Monday, October 12, 2015

New R2R ALD tool has passed factory acceptance tests at VDL ETG

According to a report on LinkedIn Flexible Electronics Group: A new R2R ALD machine operating fully at atmospheric pressure has past all factory acceptance tests this week at VDL Enabling Technologies Group (VDL ETG), The Netherlands. 



The tool can deposit various atomic layers like aluminum oxide, zinc oxide, hydrogen sulfide, etc. without making use of a vacuum chamber. The adopted technology allows for extremely fast deposition rates that can even exceed by 50-100 times the deposition rates achieved in conventional vacuum-based R2R ALD tools. Built-in air bearings guarantee the scratch-free handling of the webs used as flexible substrates. The deposition can take place at temperatures as low as 80-100 degrees Celsius, which makes this R2R ALD tool extremely useful for the deposition of barriers, buffer layers, optical films, etc. in flexible electronic devices produced on plastic foils.