Saturday, March 31, 2018

Tokyo Electron reports on patterning technology for advancements in scaling

If you are interested in the latest patterning technology you should read this excellent online publication by Ken Nawa at the Process Integration Center, Tokyo Electron. Tokyo Electron is one of the top supplier for wafer based advanced etch, deposition and clean (and more) tools for the semiconductor industry. Besides the evolution of semiconductor by scaling technology, he covers all the latest advanced technologies:
  • Introduction of advanced patterning technology and challenges
  • SADP – Scaling by thin film formation on sidewall  
  • SAQP – Scaling by extending SADP technology 
  • SAB – Scaling by etch selectivity to multiple materials

Full article: LINK 


(screen dump form tel.com)