Thursday, March 7, 2024

Aalto University in Finland Wins Major Grant for Eco-Friendly Semiconductor Technology

Aalto University, in close collaboration with key industry players including Applied Materials in Finland (Picosun), PiBond, and Volatec, has been awarded a significant grant by Business Finland for their groundbreaking project titled “New chemistries for resource-efficient semiconductor manufacturing”. This initiative is a part of the larger "Chip Zero" Ecosystem, spearheaded by Picosun, aiming to revolutionize the semiconductor industry by developing chips that boast zero lifetime emissions—a first in Finland's tech landscape.

Led by Professors Maarit Karppinen and Antti Karttunen from Aalto's Department of Chemistry and Materials Science, the project seeks to address the pressing environmental concerns associated with semiconductor manufacturing. With the industry's carbon footprint and resource consumption at an all-time high, this co-innovation venture promises to pave the way for more sustainable production methods.

Dr. Ramin Ghiyasi working in the CHEMI-SEMI project holding a silicon wafer after atomic layer deposition, Department of Chemistry and Material Science

The project's goals are ambitious yet crucial. By innovating new chemical processes and materials, the team aims to minimize the environmental impact of semiconductor fabrication. This includes the development of novel, eco-friendly precursors and solvents, enhancing material purification, and advancing recycling practices, as highlighted by Dr. Marja Tiitta from Volatec.

Dr. Thomas Gädda of PiBond emphasizes the importance of collaborative efforts in achieving these sustainability targets, underscoring the project's reliance on a synergy of expertise from academia and industry. This collaborative framework is expected to yield advancements in chemical usage, process optimization, and energy efficiency in semiconductor manufacturing.

With its comprehensive approach, combining experimental research with computational modeling, the project aspires not only to innovate within the confines of semiconductor technology but also to set a new standard for environmentally conscious manufacturing practices in the industry.

Source: Significant Grant for Greener Semiconductor Technology from Business Finland | Aalto University

Wednesday, February 28, 2024

ASM International: Spearheading Semiconductor Innovation in ALD, Epitaxy, and CVD Markets

ASM International N.V. (Euronext Amsterdam: ASM) yesterday reported its fourth quarter 2023 operating results (unaudited). Double-digit full-year revenue growth, outperforming softer WFE market in 2023

“2023 was another successful year for ASM. Sales increased by 13% at constant currencies, despite softening market conditions, and marking the seventh consecutive year of double-digit growth.” said Benjamin Loh, CEO of ASM. “Revenue in Q4 2023 amounted to €633 million, in line with our guidance of €600-640 million and down compared to the level in Q4 2022. Revenue in the quarter was supported by strong sales in the power/analog/ wafer segment. Bookings at €678 million were slightly better than our expectation and were driven by GAA pilot- line orders and continued strength in China demand.

ASM's Leadership in the Growing ALD Market

According to ASM, the single wafer Atomic Layer Deposition (ALD) market is experiencing significant growth, with projections indicating an increase from $2.6 billion in 2022 to a range of $4.2 billion to $5.0 billion by 2027. This growth, characterized by a Compound Annual Growth Rate (CAGR) of 10-14% from 2022 to 2027, underscores the expanding role of ALD technology in semiconductor manufacturing. ASM International, a key player in the semiconductor industry, holds a dominant position in this market, commanding a share of over 55% throughout the forecast period.

Please note that this market assessment, most probably originally from TechInsights (prev. VLSI Research) does not include Large Batch furnace ALD, which historically have been about 30% of the total 300 mm ALD equipment market. The leaders in this segment are Tokyo Electron followed by Kokusai and ASM chose not to compete with its A412 ALD product line.

Driving Forces Behind ALD Market Expansion

The expansion of the ALD market is propelled by a series of technological advancements and increasing demands within the semiconductor sector. Key factors contributing to this growth include the industry's shift towards Gate-All-Around (GAA) technology, the necessity for advanced high-k gate dielectrics, and the precision required for threshold voltage tuning. Additionally, the development of sacrificial layers and the use of high aspect ratio Through-Silicon Vias (TSVs) are critical in advancing semiconductor manufacturing techniques. The application of metals and the adoption of selective ALD processes further accentuate the importance of ALD technology in modern semiconductor fabrication.

ASM's Strategic Positioning and Market Opportunities

ASM is well-positioned to capitalize on the opportunities presented by the burgeoning ALD market. The company's strategic emphasis on innovation, coupled with its comprehensive product portfolio, positions ASM as a frontrunner in meeting the evolving needs of the logic/foundry and memory segments of the semiconductor industry. The transition to advanced manufacturing technologies, such as GAA and high-k metal gate applications, presents significant growth avenues for ALD, with ASM at the forefront of this technological evolution.

To be more specific, the transition to GAA technology and the expansion in FinFET applications are set to significantly increase ASM's served available market by approximately US$400 million for every 100,000 wafer starts per month (WSPM). According to ASM, the equipment orders started to come in in the 2nd half of 2023. We can assume that this are orders from Samsung, TSMC and Intel. It is however about peculiar since Samsung had 3 nm GAA going already with yield in August 2023 and ASM is describing it as GAA pilot lines. Anyhow, come 2028 when all leading foundries including Rapidus in Japan are up and running GAAFETs, this additional market will be + USD 1.5 B as compared to if it would have been "only" FinFET technology - according to my back of the envelope calculations. For a company like ASM, with just below USD 3 B (2.6 B EUR) annual Revenue 2023 this is a huge thing. If this is not enough to go woah - add to that the GAAFET market is an upwards moving target and will continue to grow and looking ahead stacking of NMOS/PMOS will drive further demand for this type of ALD and Epi processes.

Expansion into the Epitaxy and CVD Markets

The Silicon Epitaxy (Si epi) market is also on a growth trajectory, with forecasts suggesting it will reach between $2.3 billion and $2.9 billion by 2027. ASM aims for a market share target of over 30%, focusing on both leading-edge and non-leading-edge segments. The leading-edge growth is driven by transitions to GAA technology and advancements in high-performance DRAM, while the non-leading-edge growth is buoyed by wafer power analog and strong momentum from ASM's Intrepid ESA. The epitaxy market is expected to see a Compound Annual Growth Rate (CAGR) of 3-8% from 2022 to 2027, with the leading-edge segment outpacing the overall market with a CAGR of 10-15%.

