New Japanese ALD Desktop machine for particle ALD

Here is a new cool japanese ALD machine fro coating on particles and powder. Please visit SUGA for more information here: http://www.suga.ne.jp/ [In Japanese]

 Rotating and vibrating ALD particle chamber from SUGA [Photo frpm SUGA www.suga.ne.jp]

Desktop type ALD device SAL 1000 B (for powder) Promotion Video 

Germanium outperforms silicon in energy efficient gate all around NW transistors

A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab gGmbH) and the Cluster of Excellence Center for Advancing Electronics Dresden (cfaed) at the Dresden University of Technology have demonstrated the world-wide first transistor based on germanium that can be programmed between electron- (n) and hole- (p) conduction.

Full story: LINK

The publication can be found online under:
http://pubs.acs.org/doi/abs/10.1021/acsnano.6b07531

 

Breakthrough at #NaMLab #cfaed: Germanium outperforms silicon in energy efficient transistors w/ n- & p- conduction: https://t.co/k1uOKEKQr7 pic.twitter.com/ML7Up4D3Gl

— cfaed | TU Dresden (@cfaed_TUD) February 3, 2017

UCSD present near-perfect broadband absorption from hyperbolic metamaterial nanoparticles

San Diego, Calif., Feb. 1, 2017 - Transparent window coatings that keep buildings and cars cool on sunny days. Devices that could more than triple solar cell efficiencies. Thin, lightweight shields that block thermal detection. These are potential applications for a thin, flexible, light-absorbing material developed by engineers at the University of California San Diego.

Using 3D patterning and ALD UCSD researchers has developed a new flexible, light-absorbing material that can be used as a transparent, heat-blocking window coatings or infrared detection shields. The materials were fabricated using advanced nanofabrication technologies in the Nano3 cleanroom facility at the Qualcomm Institute at UC San Diego. This facility has a Beneq TSF200 ALD reacor (LINK) possibly used for the ALD processing.

Full paper: “Near-perfect broadband absorption from hyperbolic metamaterial nanoparticles.” Authors of the study are Conor T. Riley, Joseph S. T. Smalley, Jeffrey R. J. Brodie, Yeshaiahu Fainman, Donald J. Sirbuly and Zhaowei Liu.

New light-absorbing material could lead to transparent, heat-blocking window coatings or #infrared detection shields https://t.co/E0erhJDdpM pic.twitter.com/EENdnBdEb7

— UCSD Engineering (@UCSDJacobs) February 1, 2017

Veeco Enters into Agreement to Acquire Ultratech

Feb 2, 2017

PLAINVIEW, NY and SAN JOSE, CA -- (Marketwired) -- 02/02/17 --

• Creates a leading equipment supplier to the growing Advanced Packaging industry
• Increases scale and revenue diversification to improve profitability through industry cycles
• Transaction valued at approximately $815 million, expected to be immediately accretive to non-GAAP EPS
• Conference Call at 5:00pm ET today

Veeco Instruments Inc. (NASDAQ: VECO), a global leader of advanced thin film etch and deposition process equipment, and Ultratech, Inc. (NASDAQ: UTEK), a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs, today announced that they have signed a definitive agreement for Veeco Instruments Inc. ("Veeco") to acquire Ultratech, Inc. ("Ultratech"). The Boards of Directors of both Veeco and Ultratech have unanimously approved the transaction.

Ultratech shareholders will receive (i) $21.75 per share in cash and (ii) 0.2675 of a share of Veeco common stock for each Ultratech common share outstanding. Based on Veeco's closing stock price on February 1, 2017, the transaction consideration is valued at approximately $28.64 per Ultratech share. The implied total transaction value is approximately $815 million and the implied enterprise value is approximately $550 million, net of Ultratech's net cash balance as of December 31, 2016. Post transaction it is projected that Ultratech shareholders will own approximately 15 percent of the combined company.

