Friday, March 27, 2015

Micron and Intel Unveils 3D NAND

Micron and Intel Unveils 3D NAND : The World’s Highest-Capacity NAND Flash Memory

"The interdependent, growing demands of mobile computing and data centers continue to drive the need for high-capacity, high-performance NAND flash technology. With planar NAND nearing its practical scaling limits, delivering to those requirements has become more difficult with each generation. Enter our new 3D NAND technology, which uses an innovative process architecture to provide 3X the capacity of planar NAND technologies while providing better performance and reliability."

3 times the capacity of existing NAND products—enough to enable 3.5TB gum stick-sized SSDs or more than 10TB in standard 2.5-inch SSDs.
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