Reference: On the dynamics in chemical vapor deposition of InN, Journal of Applied Physics 130, 135302 (2021); https://doi.org/10.1063/5.0061926
Tuesday, October 5, 2021
The dynamics in CVD and PEALD of InN
Reference: On the dynamics in chemical vapor deposition of InN, Journal of Applied Physics 130, 135302 (2021); https://doi.org/10.1063/5.0061926
Tuesday, September 1, 2020
Epiluvac from Sweden launch MOCVD - ALD Combo reactors for Wide Band Gap Epi materials
Epiluvac from Sweden has extended it offer for 200 mm Sic and GaN Wide Band Gap (WBG) Epitaxy reactors for SiC and GaN to include also ALD process mode. This is very impressive since there are very few that can master the two most advanced CVD processes on the market, MOCVD Epitaxy resp. ALD and now even in the same reactor!
From an ALD point of view it is also very unusaul to have the possibilioty to process at high temperature. Most ALD reactors operate in the range 70 to 600 °C, but Epiluvac reactors can go up all the way to 1800 °C.
SiC (Epiluvac ER3-C1) or GaN (Epiluvac ER3-N1) epitaxy system (https://epiluvac.com/sic/)
• Up to 200 mm (8”) wafer diameter.
• Excellent uniformity through hot-wall topology, uniform gas flow and cell temperature profiling.
• Up to 1800 °C
• Quartz-free and ready for chlorinated processes.
• Hot wafer loading/unloading in a clean inert atmosphere minimizes particle contamination.
• Modular design with cluster configuration and several automation options.
• Suitable for low/medium volume production and R&D.
Friday, February 7, 2020
Veeco Introduces Suite of MOCVD Systems to Enable High Performance Photonics Devices
“Leading photonics manufacturers are currently seeing the benefits of our Lumina MOCVD system and are validating its impact in the manufacturing of high-volume photonics devices,” said Gerry Blumenstock, Senior Vice President, Product Line Management. “As the world’s leader in MOCVD equipment, the Lumina platform is the answer for the next generation VCSEL, EEL andmini / micro LED devices. With its proven design, technology and performance, Lumina provides exciting opportunities for the next generation of photonics devices.”
The Lumina R480 and R480S systems are based on Veeco’s industry leading MOCVD TurboDisc® technology which features excellent uniformity and low defectivity over long campaigns for exceptional yield and flexibility. In addition, Veeco’s proprietary technology drives uniform thermal control for excellent thickness and compositional uniformity. Providing a seamless wafer size transition, the system is capable of depositing high quality As/P epitaxial layers on wafers up to six inches in diameter. The R480 and R480S systems allow users to customize their systems for maximum value.
Veeco will be exhibiting at Photonics West in San Francisco, CA from Tuesday, February 4 to Thursday, February 6. Stop by booth number 1456 to learn more about Veeco’s MOCVD and ion beam sputtering solutions for photonics applications.
Wednesday, July 3, 2019
Aixtron delivers 3x2" CCS MOCVD system to Nagoya University for DUV opto device research
Nagoya University is a leading Japanese research institution for semiconductor materials, especially in the field of GaN-based structures. By focusing on the development of DUV devices using Aixtron’s 3x2-inch Flip Top CCS MOCVD tool, IMaSS is targeting a wide range of future-oriented applications in areas such as agriculture, health or water purification.
Thursday, April 4, 2019
Applied Optoelectronics orders MOCVD technology from AIXTRON
Herzogenrath/Germany, 2 April, 2019 – AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, today announced the delivery of multiple AIX 2800G4 systems to US-based photonic maker Applied Optoelectronics, Inc. (AOI) which focuses on the design, development, and manufacturing of advanced optical devices, packaged optical components, optical subsystems, laser transmitters, and fiber optic transceivers. The delivered tools feature a 12x4-inch configuration.
AIX 2800G4-TM
Dr. Klaus Anselm, Vice President of Semiconductor Products at AOI, comments: "Following our good experience with AIXTRON systems in the past, we will also utilize the proven Planetary® technology from Germany for our production expansion. The AIX 2800G4 has convinced us in all test phases, so that we are now looking forward to use the system for launching volume production of our next generation of optoelectronic components."
"We are very pleased that AOI has added our market-leading AIX 2800G4 tool to its existing manufacturing equipment. A system that has acquired a reputation over the past few years as the tool of record for the production of high-quality laser devices in the semiconductor industry. We are looking forward to the collaboration with AOI," says Dr. Bernd Schulte, President of AIXTRON SE.