Ultratech is a recognized leader of lithography products for Advanced Packaging applications and for LEDs and is a pioneer for laser spike anneal technology used for the production of semiconductor devices. In addition, the company offers wafer inspection solutions leveraging its proprietary coherent gradient sensing (CGS) technology which address a wide variety of semiconductor applications.

"The strategic combination will establish Veeco as a leading equipment supplier in the high growth Advanced Packaging industry. Ultratech's leadership in lithography together with Veeco's Precision Surface Processing (PSP) solutions form a strong technology portfolio to address the most critical Advanced Packaging applications. We believe our complementary end market exposure and customer relationships will create the ideal platform to accelerate growth," said John R. Peeler, Veeco's Chairman and Chief Executive Officer. "Ultratech is a great fit with our strategy to profitably grow our business and diversify our revenue. We expect this transaction to be immediately accretive to adjusted EBITDA and non-GAAP EPS."

Ultratech Chairman and Chief Executive Officer, Arthur W. Zafiropoulo said, "Both companies have a strong heritage of developing innovative and cutting-edge technologies. The combined company will create a formidable team to execute against growth opportunities and deliver significant value to customers and shareholders."

Veeco expects to realize approximately $15 million in annualized run rate synergies within 24 months after closing, to be achieved through increased efficiencies and leveraging the scale of the combined businesses. The combined company is expected to have an efficient balance sheet, benefiting from the deployment of excess cash.

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The transaction is expected to close in the second calendar quarter of 2017, subject to approval by Ultratech shareholders, regulatory approvals in the U.S. and other customary closing conditions.

NovaldMedical is Improving processing of pharmaceutical powders by ALD

NovaldMedical ltd Oy demonstrates how its patented thin film coating solution improves the flow behavior of paracetamol powder compared to non- treated paracetamol.

Improving processing of pharmaceutical powders by @novaldmedical #pharmaceuticals #ALDep https://t.co/FCyxNsVXqG

— Tommi Kääriäinen (@tommikaariainen) February 1, 2017

NASA is developing an origami-inspired design for a “smart” radiator that will regulate heat on small satellites

NASA is developing an origami-inspired design for a “smart” radiator that will regulate heat on small satellites: http://go.nasa.gov/2kOScnC

NASA Reports: Japan’s ancient art of paper folding has inspired the design of a potentially trailblazing “smart” radiator that a NASA technologist is now developing to remove or retain heat on small satellites.

Vivek Dwivedi, a technologist at NASA’s Goddard Space Flight Center in Greenbelt, Maryland, has teamed with a couple of researchers at Brigham Young University in Utah to advance an unconventional radiator that would fold and unfold, much like the V-groove paper structures created with origami, the art of transforming a flat piece of paper into a finished sculpture.

In collaboration with Raymond Adomaitis, a professor at the University of Maryland in College Park, Dwivedi plans to lower the transition temperature by applying very thin films of silver and titanium to the vanadium-oxide using sputtering and a technique called atomic layer deposition, or ALD. ALD is performed in a state-of-the-art reactor developed by both Dwivedi and Adomaitis. With ALD, engineers literally can apply atomic-sized layers of different materials onto intricately shaped structures — much like how a cook layers different ingredients to make a pan of lasagna.

We're developing an origami-inspired design for a “smart” radiator that will regulate heat on small satellites: https://t.co/AOUPaO9hXx pic.twitter.com/OIl01Ry9WE

— NASA (@NASA) January 31, 2017

Meaglow from Canada to exhibit Hollow Cathode Plasma ALD at EuroCVD/Baltic ALD 2017

We are very happy to have a Candian company exhibiting at the joint EuroCVD-Baltic ALD 2017 conference in Sweden. Pleas hurry up to book your exhibition table since we have only 9 left and we will most probably sell out theexhibition.

Since 2009, Meaglow has been manufacturing crystal growth research reactors and supplying Hollow Cathode Plasma Sources to upgrade ALD, MOCVD, MBE, and other custom systems. Notable achievements include growing yellow InGaN thin films in the green gap, featured in Compound Semiconductor, and Semiconductor Today. 

