Thursday, October 22, 2015

Successful industrialization of high-density 3D integrated silicon capacitors for ultra-miniaturized electronic components

Three high-tech SMEs finalize the joint EU-funded PICS project on innovative ALD materials and manufacturing equipment

 
Caen, Oct. 22, 2015 – Two years after the launch of the PICS project (funded by the FP7 funding instrument dedicated to research for the benefit of SMEs), three European SMEs, IPDiA, Picosun and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved during this program. 

Two new dielectric stacks were developed and integrated into the IPDiA 3D trench capacitors by IPDiA, CEA-Leti and Fraunhofer IPMS-CNT. The initial specifications were fulfilled and proven by electrical measurements. A new record on capacitance density (>500nF/mm² at 3.3V) and an extended operation voltage (10V with 150nF/mm²) were obtained, which expands IPDiA’s ability to meet current market requirements particularly in the field of medical or aeronautics. Qualification procedure was initiated during the project by launching preliminary reliability studies and it will continue in the coming months.
 
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Prototype of medical pills integrating temperature sensor and RF transceiver


3D trench capacitors integrated into Silicon 
 

Publication Overview

Title of Publication Author(s) Link
Picosun ALD enables a new generation of medical devices Picosun click here 
Innovative ALD materials and tools or high densIty 3D integrated capacitors Fraunhofer IPMS click here
Presentation: NIL industrial Days (19-20 March 2015, Berlin) Pinnow (SENTECH) click here
Presentation: EuroNanoForum (10-15 June 2015, Riga) C. Billard (CEA) click here
Presentation: "Development of innovative ALD materials for high density 3D integrated capacitors” ALD Symposium, SEMICON Europe 2014 (7-9 October 2015, Grenoble) M. Czernohorsky (Fraunhofer IPMS-CNT) click here
Presentation: "Ultra-thin high density capacitors for advanced packaging solutions" 20th European Microelectronics and Packaging Conference & Exhibition (September 13-16, 2015 in Friedrichshafen, Germany) K. Seidel (Fraunhofer IPMS-CNT) click here
Presentation: "HfO2-Al2O3 nanolaminate dielectric for ultra-high integrated MIM capacitors" RAFALD workshop (November 16-18, 2015 Grenoble, France). A. Lefevre click here 
PICS Poster   click here