Regarding the SiC market, the investor presentation highlighted significant growth in power/analog/wafer revenue, almost doubling, primarily driven by robust demand in China. This growth was positively impacted by the consolidation of LPE (SiC Epitaxy), with sales comfortably exceeding the target of more than €130 million in 2023. This indicates ASM's strong performance in the SiC market and its successful integration and expansion in SiC epitaxy, aligning with the broader industry trend towards more advanced and efficient semiconductor materials.

Chemical Vapor Deposition (CVD) technology is another area of focus for ASM, particularly in the context of transitioning to new materials like Molybdenum, which is replacing traditional materials such as CVD Tungsten and PVD Copper in interconnect applications. This shift is indicative of the evolving needs within the semiconductor manufacturing process and highlights ASM's adaptability to changing market dynamics.

In summary, ASM's strategic initiatives in ALD, Epitaxy, and CVD technologies underscore the company's commitment to innovation and leadership within the semiconductor equipment market. Through a combination of market foresight, technological prowess, and strategic investments, ASM is well-positioned to capitalize on the growth opportunities presented by the evolving semiconductor landscape. 

Tuesday, February 27, 2024

Applied Materials Unveils Cutting-Edge Patterning Technologies for Next-Gen Semiconductor Device Manufacturing

Applied Materials is leading the charge into the angstrom era of chipmaking, unveiling a suite of innovative solutions at the SPIE Advanced Lithography + Patterning conference. The company's focus is on overcoming the challenges posed by extreme ultraviolet (EUV) and high-NA EUV lithography, crucial for the production of chips at 2nm process nodes and below. Their approach integrates new materials engineering, metrology techniques, and pattern-shaping technology to enhance chip performance and yield.

To help overcome patterning challenges for leading-edge chips, Applied Materials offers a portfolio of technologies designed to complement the latest advances in lithography. The company’s newest innovations include the Producer® XP Pioneer® CVD patterning film, the Sym3® Y Magnum™ etch system, the Centura® Sculpta® pattern-shaping system and Aselta contour technology for design-based metrology.

Central to Applied Materials' advancements is the Sculpta® pattern-shaping technology, first introduced at the previous year's conference. Sculpta has seen growing adoption among top logic chipmakers for its ability to refine EUV patterning, notably reducing double patterning steps and mitigating defects such as bridge defects. This technology not only lowers patterning costs but also improves chip yields, showcasing its increasing importance in the semiconductor manufacturing landscape.

Over the next few years, chipmakers will be looking to create “angstrom era” chips that will use EUV and High-NA EUV lithography to pattern their smallest features. An entire ecosystem of capabilities will be required to enable this advanced patterning – including software and design tools, innovations in deposition and etch, advanced metrology and inspection systems, and entirely new approaches such as pattern shaping.

In response to the issue of EUV line edge roughness, Applied Materials has launched the Sym3® Y Magnum™ etch system. This innovative system employs a combination of deposition and etch processes within a single chamber to smooth out rough edges before etching, thereby enhancing yield and chip performance.

Additionally, the company introduced the Producer® XP Pioneer® CVD patterning film, designed for high-fidelity pattern transfer with enhanced resistance to etch chemistries. This film is especially significant for advanced process nodes, offering improved sidewall feature uniformity and co-optimization with both Sculpta and the Sym3 Y Magnum system for superior patterning capabilities.

To address the critical issue of feature alignment across chip layers, Applied Materials has acquired Aselta Nanographics, integrating its design-based metrology with Applied's leading eBeam systems. This integration enables a comprehensive metrology solution that significantly enhances feature placement accuracy, crucial for optimizing chip performance and yield.

Applied Materials' expansion of its patterning solutions portfolio underscores its commitment to advancing semiconductor technology. By addressing key challenges in EUV lithography and introducing groundbreaking technologies, the company is setting new standards for the industry, driving forward the capabilities of angstrom era chipmaking.

Source: Applied Materials Expands Patterning Solutions Portfolio for Angstrom Era Chipmaking | Applied Materials

DOE Invests $4M in Argonne's ALD Tech to Develop Energy-Efficient Semiconductor Devices

The US Department of Energy (DOE) has awarded Argonne National Laboratory a $4 million grant to pioneer research in microchip energy efficiency using Atomic Layer Deposition (ALD). This innovative project, part of the DOE's Energy Efficient Scaling for Two Decades (EES2) initiative, aims to harness the potential of 2D materials, specifically molybdenum disulfide (MoS2), to create microchips that could consume up to 50 times less energy than current models. 

Led by Argonne's Distinguished Fellow Jeffrey Elam, the research team will collaborate with Stanford, Northwestern, and Boise State Universities to develop ALD techniques for fabricating atomically precise MoS2 films. This breakthrough could lead to microchips with integrated memory and logic functions, significantly reducing energy waste and addressing the critical "von Neumann bottleneck" in computing. The project is a step forward in the global effort to enhance computational efficiency and sustainability.

Monday, February 26, 2024

PRiME 2024: A Global Convergence on Atomic Layer Processing Set for Honolulu This October

The PRiME Joint International Meeting, organized by the Electrochemical Society and sister societies from Japan and Korea, will take place from October 6-11, 2024, in Honolulu, Hawaii. Anticipating over 4000 participants, the conference will focus on solid-state science, technology, and electrochemistry. Symposium G01 invites submissions on Atomic Layer Deposition and Etching, covering topics from semiconductor applications to energy storage. The deadline for abstract submission is April 12, 2024. Last year's event saw 78 presentations, indicating a strong interest in the field. For visa, travel information, and participation letters, contact ECS representatives.

Every four years, the PRiME Joint International Meeting is held under the auspices of the Electrochemical Society (ECS), joint with its sister Societies of Japan and Korea.

This fall, PRIME 2024 will be held on Oct. 6-11, 2024 in Honolulu, Hawaii, and is expected to gather over 4000 participants and 40 exhibitors from both academia and industry.

The conference has a strong focus on emerging technology and applications in both solid-state science & technology and electrochemistry.

General information and the Meeting Program can be found here: CALL FOR PAPERS.