Meaglow was founded by Scott Butcher, with over 20 years of nitride semiconductor experience, more than 100 referred journal and conference papers published, Dr. Butcher is an expert and pioneer in the industry. Holding eight patent families globally and being involved in three prior start up companies in addition to Meaglow Scott’s prior technologies have attracted over $20 million in funding to bring multiple thin film systems to market

Meaglow is well known in the ALD community for a range of hollow cathode (HC) plasma sources that they offer for PEALD.

Hollow cathode (HC) plasma sources, are an alternative to ICP and CCP sources. They’ve been around for quite a number of years and have been adopted for cathodic sputtering in PV systems, but past designs have been overly complicated for many PECVD applications involving the traditional material sets.(meaglow.com).

Hitachi High-Technologies and Picosun Oy launch a collaboration in Plasma-enhanced ALD

Tokyo, Japan and Espoo, Finland - 30 January 2017 - Hitachi High-Technologies Corporation (TSE:8036, Hitachi High-Tech) and Picosun Oy announce a revolutionary technological co-operation in plasma-enhanced atomic layer deposition (PE-ALD). The aim of this co-operation is to bring thin film coating technologies to a completely new level. Hitachi High-Tech’s and Picosun’s joint breakthrough, the novel Microwave Electron Cyclotron Resonance (ECR) ALD technology will disrupt all advanced semiconductor industries. 

 

Promotion Video: MECRALD - novel, revolutionary plasma-enhanced ALD technology By Hitachi High-Technologies and Picosun. (youtube.com)
 

In the PE-ALD reactor, Hitachi High-Tech’s powerful ECR plasma generator is integrated with Picosun’s industry-proven, digitally controlled ALD system. Consequently, the quality of the deposited materials is substantially better, and the deposition process is much more precise than existing traditional ALD and plasma-enhanced ALD methods.

Some superior results for various nitride and oxide films have been confirmed with 300 mm semiconductor wafers so far and some other process applications are under evaluation.

About Hitachi High-Technologies Corporation

Hitachi High-Technologies Corporation, headquartered in Tokyo, Japan, is engaged in activities in a broad range of fields, including Science & Medical Systems, Electronic Device Systems, Industrial Systems, and Advanced Industrial Products. The company's consolidated sales for FY 2015 were approx. 629 billion [USD5.8 billion]. For further information, visit http://www.hitachi-hightech.com/global/.

About Picosun Oy

Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap　into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support network. For more information visit www.picosun.com. 

 

 

Atomic Scale Processing Workshop 4 April 2017 with CEA_Leti MINATEC

Atomic Scale Processing Workshop 4 April 2017 at CEA/Leti & MINATEC, Grenoble, France.  Sign up for FREE http://bit.ly/2k4t7Rd 

Description

The aim of this one-day workshop is to give an overview of current topics in the field of atomic scale processing for a range of applications. It is open to scientists and technologists working in industry and academia, with an interest in recent progress plus future trends in research and development.

- Participation is free but registration is mandatory.

- Lunch and refreshments are included

- Topics

• Atomic layer etch (ALE): a precision technique to enable tomorrow’s technology
• Latest advances and new technologies for atomic scale process applications
• Ion beam developments in etch and deposition
• ALD and 2D overview: technology and results
• Ion beam research results at LETI

...And more topics to be announced

Atomic Scale Processing Workshop 4 April 2017 @CEA_Leti @MINATEC,France. Sign up for FREE https://t.co/fcP6yXPjUL #ALDep #ALEtch pic.twitter.com/yiufM58Hem

— Oxford Instruments (@OxInst) January 20, 2017

Apple Dual Fold-Out/Fold-In Form Factor phone

As reported today by Petently Apple, Apple's Third Major Folding iPhone Invention has come to Light Illustrating a Dual Fold-Out/Fold-In Form Factor.

Apple's Third Major Folding iPhone Invention has come to Light Illustrating a Dual Fold-Out/Fold-In Form Factor https://t.co/Y5GdvcSHYq pic.twitter.com/lmHsV7vl1l

— Patently Apple (@PatentlyApple) January 26, 2017

Earlier Patently Apple also reported that Samsung continues to internally debate whether to launch a Fold-Out Smartphone later this year (LINK).

