memory applications: extendibility, Flash, MIM (metal-insulator-metal), MIS (metal-insulator-semiconductor), RF (radio-frequency) capacitors, etc.;
- Interconnects and contacts: integration of ALD films with Cu and low-k materials;
- Fundamentals of ALD processing: reaction mechanisms, in situ measurement, modelling, theory;
- New precursors and delivery systems;
- Optical and photonic applications;
- Coating of nanoporous materials by ALD;
- MLD (molecular level deposition) and hybrid ALD/MLD;
- ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;
- ALD for energy storage applications;
- Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates including roll-to-roll deposition;
- Area-selective ALD;
- Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.
Jonas Sundqvist, TECHCET LLC CA, San Diego USA and BALD Engineering Värmdö, Sweden
Invited speakers
- Barry Arkles, Gelest, U.S.
- Karsten Arts, Technische Universiteit Eindhoven, The Netherlands
- Parag Banerjee, University of Central Florida, U.S.
- Necmi Biyikli, University of Connecticut, U.S.
- Jane Chang, University of California, Los Angeles, U.S.
- Lin Chen, Fudan University, China
- Hao-Chung Kuo, National Yang Ming Chiao Tung University, Taiwan
- Noémi Leick, National Renewable Energy Lab, U.S.
- Cathérine Marichy, Université de Lyon, France
- Xiangbo Meng, University of Arkansas, U.S.
- Mattia Pasquali, University of Leuven and Interuniversity Microelectronics Centre (IMEC), Belgium
- Sayeef Salahuddin, University of California, Berkeley, U.S.
- Henrik Sønsteby, Universitetet i Oslo, Norway
- Shuhui Sun, Institut National de la Recherche Scientifique, Université du Québec, Canada
- Angel Yanguas-Gil, Argonne National Laboratory, U.S.
Ola Nilsen, Universitetet i Oslo, Norway
Steven George, University of Colorado Boulder, U.S.
Please visit the meeting website for further information, including travel and visa updates.
Symposium G01 organizers
F. Roozeboom, Technische Universiteit Eindhoven and TNO-Holst Centre, The Netherlands
S. De Gendt, IMEC and Catholic University Leuven, Belgium
J. Dendooven, Ghent University, Belgium
W. Elam, Argonne National Laboratory, U.S.
O. van der Straten, IBM Research, U.S.
A. Illiberi, ASM Europe, Belgium
G. Sundaram, Veeco, U.S.
R. Chen, Huazhong University of Science and Technology, China
O. Leonte, Berkeley Polymer Technology, U.S.
T. Lill, Lam Research, U.S.
M. Young, University of Missouri, U.S.
Monday, April 5, 2021
ALD/ALE 2021 is Going Virtual June 27-30, 2021
Virtual Meeting Overview & Highlights
- Live Tutorial Session with live Q&A Chat opportunities (Sunday, June 27, 2021)
- Live Plenary, Awards, and Student Finalists with live Q&A Chat opportunities (Monday, June 28, 2021)
- Live Parallel Technical Sessions with live Q&A Chat opportunities (Tuesday-Wednesday, June 29-30, 2021)
- On Demand Oral Sessions (Starting Monday, June 28, 2021)
- On Demand Poster Sessions with a Mix of Pre-recorded (Video or Audio) Talks and/or PDF files
- Live and On Demand Sessions available on Mobile App/Online Scheduler through July 31, 2021 and then to AVS members in the AVS Technical Library
AVS ALD/ALE 2021 Web
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Intermolecular at the AVS ASD2021 Workshop, April 6-8.
Day 1: April 6
Poster Session at 2 pm • Lanxia Cheng presents “Area Selective Deposition of Electronics using Multilayer SAM as Surface Passivation.”
Day 2: April 7
Session 4 is chaired by Ravindra Kanjolia., EMD Electronics
Poster Session at 2 pm • Lanxia Cheng presents “Area Selective Deposition of Electronics using Multilayer SAM as Surface Passivation.”
Day 3: April 8
Session 8 at 11:30 am • Ravindra Kanjolia presents, EMD Electronics “Strategies for Area Selective Deposition: From Inherently Selective Precursors to Inhibitor Molecules and Processes.”
12:50 pm • Milind Weling participates on a panel discussion “Area Selective Deposition.”