The organizers of symposium G01 on “Atomic Layer Deposition & Etching Applications, 20” encourage you to submit your abstract(s) on topics, comprising but not limited to:

1. Semiconductor CMOS applications: development and integration of ALD high-k oxides and metal electrodes with conventional and high-mobility channel materials;

2. Volatile and non-volatile memory applications: extendibility, Flash, MIM, MIS, RF capacitors, etc.;

3. Interconnects and contacts: integration of ALD films with Cu and low-k materials;

4. Fundamentals of ALD processing: reaction mechanisms, in-situ measurement, modeling, theory;

5. New precursors and delivery systems;

6. Optical, photonic and quantum applications; applications aiming at Machine Learning, Artificial Intelligence

7. Coating of nanoporous materials by ALD;

8. Molecular Layer Deposition (MLD) and hybrid ALD/MLD;

9. ALD for energy conversion applications such as fuel cells, photovoltaics, etc.;

10. ALD for energy storage applications;

11. Productivity enhancement, scale-up and commercialization of ALD equipment and processes for rigid and flexible substrates, including roll-to-roll deposition;

12. Area-selective ALD;

13. Atomic Layer Etching (‘reverse ALD’) and related topics aiming at self-limited etching, such as atomic layer cleaning, etc.

FYI: Last year in Gothenburg, our symposium G01 on ALD & ALE Applications 19 attracted a record number of 78 presentations, composing a full 4-day schedule of 66 oral (of which 18 invited), plus 12 poster presentations.

We will traditionally attract more attendants from Far East and expect to be as successful this fall in Hawaii.

Abstract submission

Meeting abstracts should be submitted not later than the deadline of April 12, 2024 via the ECS website: Submission Instructions

Invited speakers

A list of confirmed invited speakers (from North America, Asia and Europe) will soon be available.

Visa and travel

For more information, see: VISA AND TRAVEL INFORMATION

In addition, Mrs. Francesca Spagnuolo at the ECS ( can provide you with an official participation letter issued by the Electrochemical Society.

For (limited) general travel grant questions, please contact

We are looking forward to meeting you all at our symposium G01 on ALD & ALE Applications 20, in Honolulu | Oct. 6-12, 2024 !

Symposium organizers:

F. Roozeboom, (lead), University of Twente; e-mail:,
S. De Gendt, IMEC & Catholic University Leuven,
J. Dendooven, Ghent University,
J. W. Elam, Argonne National Laboratory,
O. van der Straten, IBM Research,
A. Illiberi, ASM Europe,
G. Sundaram, Veeco,
R. Chen, Huazhong University of Science and Technology,
O. Leonte, Berkeley Polymer Technology,
T. Lill, Clarycon Nanotechnology Research,
M. Young, University of Missouri,
A. Kozen, University of Vermont.

Saturday, February 17, 2024

After decline of -13%, TECHCET reports consecutive YoY double-digit growth

San Diego, CA, February 16, 2024: TECHCET — the advisory firm providing materials market & supply chain information for the semiconductor industry — is anticipating a strong rebound in the semiconductor memory market segment for 2024, which will lead the total semiconductor industry into an upturn. This comes after a decline in total semiconductor revenues to US$572 billion in 2023, a -13% change compared to 2022. Significant revenue growth is expected in 2024 of 12%, followed by even stronger growth in 2025 of 21%. Moderated growth is anticipated in 2026 as the market enters a downcycle later that year.

By 2029, the market is set to eclipse the US$900 billion point, but the elusive US$1 trillion echelon is not predicted by TECHCET to be reached until 2031 or 2032.

While the cyclicity of the semiconductor market is evident in this forecast, overall revenue trends for materials markets are more moderate and often do not exhibit the same swings in ASP’s or revenues as semiconductor device revenues. TECHCET will provide an overview of the current materials market outlooks with respective insights at their upcoming Advisory Alert Webinar, on April 21st, available to member subscribers and special guests.

To get more market and supply chain information on TECHCET’s forecasts and Critical Materials Reports™, go to:

Don’t miss the 2024 CMC Conference in Chandler, AZ on April 10-11. For more info and to register, visit

ABOUT TECHCET: TECHCET CA LLC is an advisory services firm expert in market and supply-chain analysis of electronic materials for the semiconductor, display, solar/PV, and LED industries. TECHCET offers consulting, subscription service, and reports, including the Critical Materials Council (CMC) of semiconductor fabricators and Data Subscription Service (DSS). For additional information, please email us here, call +1-480-332-8336, or go to

SIA Feb. 22 for a webinar on the 2023 semiconductor market and 2024 outlook

SIA Feb. 22 for a webinar on the 2023 semiconductor market and 2024 outlook. Insights from Dan Hutcheson, Dale Ford, Lita Shon-Roy, and Christopher Danely. Discover trends and future projections. Don't miss out!

A Review of the 2023 Semiconductor Market and a Look to 2024

Join us Thursday, Feb. 22 at 2 pm ET for the complimentary SIA Webinar—A Review of the 2023 Semiconductor Market and a Look to 2024.

Semiconductor sales declined by 8.2% in 2023, confirming projections that the industry would experience negative growth. Despite the decrease in annual revenue, the second half of the year saw consistent month-over-month sales growth, signaling the beginning of the new semiconductor business cycle. In addition, the increase in the latter half of the year was driven by sales in end-markets—such as AI, automotive, and industrial—that are expected to propel the industry to $1 trillion by 2030.

Please join a panel of semiconductor market experts to discuss 2023 sales trends and an outlook of the market in 2024. Panelists include Dan Hutcheson, Vice Chair at TechInsights; Dale Ford, Chief Analyst at the Electronics Components Industry Association (ECIA); Lita Shon-Roy, President/CEO and Founder of TECHCET; and Christopher Danely, Managing Director, Citi. The session will be moderated by Robert Casanova, Director of Industry Statistics and Economic Policy at SIA.

We look forward to seeing you on Thursday, Feb. 22 at 2 pm for the complimentary SIA webinar!

Register for the webinar here.

Thursday, February 15, 2024

Webinar - ALD of nitrides - enabling metastable nitrides by plasma ALD

Welcome to the next Applied® Picosun® research community webinar!

Time: Tuesday, 9th of April, 2024 at 13:00 CET
Length: 45 minutes

Although ALD is well known for binary oxides, it is less understood for binary nitrides. Some commonly studied nitride examples are SiNx and TiN that have been extensively investigated while GaN and AlN are less reported since ALD has not been needed for these materials. We have recently shown how plasma ALD seems to be a true enabler for InN, which is metastable both as binary and when combined to form ternaries. Apart from nitrides for optoelectronics, metastable cubic AlTiN has been used to increase the service life of cutting tools. Cubic AlTiN is routinely synthesized using physical vapor deposition techniques operating far from thermal equilibrium. Recently, it has been shown that metastable, cubic AlTiN with high Al content can be deposited close to thermodynamic equilibrium by deposition techniques working at very low pressures. However, very little is understood about the deposition chemistry in these processes, limiting process development to be supported by educated guesses rather than scientific understanding. In the research, a scientific understanding of the deposition chemistry for cubic AlTiN is formed, to facilitate the development of better, more sustainable processes for these coatings.