Wednesday, April 3, 2019
VEECO Demonstrates Thought Leadership at Technical Conferences in 2Q/2019
PLAINVIEW, New York, April 2, 2019—Veeco Instruments Inc. (Nasdaq: VECO) today announced its leading technologists are scheduled to speak at seven technical events throughout Q2 2019. The forthcoming presentations, which follow several notable appearances in Q1, highlight Veeco’s depth and breadth of expertise in working with customers to break through production-scale barriers that will ultimately lead to the wide adoption of game-changing trends in big-data, high-speed communications, artificial intelligence, autonomous vehicles, high resolution displays and more.
Through these papers, Veeco explains how it solves tough materials engineering challenges with advances in its deposition, etch, lithography and wet processing technologies used in applications such as next-generation advanced packaging, photonics, sensors, MEMS, micro-LEDs, power electronics, high bandwidth memory and related devices. Presentations in the second quarter include:
- MRS Spring Meeting & Exhibit (April 22-26; Phoenix, AZ)—Tania Henry, process development engineer, will present “Influence of Intermixing on Perpendicular Magnetic Anisotropy of Ion-Beam-Deposited CoFeB MTJs for STT-RAM,” on April 25 during the annual meeting focused on the future of materials science
- Critical Materials Council Conference (April 25-26; Saratoga Springs, NY)—Drew Hanser, vice president of technology, will present at the fourth annual forum for discussing actionable information related to semiconductor fab materials. Hanser’s talk, “Material Integration Challenges for GaN on Si for Power and RF Devices,” takes place on April 25 during Session II: Immediate Challenges of Materials & Manufacturing
- Society of Vacuum Coaters TechCon (April 27-May 2; Long Beach, CA)—At one of the world’s leading vacuum coating technology conferences, senior research scientist Binyamin Rubin will discuss “Monochromatic and Broadband Optical Monitoring for Deposition of Band Pass Filters,” on April 29. The Veeco team will also be exhibiting its latest advances in ion beam deposition systems for optical coatings at booth #229
- CS ManTech (April 29-May 2; Minneapolis, MN)—Phillip Tyler, process development engineer, will present “Development of Advanced Lift Off Processes for 5G and VCSEL Applications.” Stop by Veeco’s booth #609 to learn more about the company’s latest innovations in compound semiconductor and wet processing technologies
- ECTC (May 28-31; Las Vegas, NV)—Dr. Ajit Paranjpe, chief technology officer, will co-author a presentation on “High-Yield Precision Transfer and Assembly of Gallium Nitride (GaN) Micro-LEDs Using Laser Assisted Micro Transfer Printing,” with experts from the University of California, Los Angeles
- EUVL Workshop (June 10-13; Berkeley, CA)—At this year’s workshop focused on the fundamental science of EUV lithography and its continued extension to support Moore’s Law, Sandeep Kohli, principal research scientist, will present “Ion Beam Technology Roadmap for EUV Mask Deposition and Absorber Etch Processes”
- TechConnect World Innovation Conference and Expo (June 17-19; Boston, MA)—Dr. Ganesh Sundaram, vice president of applied technology, will present “Atomic Layer Deposition for Life Science Applications” on June 17 at the Nanomedicine Symposium
- SPIE Advanced Lithography (Feb. 24-28; San Jose, CA)
- “Ion Beam Etching of Advanced Absorber Materials for Sub-5nm EUV Masks”
- “Intra-field Stress Impact on Global Wafer Deformation” (alongside ASML and imec)
- EFDS ALD for Industry (March 19-20; Berlin, Germany)
- “Atomic Layer Deposition Use for Decorative Applications”
- CS International (March 26-27; Brussels, Belgium)
- “Accelerating Photonics Growth through Advances in High-Performance Arsenic/Phosphide (As/P) MOCVD and Wet Processing Technology”
About Veeco
Veeco (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment. Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, Veeco holds technology leadership positions in all these served markets. To learn more about Veeco's innovative equipment and services, visit www.veeco.com.
Saturday, March 23, 2019
Aledia Taps Veeco's Compound Semiconductor Expertise, Citing High-Quality Gallium Nitride Epitaxial Film Performance
Display Technology Innovator Expands Portfolio of Veeco Thin Film Process Technologies to Advance Next-Generation 3D Micro-LEDs
PLAINVIEW, New York, — Veeco Instruments Inc. (Nasdaq: VECO) announced today that Aledia, a developer and manufacturer of next-generation 3D LEDs for display applications, has expanded its portfolio of Veeco thin film process equipment to support the development and production of advanced 3D micro-LEDs. Aledia cited Veeco’s proven leadership in compound semiconductor applications, GaN-on-silicon growth performance, and capability to grow a full range of high-quality epitaxial films as key factors influencing its decision.“We have been impressed with the performance of Veeco’s Propel™ GaN MOCVD platform for large-wafer 3D LED production, and naturally turned to Veeco again to support our advanced LED development,” said Philippe Gilet, co-founder and CTO of Aledia. “Veeco’s solutions meet our rigorous material quality and system delivery requirements along with unmatched material flux stability and repeatability. We are excited to take the next step with them in producing next-generation 3D micro-LEDs.”
