Wednesday, October 7, 2015

3M licensing agreement with Lotus Applied Technology TransFlexALDTM spatial ALD

As reported today : 3M has entered into a licensing agreement with Lotus Applied Technology to access Lotus’s TransFlexALDTM spatial Atomic Layer Deposition (ALD) and barrier materials patent portfolio. TransFlexALD technology enables high-speed, low-cost deposition of single layer “ultra-barrier” coatings on rolls of polymer film using ALD. These coatings play a critical role in the encapsulation of moisture- and oxygen-sensitive electronics, such as OLED (organic light emitting device) lighting and displays, quantum dot films, photovoltaics, and flexible electronics.



“We are pleased to partner with Lotus AT and for the potential of their ALD technology to expand our ultra barrier film solutions portfolio as we integrate it with 3M’s proven technology strengths,” said John Banovetz, vice president of 3M’s Corporate Research Laboratory. “This licensing agreement and our continued product innovation will help 3M increase the performance of our ultra barrier films and offer cost-effective barrier solutions that will allow our customers to provide more competitive products in the flexible electronics markets they serve.”

3M is a leading manufacturer of flexible, transparent ultra barrier films providing encapsulation solutions for display (3M™ Flexible Transparent Barrier Film) and other sensitive electronic applications.



“We are excited to partner with 3M, a distinguished technology leader in the field of ultra barrier films,” said Eric Dickey, president of Lotus Applied Technology. “This technology offers the opportunity to radically improve the performance of single-layer barrier coatings, and 3M’s experience and expertise in this field will enable its rapid deployment in a field of applications that have been demanding higher performance at lower cost.”



(http://lotusat.com) Founded in 2007, Lotus Applied Technology was formed through a spinoff of the thin film process group within Planar Systems, Inc., a pioneer in Atomic Layer Deposition technology and manufacturing. Housed in a fully dedicated 20,000 square foot thin film processing and R&D facility in Hillsboro, Oregon, our team of technologists has been working together for over 20 years, developing innovative solutions to thin film processing challenges. Our equipment set includes a wide array of thin film deposition, lithography, and patterning equipment, including a versatile set of ALD equipment:

  • Six P400 Conventional Pulse-Based Batch ALD reactors
  • Roll to Roll ALD Research Scale Reactor
  • TransFlex Roll to Roll ALD Pilot Scale Reactor
  • Vortex Rotary Batch Reactor