Speaker: Pamburayi Mpofu, Linköping University, Pedersen Group

Pamburayi Mpofu is a third-year Doctoral Candidate in Materials Chemistry and a member of the Henrik Pedersen Group in the Department of Physics, Chemistry, and Biology (IFM) at Linköping University, Sweden.

Pamburayi holds a Master’s degree in Chemistry from Linköping University. His research interests are in Inorganic Materials Chemistry with a focus on atomic layer deposition (ALD). He is currently working on understanding, on a fundamental atomic level, the surface chemistry governing the deposition of metastable ternary nitrides (in particular AlTiN) thin layers of materials by ALD, for protective hard coating applications.
"I will describe the general problems for doing ALD of nitrides and why ALD seems to be an enabler for metastable nitrides will be described. With focus on my research on AlTiN I will show how I use ALD in developing an understanding of the surface chemistry during the deposition processes. Using in-situ techniques, to study the surface chemistry while navigating the precursor chemistry to generate experimental data that we compare with modeling results to provide an atomic scale perspective of the surface chemistry."

AMEC's Revenue Grows with Advanced Etch Technology Fueling China's Semiconductor Surge

AMEC, China's etching tools giant, forecasts a 30%+ revenue jump in 2023, driven by local semiconductor demand and replacing US parts with domestic ones.

Advanced Micro-Fabrication Equipment Inc. (AMEC), a leading Chinese provider of semiconductor etching tools, is set to witness a significant revenue surge exceeding 30% in 2023, buoyed by robust demand from China's burgeoning semiconductor manufacturing sector. AMEC's strategic focus on core technological innovations has enabled the deployment of an array of sophisticated chip-making equipment to domestic fabs, catering to the critical process of etching in semiconductor production. AMEC's revenue for 2023 is projected to hit 6.26 billion yuan ($879 million), marking a 32.1% increase from the previous year, underpinned by a substantial 8.36 billion yuan in new orders. This growth trajectory is further evidenced by an impressive net profit forecast ranging between 1.7 billion yuan and 1.85 billion yuan, showcasing year-on-year growth of 45% to 58%. Central to AMEC's success is its adeptness in navigating the challenges posed by tightened US semiconductor sanctions. 

The company has embarked on an ambitious strategy to diminish reliance on foreign components, with a commitment to replacing 80% of US-restricted components with locally sourced parts by the end of last year, aiming for a complete transition by 2024. AMEC's product lineup, particularly its core etching tools like the capacitively coupled plasma (CCP) and inductive coupled plasma (ICP) systems, is pivotal to its revenue stream, anticipated to constitute 75% of its total earnings for the year. These etching tools, essential for the intricate process of sculpting microscopic circuits onto semiconductor wafers, have gained substantial traction among Chinese foundries. This is a testament to AMEC's technological prowess and its role in bolstering China's self-sufficiency in semiconductor manufacturing. 

The company's market share in domestic CCP equipment is expected to soar to 60%, a significant leap from 24% in October 2022. Similarly, AMEC's foothold in the ICP equipment market is projected to reach an impressive 75%, marking a dramatic rise from virtually zero. This growth is particularly notable against the backdrop of declining mainland sales of once-dominant US chip equipment manufacturers like Lam Research. AMEC's technological offerings, characterized by advanced etching capabilities and innovation-driven development, cater primarily to China's semiconductor fabs. These fabs are integral components of the nation's strategic push towards self-reliance in semiconductor production, a sector that has become a focal point of international geopolitical tensions and trade restrictions. As such, AMEC not only stands as a technological leader but also as a key enabler of China's ambitions in the global semiconductor arena.

Scalable Electronic-Grade Van der Waals Tellurium Thin Films

Scalable Electronic-Grade Van der Waals Tellurium Thin Films: A study demonstrated a scalable ALD route for creating electronic-grade van der Waals tellurium (Te) thin films. By employing acid-base precursors and co-reactants, the research team successfully produced dense, continuous Te thin films on a wafer scale. This breakthrough is crucial for various electronic devices, promising enhancements in transistors, rectifiers, and selection elements.

Process Controlled Ruthenium on 2D Engineered V-MXene via Atomic Layer Deposition for Human Healthcare Monitoring

Engineering 2D MXene Family with Precious Metals: A novel approach has been introduced for the engineering of the 2D MXene family using precious metals through ALD techniques. This development opens new possibilities in personal healthcare devices, clean energy conversion, and storage systems by enabling the integration of precious metals like Ru, Ir, Pt, and Pd at an atomic scale, enhancing surface activity and energy performance​​.

In the study, a traveling-wave type thermal Atomic Layer Deposition (ALD) reactor (Lucida D-100, NCD Technology, Korea) was utilized to deposit ruthenium films on SiO2/Si wafers and delaminated V2CTx MXene. The ruthenium metal-organic precursor used was tricarbonyl(trimethylenemethane)ruthenium, [Ru(TMM)(CO)3], provided by TANAKA Precious Metals (Japan). Oxygen (O2) served as the reactant gas in the deposition process. The ALD process involved a sequence of precursor pulsing, nitrogen purging, reactant gas pulsing, and another nitrogen purging to ensure self-limiting growth and uniform film deposition.

A schematic of atomic layer deposition process and step coverage of ALD-Ru film. Credit: Advanced Science (2023). DOI: 10.1002/advs.202206355

The key highlights and potential applications of this research include:

Enhanced Temperature Sensing Performance: The delaminated V-MXene engineered with ruthenium via ALD shows a threefold increase in temperature sensing performance compared to V-MXene alone. This improvement is attributed to the highly ordered few-layer structure of V-MXene and the controlled atomic doping of ruthenium, forming a heterostructure that enhances sensing and reversibility.

Advanced Material Characterization: The study uses high-resolution electron microscopy techniques coupled with next-generation technology for detailed investigation of the heterostructure's formation, providing insights into the role of ruthenium in improving the sensor's performance.

Potential for Healthcare Applications: The sensor's high sensitivity and reliability in temperature detection make it suitable for various healthcare applications, including real-time skin temperature monitoring, non-contact touch, and breathing rate detection. This could be particularly useful for personal healthcare devices, offering a non-invasive way to monitor vital signs and detect potential health issues early.

Human-Machine Interface: The sensor's ability to detect temperature changes accurately and reliably can be applied in human-machine interfaces, such as wearable devices or smart textiles, enhancing user interaction through temperature-sensitive controls or feedback mechanisms.