Samsung Continues to Internally Debate whether to Launch a Fold-Out Smartphone Later this Year https://t.co/iHdNfYLbXz pic.twitter.com/rmm08wKng7

— Patently Apple (@PatentlyApple) January 11, 2017

Entegris seeking ALD/CVD precursor synthetic chemist in Austin

Seeking an experienced organometallic synthetic chemist handling air, moisture and thermally sensitive compounds for thin film ALD/CVD precursor development. Join the fastest growing BU in the company! https://lnkd.in/egAdKQT

Vital Control in Fab Materials Supply-Chains

Vital Control in Fab Materials Supply-Chains: The inaugural Critical Materials Council (CMC) Conference, co-sponsored by Solid State Technology, happened May 5-6 in Hillsboro, Oregon. Held just after the yearly private CMC meeting, the public CMC Conference provides a forum for the pre-competitive exchange of information to control the supply-chain of critical materials needed to run high-volume manufacturing (HVM) in IC fabs. The next CMC Conference will happen May 11-12 in Dallas, Texas.

John Smythe, Distinguished Member of Technical Staff of Micron Technology, explains approaches to controlling materials all the way to point-of-use. (Source: TECHCET CA)

At the end of the 2016 conference, a panel discussion moderated by Ed Korczynski was recorded and transcribed. The following is an edited excerpt of the conversation between the following industry experts:

• Jean-Marc Girard, CTO and Director of R&D, Air Liquide Advanced Materials,
• Jonas Sundqvist, Sr. Scientist, Fraunhofer IKTS; and co-chair of ALD Conference, and
• John Smythe, Distinguished Member of Technical Staff, Micron Technology

Please visit Semiconductor Manufacturing and Design (SemiMD.com) published by Extension Media for the full article by Ed Korczynski, Sr. Technical Editor.

Jonas Sundqvist, Sr. Scientist of Fraunhofer IKTS, discusses collaboration with industry on application-specific ALD R&D. (Source: TECHCET CA)

Tack så mycket CVD & ALD2017 Folks - Abstract submission is now closed and >200 Abstracts are now in review!

Tack så mycket CVD & ALD2017 Folks - Abstract submission is now closed and >200 Abstracts are now in review!

Please visit eurocvd-balticald2017.se for the latest information and support to plan your participation in EuroCVD / Baltic ALD 2017. 

There are still some nice sponsoring alternatives open and the exhibition also have a few places left - It will be sold out!

Review of EFDS Workshop – ALD for Industry 2017

In collaboration with the EFDS we organized the workshop “ALD for Industry 2017”. We appreciate to have more than 90 participants and sponsors from all over Europe and North America. There was an diversified programm with representatives from the European and American ALD Equipment Industry : Picosun (FIN), Beneq (FIN), Sentech (GER), FHR Anlagenbau (GER), Encapsulix (FRA), ASM International (NL) and Ultratech CNT (USA).  Further we welcomed representatives from the chemical industry (Air Liquide), customers (Robert Bosch) and research institutions/universities from Germany (Fraunhofer, Leibniz, …) and Finland (Aalto University and VTT Finland) who gave invited and contributed talks.

 

Text and Photos as Posted on 25. January 2017 by Martin Knaut, LINK

 

After half a day of tutorials on ALD thechnology and fundamentals and a nice get-together at the Freiberger Schankhaus in Dresden in the evening, we heard great talks about the broad range of ALD processes, ALD application and ALD equipment in the great ambiance of the Swissôtel Dresden.

Platin Sponsors:

 
 

Gold Sponsors:

Lam Research doubled install base of ALE in Logic 2016

Lam Research just presented their 4Q/2016 earnings. 2016 was the fifth consecutive year of growth and outperformance for Lam with a shipments CAGR of almost 20% over that period and shipments grew to a record $6.7 billion. As an example of the success 3D NAND shipments grew by over 80% in 2016, almost twice the rate of growth in NAND’s WFE. Please find all detailas in the Seeking Alpha Earings Call Transcript here. 

