Applied Materials, Inc. announced a next-generation etch tool at SEMICON West, the Applied Centris(TM) Sym3(TM) Etch system,
featuring an entirely new chamber for atomic-level precision
manufacturing. To overcome within-chip feature variations, the Centris
Sym3 system leapfrogs current tools to provide chipmakers with the
control and precision needed to pattern and create densely packed 3D
structures in advanced memory and logic chips.
Applied Materials Centris
Sym3 - an entirely new chamber for atomic-level precision
manufacturing
"Drawing
on over 20 years of etch learning and our expertise in precision
materials removal, the Sym3 system represents a brand new design, built
from the ground up, that solves persistent and impending industry
challenges," said Dr. Raman Achutharaman, vice president and general
manager of Applied's Etch business unit. "Customer traction has been
remarkable, resulting in the fastest adoption rate we've seen for an
etch tool in the company's history, with record ramp to production at
leading-edge fabs."
The Centris Sym3 etch chamber
employs Applied's unique True Symmetry(TM) technology with multiple
tuning controls for optimizing global process uniformity to the atomic
level. Key to the design is a focus on controlling and removing etch
byproducts, which are increasingly hampering within-chip patterning
uniformity. The system mitigates byproduct re-deposition to overcome the
challenges of line edge roughness, pattern loading and defects -
issues that are becoming more limiting for each successive technology
node. Combined with an advanced RF technology that controls ion energy
and angular distributions, the Sym3 system delivers unsurpassed vertical
profiles for high aspect ratio 3D structures.
The
Centris Sym3 platform's six etch and two plasma clean process chambers
feature system intelligence software to ensure that every process in
every chamber matches precisely, enabling repeatability and high
productivity for high-volume manufacturing.
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