Scalability and Environmental Consideration: The use of an industrially scalable ALD technique for sensor development, combined with a mild etching process for V-MXene synthesis, points towards the potential for large-scale production with reduced environmental impact.

Versatility and Multifunctionality: The combination of V-MXene's large surface area, hydrophilicity, and the electronic properties of ruthenium suggests that beyond temperature sensing, this material system could be explored for other applications like humidity sensing, energy storage, and conversion, indicating a broad scope for future research and development.

Wednesday, February 7, 2024

Tyler J. Myers Launches The ALDepartment YouTube Channel to Explore and Expand the World of Atomic Layer Deposition

Tyler J. Myers has launched a new initiative called The ALDepartment, following his departure from the ALD Stories podcast. This project aims to delve deeper into the field of Atomic Layer Deposition (ALD) by creating a platform that encompasses a wide array of ALD-related topics. The ALDepartment, hosted on YouTube, is set to feature educational content, interviews with influential figures in the ALD community, commentary on recent developments within the field, and even some entertainment-focused videos.

Myers' first video on the channel serves as an introduction, outlining his motivations for starting this venture and what viewers can expect from future content. 

Tuesday, February 6, 2024

Powering the Future: The Rise of Compound Semiconductor Substrates and Epiwafers

Yole Group reports that the compound semiconductor substrate market is on the brink of a significant transformation, poised to reach a staggering US$3.3 billion by 2029, with an impressive compound annual growth rate of 17% from 2023 to 2029. This growth is underpinned by the relentless innovation and strategic foresight of leading players like Wolfspeed and Coherent, who are continuously refining their product portfolios and expanding their market footprints.

Atomic Layer Deposition (ALD) and Atomic Layer Etching (ALE) play specific roles in the compound semiconductor industry. ALD is used to apply ultra-thin layers crucial for semiconductor devices, especially in insulating layers and gate dielectrics in transistors. ALE, with its precise etching capability, is key for crafting fine details in devices, often used in the patterning of nanoscale structures in LEDs and high-frequency transistors. These technologies support the development of advanced, reliable applications in power electronics and photonics.

At the heart of this industry evolution are the advancements in compound semiconductor technologies, spanning materials such as Silicon Carbide (SiC), Gallium Nitride (GaN), and Indium Phosphide (InP). These materials are catalyzing a revolution across various sectors, with SiC leading the charge in the automotive industry, particularly within the burgeoning 800V electric vehicle segment. GaN, on the other hand, is making inroads into consumer electronics and automotive applications, promising to redefine power electronics with its superior efficiency.

Check link below for High-Res graph

The impact of compound semiconductors extends beyond power electronics into the realm of photonics, where InP and GaAs are setting new benchmarks. InP, for instance, is witnessing a resurgence, driven by its critical role in AI applications, while GaAs photonics continues to grow, albeit at a steadier pace.

Yole Group, a market research and strategy consulting firm, in its latest "Status of Compound Semiconductors Industry 2024" report, provides an exhaustive analysis of these trends. The report delves into each substrate's market dynamics and technological advancements, offering a comprehensive overview of the ecosystem.

LINK: Compound semiconductors industry: an unprecedented promise (

As the industry stands at the precipice of transitioning to larger diameter substrates, the demand for high-data-rate lasers in AI is pushing for a shift to 6” InP substrates. Concurrently, GaAs is exploring the potential of 8” manufacturing for MicroLEDs, despite the challenges it faces against OLED technology.

In this dynamic landscape, companies like Wolfspeed and Coherent are not just participants but are leading the charge towards a more efficient, technologically advanced future. Their efforts in expanding material capacity and forging strategic alliances are testament to the industry's readiness to embrace the next wave of semiconductor innovation.

Saturday, January 27, 2024

AlixLabs Celebrates Gold Sponsorship at ALD/ALE 2024 in Helsinki: Honoring Dr. Tuomo Suntola and Embracing Advances in Atomic Layer Etching

 We are proud to be Gold Sponsors of ALD/ALE 2024 in Helsinki, Finland . We look forward to contribute to the conference program and meet you in the exhibition. We especially look forward to join the celebration 50 Years of ALD and honor the inventor and Millennium Prize Winner 2018 Dr. Tuomo Suntola.

It is also a prime event for Atomic Layer Etching this year since our CTO Dr. Dmitry Suyatin and our Advisory Board Member Prof. Fred Roozeboom are co-chairing the ALE Conference!

Please visit The Conference Page for full details:

Thursday, January 25, 2024

Chipmetrics sichert sich 2,4 Mio. Euro Seed-Finanzierung für Produktinnovation und globale Expansion

24. Januar 2024 – Joensuu, Finnland - Chipmetrics Ltd, ein Technologieunternehmen im Bereich Atomic Layer Deposition (ALD) und Pionier in der Entwicklung von 3D-Prüfelementen mit ultrahohem Aspektverhältnis für die Vermessung von fortgeschrittenen Halbleiter- und Dünnschicht-Produktionsprozessen, hat erfolgreich eine Finanzierungsrunde in Höhe von 2,4 Millionen Euro abgeschlossen. Das internationale Investorenkonsortium wird vom High-Tech Gründerfonds (HTGF) und OCCIDENT aus Deutschland angeführt. Zu den weiteren Investoren zählen Innovestor, REDSTONE und BALD Engineering.

Gründungs- und Management-Team von Chipmetrics: v. l. n. r. Feng Gao (CTO), Pasi Hyttinen (CDO) und Mikko Utriainen (CEO) (Bild: Chipmetrics)

Die Investition bestätigt die bahnbrechenden Fortschritte von Chipmetrics im Bereich der auf PillarHall®-Chips basierenden Messtechnologie, die das Unternehmen an die Spitze der Konformitätsmessung in Materialabscheidungsprozessen gebracht hat. Die Finanzierung wird es Chipmetrics ermöglichen, die Produktentwicklung zu beschleunigen, die Produktionskapazität zu erhöhen und die Marktpräsenz mit dem bestehenden internationalen Kundenstamm auszubauen.

Mikko Utriainen, Gründer und CEO von Chipmetrics, unterstreicht die Bedeutung dieser Investition für die Innovationsbestrebungen des Unternehmens und seine globale Marktexpansion. „Diese Investition gibt unseren Wachstumsplänen und unserem technologischen Fortschritt weiteren Auftrieb. Wir sind entschlossen, unser Produktportfolio zu erweitern, unsere Messlösungen zu verfeinern und unser globales Vertriebsnetz zu stärken“, so Utriainen.

