Technical program for AVS ALD2019 and ALE2019 in Bellevue, Washington USA

Technical Program

Key Deadlines: Hotel Reservation Deadline: June 27, 2019 JVST Special Issue Deadline: November 1, 2019

Hotel Deadline is June 27

Hotel

Schedule

Register

The AVS 19th International Conference on Atomic Layer Deposition (ALD 2019) featuring the 6th International Atomic Layer Etching Workshop (ALE 2019) will be a three-day meeting dedicated to the science and technology of atomic layer controlled deposition of thin films and now topics related to atomic layer etching. The conference will take place Sunday, July 21-Wednesday, July 24, 2019, at the Hyatt Regency Bellevue in Bellevue, Washington (East Seattle). The meeting will be preceded (Sunday, July 21) by one day of tutorials and a welcome reception. Sessions will take place (Monday-Wednesday, July 22-24) along with an industry tradeshow. All presentations will be audio-recorded and provided to attendees following the conference (posters will be included as PDFs). Anticipated attendance is 800+.

Download the ALD-ALE Mobile App Logging into the app allows you to access messaging, enable the synchronization of notes, favorites, and scheduled items between devices and the online scheduler. Click Here for Download Details

ALD/ALE 2019 Website

Plenary Speaker ·    Jeff Elam (Argonne National Lab, USA) ·    Eric Joseph (IBM, USA) ALD Invited Speakers ·    Silvia Armini (IMEC, Belgium) ·    Ageeth Bol (Eindhoven Univ. of Technology, Netherlands) ·    Jolien Dendooven (Ghent Univ., Belgium) ·    Eric Dickey (Lotus Applied Technology, USA) ·    John Ekerdt (Univ.of Texas, Austin, USA) ·    Fabio Grillo (ETH Zurich, Switzerland) ·    Hyeongtag Jeon (Hanyang Univ., South Korea) ·    Jessica Kachian (Intel, USA) ·    Rajesh Krishnamurthy (TechInsights/Chipworks, Canada) ·    Alex Martinson (Argonne National Lab, USA) ·    Niloy Mukherjee (Eugenus, Inc., USA) ·    Jin-Seong Park (Hanyang Univ., South Korea) ·    Henrik Pedersen (Linkoping Univ., Sweden) ·    Madhukar Rao (Versum Materials, USA) ·    Dina Triyoso (Tokyo Electron, USA) ·    Ginger Wheeler (U.S. Naval Research Lab, USA)

ALE Invited Speakers ·    Tomoko Ito (Osaka Univ., Japan) ·    Sabbir A. Khan (Niels Bohr Institute, Univ. of Copenhagen, Denmark) ·    Nobuyuki Kuboi (Sony Semiconductor Solutions Corp., Japan) ·    Xu Li (Univ. of Glasgow, UK) ·    Alfredo Mameli (TNO-Holst Centre, The Netherlands) ·    Angelique Raley (TEL Technology Center, America, USA) ·    Kazunori Shinoda (Hitachi Ltd, Japan) ·    Samantha Tan (Lam Research, USA) Tutorial Speakers ·    Area-selective ALD for Semiconductor Manufacturing, Stacey Bent (Stanford Univ., USA) ·    ALD for Battery Applications, Andy Sun (Western Univ., Canada) ·    ALD for Catalysis, Rong Chen (Huazhong Univ. of Science and Technology, China) ·    ALD for Photovoltaics, Bart Macco (Eindhoven Univ. of Technology, Netherlands) ·    Plasma Based ALE, Thorsten Lill, (Lam Research, USA) ·    Thermal Based ALE, Steve George (Univ. of Colorado at Boulder, USA)

ALD Program Chairs Program Chair: Sumit Agarwal (Colorado School of Mines, USA) Program Co-Chair: Dennis Hausmann (Lam Research, USA)

ALE Program Chairs Program Chair: Craig Huffman (Micron Technology, USA) Program Co-Chair: Gottlieb Oehrlein (University of Maryland, USA)

TechInsights’ Logic, NAND, DRAM and Emerging Memory Process Roadmaps are here

TechInsights’ Logic Process Roadmap offers an assessment and the anticipatory timing of new innovations from key players within the Logic space including: TSMC, Global Foundries, Intel & others. Download the roadmap here http://bit.ly/2FipHHA 

TechInsights’ technology roadmaps show you the innovations we are monitoring

For over 30 years, TechInsights has been reverse engineering semiconductors and advanced technology products, developing the world’s largest library of technical analysis. We have built this library through two approaches: by conducting analysis in response to client requests, and by proactively analyzing disruptive or innovative technologies as they are released.

