Here are some interesting articles on ALD following SEMICON West 2015. I don´t know what you think but it seems to me that ALD really went one step further 2015! I will update as I find more and if you have seen anything interesting please let me know! (jonas.sundqvist@baldengineering.com)
Semicon West: Forget microelectronics it’s not even nano let’s call it atomtronics
The era of atomic level control of electrical
properties have already begun, in that sense the so-called Moore’s law
will continue but with the new way of doing things. The researchers in
semiconductor manufacturing are both engineers and also equally good
material scientists who always explored how to find a way around the
technology barricades/walls and also design a manufacturing process in
such a way that it can be manufactured in volumes at a cost feasible for
business success. So it takes a huge amount of scientific as well as
engineering talent and also business knowledge of the industry in this
field of semiconductor research.
Continue reading : http://www.eeherald.com/section/news/owns20150719006a.html
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Dealing With Atoms
To process chips at the atomic level, there are various solutions in
the market today. For years, ALD has been used to scale the capacitor in
DRAMs as well as to develop the high-k/metal-gate stack for logic
devices. More recently, ALD is also being used to deposit films for the
spacers in multiple patterning applications.
In total, the ALD business is expected to reach $920 million to $925
million in 2015, up from $830 million in 2014, according to Applied
Materials. Applied Materials, ASMI, Lam, TEL and others compete in the
ALD tool market.
ALD is a deposition technique that deposits materials one layer at a
time. “ALD is the alternation of two different chemistries being
introduced in a sequential manner,” said David Chu, strategic marketing
director at Applied Materials. “Because the chemistries are being broken
up, it’s self-limiting. That’s why it allows the technology to be
conformal.”
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Growth forecast for Wafer Fab Equipment and ALD according to Gartner
Good news of ALD - Gartner has forecasted a growth for the Advanced nodes to come!
Gartner says that
the Worldwide semiconductor revenue is forecast to reach $348 billion
in 2015, a 2.2 percent increase from 2014, but down from the previous
quarter's forecast of 4.0 percent growth, according to Gartner, Inc.
Growth forecast for Wafer Fab Equipment according to Gartner (Graph from ASMi Investor Technology Seminar at SEMICON West)
Continue reading : http://baldengineering.blogspot.se/2015/07/growth-forecast-for-wafer-fab-equipment.html
RC plot and HAADF-STEM images illustrating the effectiveness of SAM sealing in preventing metal indiffusion into the ultra-porous low-k film integrated in a 45nm half pitch dual damascene test vehicle. This translates in a 30% decrease in the measured capacitance. (www.imec.be)
Continue reading : http://baldengineering.blogspot.se/2015/07/imec-introduces-self-assembled.html
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Imec introduces self-assembled monomolecular organic films to seal ultra-porous low- k materials
Nano-electronics research center imec announced today at SEMICON West that it has demonstrated concept and feasibility for pore-sealing
low-k dielectrics in advanced interconnects. The method, based on the
self-assembly of an organic monolayer, paves the way to scaling
interconnects beyond N5.
RC plot and HAADF-STEM images illustrating the effectiveness of SAM sealing in preventing metal indiffusion into the ultra-porous low-k film integrated in a 45nm half pitch dual damascene test vehicle. This translates in a 30% decrease in the measured capacitance. (www.imec.be)
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UPDATE: ASM International technology briefing SEMICON West 2015
ASM International N.V. announces that it
will be hosting an analyst and investor technology briefing on
Wednesday, July 15, 2015 at 8:00 - 9:30 a.m. (PDT) in San Francisco, US,
coinciding with SEMICON West 2015. The presentation will be held in
Room 301, Esplanade, Moscone Center.
ASMi is operating in a very close relationship with leading IDMs and Imec on CMOS scaling. In this
technology seminar Han Westendorp, Vice President Corporate Marketing,
will present "Advanced wafer processing with new materials". The
presentation will include highlights of ASM's
- Advanced thermal ALD
- Plasma enhanced ALD products and technologies
- CVD, PECVD and epitaxy technologies
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Lam Research Releases High-Productivity VECTOR(R) ALD Oxide Deposition System
Lam Research Corp a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced it has released its high-productivity VECTOR® ALD Oxide system on the Extreme platform. The new product uses atomic layer deposition (ALD) to create highly conformal dielectric films with an emphasis on advanced patterning, in particular spacer-based multiple patterning. One key challenge is managing thickness variability of the self-aligned spacers that define critical dimensions (CDs). By delivering superior CD control, VECTOR ALD Oxide has been winning volume-production decisions for multi-patterning applications. Now leveraging Lam's Extreme platform, the latest system meets productivity requirements for continued scaling, where additional steps increase process time, cost, and complexity. As a result, VECTOR ALD Oxide is gaining rapid adoption by a number of leading chipmakers for advanced multi-step patterning applications.
"Multiple patterning continues to be a key inflection for the industry, and spacer-based multi-patterning remains an enabling strategy for chipmakers for both current immersion and future EUV lithography schemes," said Sesha Varadarajan, group vice president, Deposition Product Group. "With this in mind, we are working closely with our customers to deliver cost-effective, extendible solutions required for further scaling, such as the high-productivity atomic-scale control from our VECTOR ALD Oxide product."
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Applied Materials announced a next-generation etch tool at SEMICON West
Applied Materials, Inc. announced a next-generation etch tool at SEMICON West, the Applied Centris(TM) Sym3(TM) Etch system,
featuring an entirely new chamber for atomic-level precision
manufacturing. To overcome within-chip feature variations, the Centris
Sym3 system leapfrogs current tools to provide chipmakers with the
control and precision needed to pattern and create densely packed 3D
structures in advanced memory and logic chips.
Applied Materials Centris
Sym3 - an entirely new chamber for atomic-level precision
manufacturing
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