ASM International N.V. announces that it
will be hosting an analyst and investor technology briefing on
Wednesday, July 15, 2015 at 8:00 - 9:30 a.m. (PDT) in San Francisco, US,
coinciding with SEMICON West 2015. The presentation will be held in
Room 301, Esplanade, Moscone Center.
ASMi is operating in a very close relationship with leading IDMs and Imec on CMOS scaling. In this
technology seminar Han Westendorp, Vice President Corporate Marketing,
will present "Advanced wafer processing with new materials". The
presentation will include highlights of ASM's
- Advanced thermal ALD
- Plasma enhanced ALD products and technologies
- CVD, PECVD and epitaxy technologies
The excellent presentation has now been released and can be downloaded here and some highlights you can find below:
http://www.asm.com/Downloads/2015_Semicon_West_investor_technology_seminar_presentation.pdf
How scaling has been enabled by the introduction of new material and 3D integration.
Density scaling (continuing Moore’s law) driving towards higher mobility materials and alternate device architectures. Future systems will integrate much wider variety of materials and device structures
Here is a nice growing list of the materials and processes that has been introduced until now to drive scaling forward. Many of these process are perfumed by either Epitaxy, CVD/PECVD or ALD/PEALD.
I liked the way you explained the subject. Really, your blog has a lot of stuff. Thank you for sharing such valuable information with us. We also provide such information to Audience. You can also check our blog at once for more information.
ReplyDeleteMontecarlo Ltd
Forex Charts
international trade
Happiest Minds Technologies