Wednesday, May 27, 2020
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Samsung has now introduced of EUV lithography into their 7LPP process
Amazing - Samsung has now introduced of EUV lithography into their 7LPP process used in the Exynos 9825. In a direct comparison, it shows the increased density achieved compared to TSMC’s N7 7.5T 3/3-fin layout
In addition, Samsung has introduced a Self Aligned Diffusion Break (SA DB) that likely reduces performance variation caused by the local layout effect of PMOS transistor.
Source: TechInsight https://www.techinsights.com/blog/techinsights-confirms-samsungs-true-7lpp-process-samsung-exynos-990
With a 27nm fin pitch, this disruptive innovation enables a smaller
standard cell height of 270nm while maintaining high drive current with a
3/3-fin layout for both NMOS and PMOS transistors. Credit: TechInsight
Monday, May 25, 2020
AlixLabs ramps up activities and employs Dr. Mohammad Karimi as Principal Scientist
Atomic Layer Etching for Nano Device Fabrication at AlixLabs
We provide an ALE-based method of manufacturing nanostructures with a characteristic size below 20 nm.
This is a new method of nanostructure fabrication using the atomic layer etching process, which is inherently a damage-free etch process. The recently discovered etching process selectivity to inclined surfaces, allows to use walls of tapered structures as a mask. The inclined surfaces can be readily fabricated by e.g. dry etching or epitaxial growth, and will provide masking during the atomic layer etching process.
The key Tool for ALE development - An Inductively coupled plasma reactive ion etching (ICP-RIE) system Apex
SLR from Advanced Vacuum Systems AB. The system is designed for
controlled nanoscale etching of Si, SiO2, Si3N4,
W, Mo and polymers (resists) with fluorine-based chemistry. Unprotected
surfaces of the following materials are not allowed: glasses, noble
metals (Au, Ag, Pt, Cu, Pd), heavy metals (Cd, Pb, Zn) and certain types
of polymers (e.g. silicones). In total, 8 process gases are presently
available: SF6, CHF3, CF4, C4F8, Ar, O2, H2, N2. LINK
The inclined surfaces can be readily fabricated by e.g. dry etching or epitaxial growth, and will provide masking during the atomic layer etching process. This process therefore provides access to fabrication of extremely small structures in a very precise and efficient way.
AlixLabs is a user at Lund Nanlo Lab, Lund University, Sweden
Lund Nano Lab (LNL) is an open research facility that is available to both academic research groups, start-up and company users. Our world-class clean room facility is equipped with state-of-the-art semiconductor processing and metrology equipment.
- ISO 5 and ISO 7 cleanroom facility for cutting edge nano- and micro-fabrication
- 24/7 access for accredited academic research and company users
- Fabrication and analysis of structures on the micro- and nanometer-scale
- Wide range of equipment for Growth, Lithography, Deposition, Etch and Characterisation
- Centre of excellence for Epitaxial growth of III-V materials
- Industrial product development and prototype testing
- Staffed by expert equipment and process experts available to provide user training
Lund Nano Lab is one of the main resources within NanoLund and provides support to research groups in strategically important areas of research such as:
- Nanowire growth and material science
- Fundamental and device physics, electronics and photonics
- Nano-bio and life science
- Exploratory nanotechnology
- Growth and physics of new materials
- Nanowire-based photovoltaics
- Processing of nanoelectronic devices and circuits
Thursday, May 21, 2020
A GLOBAL DIGITAL CONFERENCE ON PARTICLE ATOMIC LAYER DEPOSITION [PALD]
Reuters: Samsung Electronics builds sixth domestic contract chip-making line
PALD2020 Sundqvist - Roating Drum ALD and LPCVD
Roll-to-roll ALD for lithium-ion batteries by Beneq R2R
Tuesday, May 19, 2020
Hafnium, Zirconium: Australian Strategic Materials a step closer to completing commercial pilot plan
Besides the tension with Japan, China's dominance in the supply of zirconium chemicals and materials has highlighted the additional risk in the critical materials supply change for its important semiconductor and high tech industries.
One such action has been setting up a pilot plant in South Korea for hafnium and zirconium metal in joint development with Australias Alkane and its subsidiary Australian Strategic Materials (ASM). The joint undertaking has now moved to the next phase for a commercial operation of a pilot plant as reported by Alkaine below.