Olaf Joeressen, Senior Investment Manager beim HTGF, kommentiert: „Der Fokus des Teams auf innovative Lösungen für seine Kunden ist beeindruckend und ich freue mich auf weitere Produkt- und Serviceinnovationen von Chipmetrics!“

Simon Schild von Spannenberg, Investment Manager bei OCCIDENT, ergänzt: „Chipmetrics hat sich mit seinen innovativen PillarHall® Testchips bereits eine starke Position in der Dünnschichtprozesskontrolle aufgebaut. Die Produkte von Chipmetrics bieten eine einzigartige Präzision, sowie kosteneffiziente Messungen von komplexen 3D-Strukturen. Unser Investment unterstreicht das Vertrauen in das Chipmetrics-Team und in den Erfolg dieser hochinnovativen Technologie auf dem globalen Halbleitermarkt.“

Über Chipmetrics

Chipmetrics Oy entwickelt und liefert messtechnische Lösungen für Herstellungsprozesse in der Halbleiterindustrie. Das Unternehmen vertreibt innovative Messchips und Messdienstleistungen, deren Anwendungen sich auf die ALD-Technologie konzentrieren. Das Hauptprodukt des Unternehmens ist der PillarHall®-Messchip zur Messung der erzielbaren Konformität von Schichten in Dünnschicht-Produktionsprozessen. Das Unternehmen wurde 2019 gegründet und hat seinen Sitz in Joensuu, Finnland. Darüber hinaus hat das Unternehmen Mitarbeiter und Vertriebspartner in Japan, Südkorea, den USA und Deutschland.
Weitere Informationen finden Sie unter

Über den High-Tech Gründerfonds  

Der Seedinvestor High-Tech Gründerfonds (HTGF) finanziert Technologie-Start-ups mit Wachstumspotential und hat seit 2005 mehr als 700 Start-ups begleitet. Mit dem Start des vierten Fonds hat der HTGF rund 1,4 Milliarden Euro under Management. Das Team aus erfahrenen Investment Managern und Start-up-Experten unterstützt die jungen Unternehmen mit Know-how, Unternehmergeist und Leidenschaft. Der Fokus liegt auf High-Tech Gründungen aus den Bereichen Digital-Tech, Industrial-Tech, Life Sciences, Chemie und angrenzende Geschäftsfelder. Rund 5 Milliarden Euro Kapital investierten externe Investoren bislang in mehr als 2.000 Folgefinanzierungsrunden in das HTGF-Portfolio. Außerdem hat der Fonds bereits Anteile an mehr als 170 Unternehmen erfolgreich verkauft.  Zu den Fondsinvestoren der Public-Private-Partnership zählen das Bundesministerium für Wirtschaft und Klimaschutz, die KfW Capital sowie 45 Unternehmen aus unterschiedlichsten Branchen. Mehr erfahren unter:


OCCIDENT ist ein internationaler Venture Capital Investor mit Standorten in München und Zug, ist eigentümergeführt und investiert eigenes Vermögen. Der Anspruch ist, durch nachhaltige und sinnstiftende Investitionen einen positiven Beitrag für die Gesellschaft zu leisten. OCCIDENT investiert in innovative Deep Tech Startups mit exzellenten Technologien, breiten Anwendungsmöglichkeiten und dem Potential für Weiterentwicklung aus den Bereichen Lifesciences, Industrial Tech und Digital. OCCIDENT ist ein finanzstarker, unternehmerisch orientierter Partner und bietet vielseitige Unterstützung der Portfoliounternehmen durch ein kompetentes Expertenteam und die eigene Erfahrung als Entrepreneur.

Über Innovestor

Innovestor ist eine finnische Investmentgesellschaft, die sich auf Risikokapital und Immobilien konzentriert. Darüber hinaus bietet Innovestor Dienstleistungen im Bereich Corporate Venturing an. Das Unternehmen verwaltet derzeit sechs VC-Fonds mit einem Gesamtkapital von über 250 Millionen Euro. Mit fast 100 Wachstumsunternehmen in den Bereichen Technologie, Biowissenschaften und Gesundheit ist es eines der größten privaten Risikokapitalportfolios in den nordischen Ländern. Unser Ziel ist es, gutes Geld zu verdienen.

Über Redstone

Redstone, mit Hauptsitz in Berlin und Büros in Zürich und Helsinki ist eine europäische Venture-Capital-Gesellschaft, die ausgewählte Investmentstrategien verfolgt. Mit seinem datengesteuerten Ansatz entwickelt Redstone eine starke Branchenkompetenz und baut wertvolle Netzwerke für sein Portfolio auf.

Als einer der aktivsten Frühphaseninvestoren in Europa verwaltet Redstone ein vielfältiges Portfolio von über 80 Unternehmen und konzentriert sich auf Fintech, Industrial Tech, Built World, Social Impact und Quantum.


Mikko Utriainen, CEO, Chipmetrics Ltd


Tel: +358 10 348 1344

Chipmetrics Secures € 2.4 Million Seed Funding Round to Accelerate Product Innovation and Global Expansion.

24.01.2024– Joensuu, Finland: Chipmetrics Ltd, the Atomic Layer Deposition (ALD) technology company and a pioneer in 3D ultra-high aspect ratio test elements for metrology of semiconductor and advanced thin film material manufacturing, proudly announces the successful closure of a €2.4 million investment round. The international investor syndicate was led by High-Tech Gründerfonds (HTGF) and co-led by OCCIDENT from Germany. Other investors were Innovestor, REDSTONE and BALD Engineering. This substantial investment serves as a testament to Chipmetrics’ groundbreaking advancements in the PillarHall® metrology test chip technology, positioning the company as a frontrunner in conformality measurements in material deposition processes. The funds raised will be instrumental in accelerating Chipmetric’s product development efforts, scaling production capabilities, and expanding its market presence with the already existing international customer base.

Founders and management team of Chipmetrics Ltd. Persons in the picture, from left to right: Feng Gao (CTO), Pasi Hyttinen (CDO) and Mikko Utriainen (CEO).

Mikko Utriainen, the visionary founder & CEO of Chipmetrics, highlights the investment’s role in driving the company’s innovative pursuits and global market expansion. “This investment is a boost for our growth plans and technological advancements. We are committed to enhancing our product portfolio, refine our measurement solutions, and reinforce our global sales network ” Utriainen states.

