Saturday, December 12, 2015

MAM2016 & HERALD ALD for BEOL Workshop in Brussels March 20th

MAM 2016 will be the 25th in a series devoted to research on materials properties and interactions of interconnect and silicide materials.  Starting as a workshop on refractory metals and silicides in the 1980’s and moving towards materials for advanced metallization in 1995, the 2016 conference also aims to address new challenges in the fields of Materials for Flexible Electronics,

The objective of the conference is to provide a forum for open discussions across fundamental and applied sciences and industrial applications.  It is dedicated to international material scientists, process and integration engineers and students, and historically had attendees from universities, research institutions and industries.  To meet the progressive downscaling of device dimensions and the demand for more functionality, the challenges fall to material solutions. New and extensive materials research is needed to further allow chip scaling for the 7nm and 5nm nodes as well as to develop novel nanoscale devices. 
MAM with the COST action Hooking together European Research in Atomic Layer Deposition (HERALD) will host a dedicated workshop on ALD for BEOL Applications in an extended metallization session during the 2016 conference. This special MAM-HERALD session aims to integrate European research activity in atomic layer deposition, bringing together existing groups, promoting young scientists and reaching out to industry and the public. Specially invited international guest speakers will review how ALD will help the industry meet scaling demands and enable new device integration. Furthermore, an expert panel will debate critical issues from both industry and academia.
MAM 2016 is honored to welcome DAVE HEMKER, Lam Research and SUNDAR RAMAMURTHY, Applied Materials to give key insights on the state of the materials industry and open three days of technical presentations and discussions on research for the properties and interactions of interconnect and silicide materials. Additional invited talks will be given by scientific and technical leaders in each of the conference key areas to present the current state-of-the-art.  Watch out for news on invited speakers at: 

Key dates to remember
Abstracts due: 18th December 2015 (2 page abstracts should be submitted at
Early Registration deadline: 20th February 2016
Submission of full papers: 20th March 2016 (Full-length papers will be published in a special issue of Microelectronic Engineering.  See here for details)

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