The collaboration between Aledia and Veeco reflects the immense promise of micro-LEDs and other advanced LEDs for the future of displays. Micro-LEDs offer high efficiency, brightness and reliability benefits with shorter response time, enabling lighter, thinner and flexible displays with energy saving advantages for applications such as wearables, smartphones, automotive, signage/large TVs, augmented reality/virtual reality, etc. According to a recent Yole Développement report, there have been close to 1,500 patents filed related to micro-LED display from 125 different companies, with the bulk of activity occurring after 2012.
“With the significant shift toward exploration of micro-LEDs for use in next-generation displays, leaders like Aledia are turning to Veeco,” said Gerry Blumenstock, senior vice president and general manager of Veeco’s compound semiconductor business unit. “Veeco’s proven materials engineering expertise puts us in a unique position to offer innovative thin film deposition technologies for customers tackling tough compound semiconductor research, development and production challenges.”
Veeco will exhibit and present at the CS International Conference, March 26-27, 2019 in Brussels, Belgium. Mark McKee, director of product marketing for Veeco’s MOCVD business unit, will present “Accelerating Photonics Growth through Advances in High Performance As/P MOCVD and Wet Processing Technology,” on March 27, 2019 at 9:50 a.m. CET.
Tuesday, October 30, 2018
Estimating rising demand for Ru thin-films in the next generation chips
STREM Chemicals offers one of the most promising ruthenium amidinate precursors for growing Ru ALD or CVD films
The saturation of Moore’s curve while following systematic downscaling of logic and memory devices has given rise to the biggest challenges involving contacts and interconnects in the chip. The transistors (FinFETs at leading nodes) are getting better and better at smaller dimensions. On the contrary, the shrinking interconnects and contacts at each technology node cause the unwanted resistance-capacitance (RC) delay to increase. Therefore, the chipmakers are exploring new materials to replace conventional tungsten and copper for contacts and interconnects, respectively (see figure below, LINK). At 10 nm, Intel switched over to cobalt for contacts and some, but not all, interconnect layers. Ru is also being explored hugely since Co has some trade-offs as well as higher line resistance (VLSI 2017, Globalfoundries). In fact, there was also news in the market regarding use of Ru implemented in Intel’s 10 nm technology node (TechInsight 2018).Ru is also an excellent candidate for the electrode capacitor in DRAM applications and gate electrode material in CMOS transistor applications because of its high melting point, high oxidation resistance, and low resistivity. Ruthenium’s lower resistivity and ease of dry etching give it a significant advantage over other noble metals like iridium and platinum. Ru seed-layer deposited as a conformal via liner significantly improves copper adhesion and hinders oxygen diffusion in interconnects and through-silicon-via (TSV) applications. Moreover, ruthenium oxide is conductive and therefore, oxygen diffusion from adjacent materials or processes does not hinder the device performance. Recent research reports the use of ruthenium-based materials as an electrode in ferroelectric applications as well.
Thus, as the main bottleneck of next generation ICs, interconnects and contacts are nowadays the major driving factors of the market of high quality specialty chemicals for the performance or function specific materials or molecules. The physical and chemical properties of a single molecule or a formulated mixture of molecules as well as its chemical composition influence the end product performance extensively. Therefore, unlike the other sub-sectors of the chemical industry, the companies manufacturing and marketing specialty chemicals provide more often than not targeted customer service to innovative individual technical solutions for their customers.
Since 1964, Strem Chemicals, Inc. has been serving its clients from academic, industrial and government research and development laboratories as well as commercial scale businesses in the pharmaceutical, microelectronic and chemical / petrochemical industries. Strem (Headquarters: Newburyport, Massachusetts, USA) is a high purity specialty chemicals’ manufacturer and supplier. Strem also provides custom synthesis (including high pressure synthesis) and current good manufacturing practice (cGMP) services. With ISO 9001 certification for Quality Management System (QMS) standard and documentation, most of the Strem’s products are reliably of high purity, typically 99%, with some at 99.9999% metals purity. Strem utilizes a comprehensive range of analytical techniques tailored to each product to insure quality because the researchers typically rely on the supplier's quality procedures and documentation, which may kill a great research idea if poorly conducted. All of Strem's catalogs, since inception, have listed “Color and Form” for every product as primary indicators of quality.
Promotional Blog for Strem Chemicals, Inc.
Researched, produced & written by BALD Engineering AB, Stockholm, 2018-10-30
Abhishekkumar Thakur, Jonas Sundqvist
www.baldengineering.com