Three high-tech SMEs finalize the joint EU-funded PICS project on innovative ALD materials and manufacturing equipment
Caen, Oct. 22, 2015 – Two years after the launch of the PICS project
(funded by the FP7 funding instrument dedicated to research for the
benefit of SMEs), three European SMEs, IPDiA, Picosun and SENTECH
Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the
major technological results achieved during this program.
Two new dielectric stacks were developed and integrated into the IPDiA
3D trench capacitors by IPDiA, CEA-Leti and Fraunhofer IPMS-CNT. The
initial specifications were fulfilled and proven by electrical
measurements. A new record on capacitance density (>500nF/mm² at
3.3V) and an extended operation voltage (10V with 150nF/mm²) were
obtained, which expands IPDiA’s ability to meet current market
requirements particularly in the field of medical or aeronautics.
Qualification procedure was initiated during the project by launching
preliminary reliability studies and it will continue in the coming
months.
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Prototype of medical pills integrating temperature sensor and RF transceiver
3D trench capacitors integrated into Silicon
Publication Overview
Title of Publication | Author(s) | Link |
---|---|---|
Picosun ALD enables a new generation of medical devices | Picosun | click here |
Innovative ALD materials and tools or high densIty 3D integrated capacitors | Fraunhofer IPMS | click here |
Presentation: NIL industrial Days (19-20 March 2015, Berlin) | Pinnow (SENTECH) | click here |
Presentation: EuroNanoForum (10-15 June 2015, Riga) | C. Billard (CEA) | click here |
Presentation: "Development of innovative ALD materials for high density 3D integrated capacitors” ALD Symposium, SEMICON Europe 2014 (7-9 October 2015, Grenoble) | M. Czernohorsky (Fraunhofer IPMS-CNT) | click here |
Presentation: "Ultra-thin high density capacitors for advanced packaging solutions" 20th European Microelectronics and Packaging Conference & Exhibition (September 13-16, 2015 in Friedrichshafen, Germany) | K. Seidel (Fraunhofer IPMS-CNT) | click here |
Presentation: "HfO2-Al2O3 nanolaminate dielectric for ultra-high integrated MIM capacitors" RAFALD workshop (November 16-18, 2015 Grenoble, France). | A. Lefevre | click here |
PICS Poster | click here |
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