Olaf Joeressen, Senior Investment Manager of HTGF comments: “The team’s focus on delivering innovative solutions to their customers is impressive, and I look forward to more product and service innovations delivered by Chipmetrics!”

Investment manager Simon Schild von Spannenberg from OCCIDENT continues: “Chipmetrics has already established a reputable position in thin film process development with its innovative PillarHall® Lateral High Aspect Ratio (LHAR) test chips. Chipmetrics’ products convince with their unique user interface, precision, speed, and cost-efficiency in the complex 3D measurements. Our investment reflects our confidence in the Chipmetrics’ team and the success of the highly innovative technology on the global semiconductor market.”

About Chipmetrics

Chipmetrics Oy develops and delivers metrology solutions for manufacturing processes for the semiconductor industry. The company’s business is based on the sale of innovative metrology chips and measurement services whose applications are focused on ALD technology. The company’s main product is the PillarHall® metrology chip for thin film process conformality measurement. The company was founded in 2019 and its head office is in Joensuu, Finland. In addition, the company has employees and sales partners in Japan, South Korea, the USA, and Germany.

For more information, visit

About High-Tech Gründerfonds

The seed investor High-Tech Gründerfonds (HTGF) finances tech start-ups with growth potential and has supported more than 700 start-ups since 2005. With the launch of its fourth fund, HTGF now has about 1.4 billion euros under management. Its team of experienced investment managers and start-up experts support young companies with expertise, entrepreneurial spirit and passion. HTGF’s focus is on high-tech start-ups in the fields of digital tech, industrial tech, life sciences, chemistry and related business areas. To date, external investors have injected about 5 billion euros of capital into the HTGF portfolio via more than 2,000 follow-on financing rounds. In addition, HTGF has already successfully sold shares in more than 170 companies. Fund investors in this public-private partnership include the German Federal Ministry for Economic Affairs and Climate Action, KfW Capital and 45 companies from a wide range of industries.

For more information at


OCCIDENT is an international venture capital investor with offices in Munich and Zug, is owner-managed and invests its own assets. Its mission is to make a positive contribution to society through sustainable and meaningful investments. OCCIDENT invests in innovative deep tech start-ups with excellent technologies, broad application possibilities and the potential for further development in the fields of life sciences, industrial tech and digital. OCCIDENT acts as a long-term enabler for highly innovative startups and visionary founders.

About Innovestor

Innovestor is a Finnish investment company focusing on venture capital and real estate. In addition, we offer corporate venturing services. The firm currently manages six VC funds with total capital of over €250 million. Consisting of almost 100 growth companies across multiple sectors of technology and life science & health, it represents one of the largest private venture-backed portfolios in the Nordics. Our mission is to make good money.

About Redstone

Redstone, headquartered in Berlin with offices in Zurich and Helsinki, is a European early-stage venture capital firm that pursues selected investment strategies. With its data-driven approach, Redstone develops strong sector expertise, building valuable networks for its portfolio. As one of Europe’s most active early-stage investors, Redstone manages a diverse portfolio of over 80 companies, focusing on Built World, Climate, Fintech, Industrial Tech, Social Impact, and Quantum.

Contact Information:

Mikko Utriainen, CEO, Chipmetrics Ltd

Tel: +358 10 348 1344

Tuesday, January 23, 2024

Significant Investment in ALD Technology for MicroLED & AR: Oxford Instruments' Pioneering Role

Oxford Instruments, a renowned name in the realm of technology, has recently made a significant contribution to the advancement of MicroLED and Augmented Reality (AR) devices. The company has supplied its state-of-the-art Atomic Layer Deposition (ALD) technology to a leading UK manufacturer. This move is set to revolutionize the way we experience consumer-immersive reality products and display devices.

The Rise of MicroLED and AR

The demand for wearable devices with compact form factors and high-definition displays is skyrocketing. This trend is driving extensive research and development in the industry. MicroLEDs stand out in this arena for their ability to offer incredibly small die pitch sizes (less than 10 µm), enabling the miniaturization of wearable display devices without compromising image resolution. However, as pitch sizes shrink, the challenges in manufacturing increase, particularly regarding the damage caused during mesa formation and isolation steps. This damage can significantly impede device performance.

Oxford Instruments' Breakthrough with Plasma ALD

At the 2023 International Conference on Nitride Semiconductors (ICNS) in Fukuoka, Japan, the spotlight was on Plasma ALD technology, provided by Oxford Instruments. This technology has been hailed for its ability to mitigate damage and substantially boost external quantum efficiency – a critical measure of material performance. The Plasma ALD technology from Oxford Instruments, especially their high-K passivation solution, is optimized for smaller dies, enhancing performance in devices like head-mounted displays for virtual reality and smartwatches.

Oxford Instruments' ASP tool for PEALD offers precise, plasma-enhanced thin-film deposition, ideal for semiconductor, photonics, and microLED applications.

Klaas Wisniewski, Oxford Instruments' Strategic Business Development Director, expressed excitement about their Plasma ALD technology's growing market presence. "Our low-damage Plasma ALD technology, especially on our 200 mm capable platform, has been instrumental in doubling the external quantum efficiency for some of our customers at ICNS," said Wisniewski.

Looking Forward: Photonics West 2024

Oxford Instruments is not resting on its laurels. As a leader in compound semiconductor processing equipment, the company is set to participate in Photonics West 2024 in San Francisco. There, Oxford Instruments will showcase its latest optoelectronics processes for augmented, virtual, and mixed reality, as well as quantum and data transfer applications critical for AI and machine learning. This event will be an excellent opportunity for industry professionals to learn how Oxford Instruments' etch, deposition, and Ion Beam process solutions can enhance their projects, ensuring higher efficiency and lower costs.

In conclusion, Oxford Instruments' investment in ALD technology for MicroLED and AR is a game changer, marking a significant step forward in the evolution of consumer electronics and immersive reality experiences.

Atomic Scale Innovation Workshop in Copenhagen


Hosted by ATLANT 3D, this event is a gathering point for industry experts, researchers, and technical professionals, all focused on exploring the vast potential of Atomic Layer Deposition (ALD) and related technologies.

The future of manufacturing lies in precision and sustainability. At ATLANT3D, we are deeply committed to advancing the frontiers of atomic scale manufacturing, unlocking novel avenues for materials development and scalable applications. This conference is our call to arms, bringing together the brightest minds to push the boundaries of what’s possible.

Topics & Highlights:
• ALD's current market and applications in various industries.
• In-depth presentations on advanced materials innovation.
• Interactive discussions on the future of atomic layer processing.