Wednesday, March 31, 2021
Canada's Gratomic Enters EV Battery Supply Chain With Forge Nano and ALD
Tuesday, March 30, 2021
Picosun Group demonstrates strong growth in 2020 - Turnover grew by 38,6%
• Order intake grew by 48,4% and was €40,9M (€27,5M)• Turnover grew by 38,6% and was €37,6M (€27,1M)• Operating profit was €0,9M (€-0,3M), which is 2,5% (-1,1%) of the turnover
Almost a fifth of company’s turnover to research and development
Friday, March 26, 2021
Samsung confirms first HKMG for DDR5 DRAM
ASM International recently acknowledged that ALD High-k/Metal Gate (HKMG) is finally in high volume production for DRAM (LINK). Now Samsung confirms that. This is a small victory for all people working on this process for such a long time. My first tool ownership when I moved to Germany and started at Infineon was an ASM Polygon 200 mm cluster with a Pulsar 2000 chamber running HfO2, TiN, TiHfN, TiAlN, Al2O3, and my not fully understood HfN ALD process and a Poly chamber that I never really cared too much about. Press release below - and now do the maths - how big this business is once rolled out for all DRAM technologies to come - yeah $$$, many tulips indeed.
Samsung Develops Industry’s First HKMG-Based DDR5 Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications
512GB capacity DDR5 module made possible by an 8-layer TSV structureHKMG material reduces power by 13 percent while doubling the speed of DDR4
Thursday, March 25, 2021
Forge Nano on ALD for Radio frequency (RF) and power electronics
Check out this fast ALD-Beast: LINK
- Hermetic sealing encapsulation layers with minimal thickness
- Pristine conformality in high-aspect ratio structures
- Ultra-low particle generation
- Low stress films
- Improved lifetime of circuits and PCBs
- Increased resistance to harsh environments
- No peeling or flaking of the hermetic seal at atmospheres >1200 PSI
- Negligible mass gain from coating at 100 nm
Wednesday, March 24, 2021
Canon, SCREEN and Tokyo Electron to join Japan advanced chipmaking project for 2nm
Intel is spending $20 billion to build two new chip plants in Arizona
Alex Tregub, PhD Staff Engineer Intel Corporation "From Egyptian Royal Cubit to SEMI Guides for CMP consumables – Industry Standards"
- Intel invests $20 billion in two Arizona factories, 7nm chips coming in 2023
- Intel announces steps to boost chip manufacturing
- ‘Intel is back:’ New CEO’s plan to make chips for others excites investors
- Stocks making the biggest moves after the bell: GameStop, Adobe, Intel
- Intel is spending $20 billion to build two new chip plants in Arizona
Applied Materials may kill $3.5B buy of Japanese ALD and CVD Furnace Company Kokusai over delayed approval by China
- Kokusai is a small acquisition for Applied materials as compared to the previously failed mega-merger with Tokyo Electron
- Kokusai, which counts Samsung, SK Hynix, Toshiba, and Micron among its top customers, reported revenue of $1.24 billion as of March 2018.
- Kokusai’s batch wafer processing tools are less technology-intensive than Applied Materials’ single wafer tools, the recent focus on ultra-thin films has driven renewed interest in this group.
Friday, March 19, 2021
Picosun Group is among the 10 biggest patent applicants in Finland
Woxna AB in Sweden & Forge Nano USA to evaluate ALD coated graphite anode material for Lithium batteries
Thursday, March 18, 2021
AlixLabs AB launched ALE Pitch Splitting (APS) for the first time at ALD & ALE Ireland 2016
We did not want to steal the thunder from our good Irish friends and St. Patrick Day we wish you all a healthy recovery today and breakfast for Champions. Yesterday we remembered our trip to Dublin and launching our proprietary technology, APS - ALE Pitch Splitting, for the first time to a bigger audience. Since then a lot of things has happened at AlixLabs AB in Lund, Sweden:
- We received soft funding and invest support to found the company by LU Holding (LINK) - AlixLabs AB in Lund, Sweden operating out of IDEON Science park (LINK) and Lund Nano lab at Lund University
- We received SwedishVinnova grant for "Innovative startups" 93 startup-bolag får dela på 28 miljoner | Vinnova
- We hired our first Full-time employee Dr. Mohammad Karim, Principal Scientist (LINK)
- We signed an agreement to use the lab facilities of Sweden’s largest research environment for nanoscience and nanotechnology - Lund Nano Lab (LINK)
- We applied for an Additional 2.7 MSEK EU and National Swedish Soft co-funding in early 2021 and have additional 3 projects in the pipeline.
- We have started our 1st Investment round to close before Swedish Midsummer - please get in touch if you want a meeting! (jonas@alixlabs.com or LinkedIn: LINK)
ALE Pitch Splitting (APS) taking place at the Lund Nano Lab exhibition stand in the ALD Ireland 2016 Industry Exhibition.
Video from presentation invited given by Dr. Dmitry Suyatin LINK. Staff Engineer at Lund Nano Lab and CTO of AlixLabs AB and on the Scientific Committee of AVS ALE.