Australian Strategic Materials a step closer to completing commercial pilot plan
Australian Strategic Materials (ASM), a wholly owned subsidiary of Alkane Resources is getting closer to completing the construction of a commercial pilot plant facility in South Korea that will enable critical metal oxides, including zirconium and hafnium, to be converted into metals in clean, carbon-free way.
As the Covid-19 pandemic continues to highlight weaknesses in critical minerals supply chains globally, ASM has confirmed in Alkane Resources' quarterly recently it has received interest in both potential future supply and partnership from a number of parties in South Korea and elsewhere. ...
Read more.
The Dubbo Project - The High-k mine in Dubbo, NSW Australia
Hafnium product breakthrough consolidates Dubbo Project business case
China’s water crisis stems the flow of zirconium and rare earths for global industries
Alkane Resources reports that zirconium oxychloride (ZOC) prices are up 40% since January 2017
Monday, May 18, 2020
SEMICON West will be a virtual event July 20-23
Presentations will feature emerging applications that demand the industry’s design and manufacturing expertise. Virtual exhibit booths throughout the detailed, interactive exhibit hall provide the opportunity to network and gather insights just like on a physical show floor.
Attendees can stop by SMART technology pavilions and exhibitors’ booths to view video content, download informative product information, and converse with supplier representatives.
“This will be the deepest, most extensive online global industry event this year,” said David Anderson, President of SEMI Americas and host for the gathering.
“As a virtual conference, SEMICON West 2020 allows us to offer our customers – large and small – A-list speakers and a full exhibition experience, with all the content, interactions and networking opportunities of a physical show – without the associated costs and time of travel.”
Attendees can also join technical sessions, participate in one-on-one or group meetings, and interact with colleagues and industry representatives in networking areas.
Registration opens May 18, 2020; a notification form and detailed information on the event are available at www.semiconwest.org.
ACM Research Enters Dry Processing Market with Launch of CVD/ALD Ultra Furnace
- ACM’s First Furnace Product Targets LPCVD Initially, Oxidation, Annealing and ALD in Future
- ACM Research intends to target customers in China initially, before expanding the offering of the Ultra Furnace into Korea and Taiwan later.
- ACM delivered the first Ultra Furnace tool to a key logic customer’s manufacturing facility in China in early 2020. This tool targets LPCVD, and has been installed in a production environment to begin qualification.
FREMONT, Calif., April 28, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM” or the “Company”) (NASDAQ:ACMR), a leading supplier of wafer cleaning technologies for advanced semiconductor devices, today unveiled the Ultra Furnace, its first system developed for multiple dry processing applications. Initially optimized to deliver high performance for low-pressure chemical vapor deposition (LPCVD), the Ultra Furnace also leverages the same platform to be used for oxidation and annealing processes, as well as for atomic layer deposition (ALD). This achievement represents a two-year collaboration between ACM’s R&D teams located in China and Korea.
“The Ultra Furnace product is the result of collaboration between our talented experts in China and Korea to develop differentiated technology,” stated YY Kim, CEO of ACM Research Korea. “ACM’s team in Korea was established to complement the talents of our world-class Shanghai team, accelerate our time to market, and provide outstanding technical support to our local customers.”
Deposition processes utilize process gases at a high temperature to react with each other on a silicon wafer, forming a silicon oxide or nitride layer on the wafers. The Ultra Furnace system is intended for batch processing of up to 100 12-inch (300mm) wafers. The innovative system design combines newly developed hardware that improves durability, with the company’s proven software technology and a proprietary control system and algorithm. This enables the tool to provide stable control of pressure, gas flow rate and temperature.
While the Ultra Furnace system targets LPCVD processes, with a few changes to the components and layout, each tool can address other target applications. About 85 percent of the hardware configuration remains unchanged, so the alterations for the new application can be achieved efficiently.
ACM Research intends to target customers in China initially, before expanding the offering of the Ultra Furnace into Korea and Taiwan later. ACM delivered the first Ultra Furnace tool to a key logic customer’s manufacturing facility in China in early 2020. This tool targets LPCVD, and has been installed in a production environment to begin qualification.