With respect to new existing atomic level control technology Lam has strengthened its momentum in foundry and logic with significant application share gains from the 2016 nodes to the 10 and 7 nanometer nodes. As an example, during the quarter they more than doubled their install base for  Atomic Layer Etch (ALE) system for logic self-aligned contact application with their dielectric etch product and mixed mode pulsing technology.

Seeking Alpha Earings Lam Research Call Slides here.

The NaMLab Novel High k Application Workshop 2017 in Dresden

NaMLab invites to the Novel High-k Application Workshop on March 9th and 10th, 2017. New challenges offered by the application of high-k dielectric materials in micro– and nanoelectronics will be discussed by more than 80 participants from industry, research institutes and universities. One main focus will be on the ferroelectric properties of HfO2. 

 

NaMLab created with the workshop a stimulating platform for application-oriented scientist to exchange ideas and discuss latest experimental results on MIM-capacitors, process technology, leakage & reliability as well as characterization of high-k dielectrics integrated in silicon based micro– and nanoelectronics. The ferroelectric properties of doped HfO₂ and ZrO₂ were discovered 10 years ago. On the second day of the workshop, root causes for the formation of this so far unknown phase will be discussed.

Registration for the workshop started:

- registration rate: participants: 12€/day  - students: 10€/day  (includes all meals and coffee breaks)

- registration rate can be paid by credit card, pay pal (Europe only: direct transfer)

Preliminary agenda:    March 9th  to 10th

Workshop location: Max Planck Institute PKS (Physics of Complex Systems), Noethnitzer Strasse 38

Sponsors:
  http://www.oxford-instruments.com/  
   http://www.strem.com/
  http://globalfoundries.com/

Co-organized by:

Functional Perovskites by Atomic Layer Deposition – An Overview

Here is a fresh review on perovskites (thanks for sharing Henrik Pedersen) by ALD from the Group of Prof. Nilsen at Oslo University, which as far as I know are the true masters of creating and understanding complex multi component metal oxides by ALD. I like that the review starts by placing the topic of perovskites in a historical context "In the 90 years since Victor Goldschmidt properly described the perovskite structure in his inaugural paper “Die Gesetze der Krystallochemie”, it has become one of the most studied and iconic classes of materials".

[Wikipedia] Victor Moritz Goldschmidt (Zürich, January 27, 1888 – March 20, 1947, Oslo) was a mineralogist considered (together with Vladimir Vernadsky) to be the founder of modern geochemistry and crystal chemistry, developer of the Goldschmidt Classification of elements. (photo from Wikipedia)

Functional Perovskites by Atomic Layer Deposition – An Overview 

Henrik Hovde Sønsteby^*, Helmer Fjellvåg and Ola Nilsen

Adv. Mater. Interfaces 2017, 1600903

DOI: 10.1002/admi.201600903

 Preview article

Gustav Rose who discovered the mineral perovskite

The mineral perovskite composed of calcium titanate (CaTiO3) was discovered in the Ural Mountains of Russia by Gustav Rose form The Kindom of Prussia in 1839 and is named after Russian mineralogist Lev Perovski (1792–1856). Amongst others, Gustav Rose studied under famous Swedish physical chemist Jöns Jakob Berzelius (1779–1848) in Stockholm. Berzelius is considered, along with Robert Boyle, John Dalton, and Antoine Lavoisier, to be one of the founders of modern chemistry and introduced chemical notation. [Wikipedia]

Jöns Jacob Berzelius (1779–1848) [Wikipedia]

KAUST technology extracts more from wastewater using ALD catalyst

KAUST present a novel electrocatalytic and microfiltration polymeric hollow fiber using ALD of platinum that is fabricated for simultaneous recovery of energy (H2) and clean fresh water from wastewater, hence addressing two grand challenges facing society in the current century (i.e., providing adequate supplies of clean fresh water and energy as the world's population increases).

