Tuesday, July 14, 2015

UPDATE: ASM International technology briefing SEMICON West 2015

ASM International N.V.  announces that it will be hosting an analyst and investor technology briefing on Wednesday, July 15, 2015 at 8:00 - 9:30 a.m. (PDT) in San Francisco, US, coinciding with SEMICON West 2015. The presentation will be held in Room 301, Esplanade, Moscone Center.

 
ASMi is operating in a very close relationship with leading IDMs and Imec on CMOS scaling. In this technology seminar Han Westendorp, Vice President Corporate Marketing, will present "Advanced wafer processing with new materials". The presentation will include highlights of ASM's 
  • Advanced thermal ALD
  • Plasma enhanced ALD products and technologies
  • CVD, PECVD and epitaxy technologies
The excellent presentation has now been released and can be downloaded here and some highlights you can find below: 

http://www.asm.com/Downloads/2015_Semicon_West_investor_technology_seminar_presentation.pdf


How scaling has been enabled by the introduction of new material and 3D integration.



Density scaling (continuing Moore’s law) driving towards higher mobility materials and alternate device architectures. Future systems will integrate much wider variety of materials and device structures



Here is a nice growing list of the materials and processes that has been introduced until now to drive scaling forward. Many of these process are perfumed by either Epitaxy, CVD/PECVD or ALD/PEALD.


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