Tuesday, March 31, 2015

SENTECH introduces PECVD / PEALD combo reactor at SEMICON China

According to a report by ALDPulse.com, SENTECH introduced a new SIPAR System at SEMICON China 2015. SIPAR combines PEALD & IC PECVD in one reactor. The SIPAR System enables automatic depositing multilayer stacks composed of plasma enhanced chemical vapour deposition (PECVD) and atomic layer deposition (ALD) layers. PECVD layers feature high deposition rates and ALD layers provide high conformity and homogeneity. SIPAR is designed for low damage deposition of multilayers at low temperature <100°C using the SENTECH proprietary PTSA inductively coupled plasma source.

The SIPAR Chamber was first introduced on the German market at the ThGOT workshop in Leipzig late 2014.

"New system for PEALD & ICPECVD in one reactor presented at ThGOT"

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