More information: Krishna P. Katuri et al. A Microfiltration Polymer-Based Hollow-Fiber Cathode as a Promising Advanced Material for Simultaneous Recovery of Energy and Water, Advanced Materials (2016). DOI: 10.1002/adma.201603074

Read more at: https://phys.org/news/2017-01-wastewater.html#jCp

The results have been published in Adv. Mater., DOI: 10.1002/adma.201603074 and according to the supporting information the catalyst deposition by ALD on the outer surface of a POD hollow fiber membranes and was carried out on Oxford Instrument ALD system FlexAL

Read more at: https://phys.org/news/2017-01-wastewater.html#jCp

Fresh water scarcity and energy security are two critical global challenges facing us today. Researchers at KAUST have now created an advanced material that can address both problems simultaneously by producing clean water and hydrogen from wastewater.

Candadian researchers introduce novel ceramic ALD coated solid electrolyte for safe Li-batteries

Candadian researchers from University of Calgary report novel ceramic ALD coated solid electrolyte for safe Li-batteries (LINK): Existing lithium-ion batteries like those used in the Tesla Motors cars, Chevrolet Volt, Nissan Leaf and other electric and plug-in hybrid vehicles, as well as in portable electronics, use membranes of organic polymer compounds and lithium salts as the electrolyte. 

 

This is an illustration of a Li-rich garnet structure based all-solid-state-Li battery. While other research groups in the world have used garnet to build lithium batteries, “We showed we can use the lithium metal very efficiently, with the lowest interface-charge transfer resistance between the lithium electrode and the garnet electrolyte,” Thangadurai says. (Figure from www.ucalgary.ca)

The electrolyte in a battery separates the two electrodes (the positive cathode and the negative anode), and conducts the lithium ions between the electrodes during charging and discharging cycles. Currently used organic polymer-based electrolytes are flammable, so fire is a safety issue.

Instead of organic polymers for their battery, Wachsman and co-principal investigators Thangadurai and Liangbing Hu (at the UMD), along with other UMD scientists, used a solid ceramic electrolyte, which doesn’t burn.

The research team also used, for the first time, a technique called atomic layer deposition to place a thin film of aluminum oxide on top of a garnet structure coating the ceramic electrolyte.

 

Continue reading

2nd Area Selective Deposition workshop (ASD 2017), April 20-21, 2017

In collaboration with COST action HERALD, Eindhoven University will host the 2nd Area Selective Deposition workshop (ASD 2017), which will be held on April 20-21, 2017. The aim of this workshop is to bring together leading scientists and engineers from both academia and industry, to discuss the fundamentals of area selective deposition, as well as its applications.

Similar to last year’s successful workshop at IMEC, ASD 2017 will consist of one day of presentations and discussions. This scientific program will take place on April 21 in the city center of Eindhoven (90 minutes from Amsterdam), and will be preceded by a welcome reception at Eindhoven University on April 20. We are pleased to confirm the following invited speakers: Stacey Bent (Stanford University), John Abelson (University of Illinois at Urbana-Champaign), Rong Chen (Huazhong University), and Younghee Lee (University of Colorado at Boulder).

In addition to several invited presentations, this year’s program will include a few contributed presentations to feature recent developments in the field. The topics for these presentations will be selected based on abstracts received. Furthermore, there will be a poster session covering work related to nucleation, selective deposition, and nanopatterning. The abstract deadline is February 21. Note that this deadline is relatively tight.

The workshop is free, but registration for the scientific program and the welcome reception is mandatory. The registration deadline is April 12. Please see www.nanomanufacturing.nl/ASD2017 for more information about abstract submission and registration.

The ASD Program Committee is looking forward to your attendance.

Scott Clendenning (Intel Corporation), Annelies Delabie (IMEC), Dennis Hausmann (LAM Research), Rami Hourani (Intel Corporation), Gregory Parsons (North Carolina State University), and Adrie Mackus (Eindhoven University of Technology)

COST Action MP1402 - HERALD
Hooking together European research in Atomic Layer Deposition