Saturday, March 1, 2014

Atomic Layer Deposition engineers met in San Diego during SEMATECH’s Q1 Manufacturing Week 17-20th Feb

As reported earlier here on the ALD News Blog, Atomic Layer Deposition engineers met in San Diego during SEMATECH’s Q1 Manufacturing Week to benchmark ASM, TEL, HKE, AMAT and JUSUNG equipment productivity and to share some best known methods from the HVM Fabs. Samsung, tsmc, Intel, GLOBALFOUNDRIES, IBM, UMC, Winbond, HP and Freescale engineers all participated. The topics of key interest are:

1) Cost of precursor and dry-precursor usage – taring the weight of dry precursors is not fail safe and therefore not HVM friendly

2) Cost savings were identified of $800K per tool per year

3) Some OEM equipment still not being HVM friendly even after 10 years of ALD in manufacturing (HVM hardening & readiness is low compared to other equipment types)

4) FDC approaches and data collection frequencies (looking at 10Hz for metal ALD right now but potentially requiring 100Hz moving forward)

5) Trap installation, Helium de-gassers and special fore-line consideration
 
 

Boyd Finlay project manager from Manufacturing Technology at SEMATECH in Albany together with ALD Equipment Engineers and Experts from the top Leading Edge Fabs. 

 
Atomic Layer Deposition engineers from Samsung, tsmc, Intel, GLOBALFOUNDRIES, IBM, UMC, Winbond, HP and Freescale engineers all participated in the meeting.