Topic: “Atomic Layer Deposition: Its Evolution, Diverse Applications, and Future Prospects”.
• DR. Maksym Plakhotnyuk 🇺🇦, CEO & FOUNDER OF ATLANT 3D
Topic: “Atomic Layer Processing: Driving Global Innovation in Advanced Manufacturing”.
• PROF. DR. Erwin Kessels, EINDHOVEN UNIVERSITY OF TECHNOLOGY Topic: “Innovations in Plasma Processing for Nanoscale Fabrication”.
Topic: “Advancements in 2D Materials Synthesis Through Atomic Layer Deposition”.
Topic: “Progress and Opportunities for Atomic Layer Deposition to Facilitate Next-Generation Batteries”.
Topic: “Harnessing ALD for Next-Generation Photovoltaics and Electrochemical Energy Storage”.
Topic: “ALD Deposited Ultrabarriers for Applications in Electronics, Energy, and Medical Fields”.
• DR. Ville Miikkulainen, ALTO UNIVERSITY
Topic: “Photo-assisted ALD: Enabler for Direct-Write ALD”.

Download brochure:

Special Features:
• Exclusive visit to ATLANT 3D's state-of-the-art A-HUB & Laboratory facilities.
• A social evening for informal networking and collaboration.

Saturday, January 20, 2024

Revolutionizing CPU Memory: How ReRAM is Shaping the Future of High-Bandwidth Applications

In the Semi Engineering article by Brett Lowe, "Developing ReRAM As Next Generation On-Chip Memory For Machine Learning, Image Processing And Other Advanced CPU Applications," the focus is on the burgeoning field of Resistive Random Access Memory (ReRAM) as a promising solution for the limitations of current on-chip CPU memory. The article highlights the inefficiencies in modern CPU operations, primarily due to the energy consumption and delays caused by data transfer between the CPU and off-chip memory. SRAM, the prevalent on-chip memory, falls short in meeting the requirements of advanced applications like AI and 8K video processing, which demand memory access bandwidths up to 10 terabytes per second. ReRAM emerges as a viable alternative, boasting a non-volatile memory cell structure that uses memristor materials to enable data storage. This technology facilitates significant improvements in storage density by employing a 3D stacking approach.

The article delves into the intricacies of ReRAM's structure and functionality, utilizing SEMulator3D Virtual Fabrication for process simulation and architectural visualization. The discussed 3D ReRAM model comprises multiple layers of wordlines and memristors, strategically organized for optimized storage density. The programming of memristors in ReRAM, requiring low current and voltage, aligns well with the integration into advanced logic devices. The piece concludes with the assertion that ReRAM stands as a robust contender to replace SRAM in on-chip memory, particularly for high-bandwidth CPU applications. Its potential to significantly reduce energy consumption and processing delays in data movement positions ReRAM as a pivotal innovation for future CPU developments.

Unveiling the Future of Material Science: Key Takeaways from the MLD and ALD Webinar

In the dynamic world of material science, the recent Applied Materials Picosun webinar held on January 16, 2024 centered on Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD), offered a deep dive into these groundbreaking technologies and their applications in crafting advanced functional properties. 

LINK to recording: Atomic layer deposition (ALD) and molecular layer deposition (MLD) together present an elegant technique for the deposition of novel inorganic-organic materials. (

The webinar was given by Topias Jussila, Doctoral Researcher, Aalto University, Finland. Let's explore how ALD and MLD are shaping the future of materials at the nanoscale.

The Emergence of MLD

Molecular Layer Deposition, though a relative newcomer compared to ALD, has quickly garnered attention for its unique capabilities. MLD, which operates on the principle of sequential molecular layering, offers a versatile platform for creating hybrid materials with tailored properties. The webinar expertly delineated the different types of MLD, such as metal-aliphatics, metal-aromatics, and inorganic-organic multilayers, each presenting its distinct advantages in material fabrication.


Synergy of ALD and MLD

The fusion of ALD with MLD emerged as a focal point of discussion. This combination enhances the material properties, allowing for precise control at the nanoscale. The synergy of ALD and MLD opens doors to innovative applications, particularly in microelectronics and nanotechnology, by creating materials with unprecedented electrical, optical, and mechanical properties.


Applications That Reshape Industries

The practical applications of MLD and ALD-MLD are vast and varied. Key areas include:

Flexible Barrier Layers: MLD is particularly effective in creating ultra-thin, flexible barrier layers that are impermeable to gases and moisture. This is crucial for applications like organic light-emitting diode (OLED) displays and flexible electronics, where moisture and oxygen can degrade the performance of the devices.

Encapsulation: MLD provides an excellent method for encapsulating sensitive components, protecting them from environmental factors without compromising their functionality.

Photocatalysis: MLD materials are used in photocatalysis applications, which are important in environmental remediation and energy conversion technologies.

Electronics and Semiconductors: The combination of MLD with ALD is particularly advantageous in the electronics and semiconductor industries. It enables the precise deposition of thin films with tailored electrical and optical properties, crucial for advanced microelectronics and photonics.

Biomedical Applications: The versatility of MLD and ALD-MLD coatings also finds applications in the biomedical field, such as in drug delivery systems and bioimaging, where biocompatibility and controlled interactions with biological environments are essential.

Industrialization and Future Outlook

As for the industrialization of MLD, it is a relatively newer field compared to ALD. While ALD has been widely industrialized, particularly in the semiconductor industry, MLD is still primarily in the research and development stage, with growing interest in transitioning to industrial applications. The unique capabilities of MLD in creating organic-inorganic hybrid materials are driving research and potential industrial applications, but widespread industrial adoption might still be in progress.


The ALD and MLD webinar served as a beacon of knowledge, shedding light on the latest advancements and future prospects of these technologies. As we step into an era where material science plays a critical role in technological advancements, the insights from this webinar not only educate but also inspire further exploration and innovation in the field. The future of material science, undoubtedly, holds exciting possibilities, with ALD and MLD at its forefront.

Background: Topias Jussila is a second year PhD student at the Department of Chemistry and Materials Science, Aalto University, Finland. Topias carried out his Bachelor’s degree in Chemistry at the University of Helsinki and Master’s degree in Functional Materials at Aalto University. For the past two years, Topias has worked intensively with atomic layer deposition (ALD) and molecular layer deposition (MLD) with a target to develop novel thin film materials with advanced functional properties, having the main focus in iron-based inorganic and inorganic-organic materials. In addition to deposition process development, he has employed a wide range of thin film characterization methods to study the composition, structure, and functional properties of the thin films.