We constantly monitor the consumer electronics market to determine which manufacturers are planning to release new solutions, and when. We maintain and regularly update technology roadmaps in several different areas: Logic, NAND Flash Memory, DRAM, Emerging Memory, and Internet of Things Connectivity Systems on Chips, and more.

Updates to the roadmaps shown below are released throughout the year; check this page for updates. 

Call for papers -Atomic Layer Deposition and Atomic Layer Etching in JVSTA

Manuscript Deadline: November 1, 2019

These 2020 Special Topic Collections are planned in collaboration with ALD 2019 and the ALE 2019 Workshop to be held in Bellevue, WA from July 21—July 24, 2019. The Special Topic Collection will feature sections dedicated to the science and technology of atomic layer controlled deposition and to the science and technology of controlled etching of thin films. While a significant number of articles will be based on material presented at ALD 2019 and the ALE 2019 Workshop, research articles on ALD and ALE but not presented at this conference are also welcome. The special topic collection will be open to all articles on the science and technology of ALD and ALE.

Authors are encouraged to use the JVST template. Online, you will have an opportunity to tell us that your paper is a part of the Special Topic Collection by choosing either the “ALD Special Topic Collection” or the “ALE Special Topic Collection.” See recent Collections: ALD 2019, ALE 2019, ALD 2018, ALE 2018. 

Submit to JVST A

JVST Article Template

 

 

Swedish Nanexa’s PharmaShell® patent approved in Japan

[Nanexa AB, LINK] The Japanese Patent Office has approved Nanexa’s patent application for the drug delivery platform PharmaShell®.

Nanexa’s drug delivery system PharmaShell® is suitable for parenteral drug administration. The drug delivery system enables drug release in a well-controlled manner from a couple of weeks to really long depots of up to one year. By adjustments in the manufacturing process of PharmaShell®, the depot time can be controlled to the desired length.

The properties of PharmaShell®, with extremely high so-called drug load and the ability to control the initial release, make it unique in the market. The system enables depot preparations from simple small molecule drugs to proteins. The mentioned properties are in demand by the pharmaceutical industry to create new and more effective drugs with the possibility of limiting the side effects of the drug.

The Japanese Patent Office has approved Nanexa’s patent application on May 30, 2019. The now approved patent covers the product PharmaShell® itself and the method of its manufacture and formulation of PharmaShell® coated drugs. The approved patent has patent number JP6516729.

CEO David Westberg comments:

In January, we got the PharmaShell® patent approved in the US and I can now conclude that it has also been approved in Japan. The Japanese market is large and important for Nanexa and with an approved patent our commercial opportunities in the future will increase.

Our continuous work on patent applications begins to yield results and together with our more recently filed patent applications, I assess that we have a strong patent portfolio.

Previous News on Nanexa:

Nanexas PharmaShell® patent approved in the United States

Nanexa order a third Picosun ALD System to meet production demand for PharmaShell®

Nanexa has completed a safety laboratory for the PharmaShell® process

New method using ALD enables storage and controlled release of pharmaceutical substances in the body

UV Broadband Antireflection Coating Using Al2O3, HfO2 and SiO2 Multilayer by ALD

Researchers at Shanghai Institute of Technical Physics of The Chinese Academy of Sciences have studied UV broadband antireflection (AR) films prepared by ALD. The study reports results in the 250~390 nm spectral range. They showed that a higher transmittance was acquired when HfO2-Al2O3 nano-laminates replaced the sinngle HfO2 layer in the AR coating. The results was presented at the recent Optical Interference Coatings 2019 conference in Santa Ana Pueblo, New Mexico United States (2–7 June 2019).

Trancmitance of ALD AR coating. (Figure capture from Google)

Source: OSA Publishing, Optical Interference Coatings 2019 "UV Broadband Antireflection Coating Using Al2O3, HfO2 and SiO2 Multilayer by Atomic Layer Deposition" LINK

Picosun strengthens its presence in the healthcare industries

ESPOO, Finland, 29th May 2019 – Picosun Group, the global provider of AGILE ALD™ (Atomic Layer Deposition) thin film coating solutions, continues its breakthrough into healthcare industries by supplying ALD technology to produce bioactive coatings on surgical implants at a major, leading manufacturer.

In the recent couple of years, healthcare industries have truly awakened to the endless possibilities ALD offers to them. As the population ages, the need for various ‘spare parts’ of the body, such as artificial hips, knee joints, dental implants, and stimulators for heart or brain functions grows. Along with the increasing miniaturization of implantable microelectronics and wireless sensors, remote health monitoring and therapeutics is also becoming commonplace.

“Picosun has worked with medical companies for a long time, for example with Russian-based implant manufacturer Conmet LLC, and with Swedish Nanexa AB, who uses ALD for drug particle surface functionalization for targeted and controlled drug delivery. We also collaborate with several universities where medical ALD technology is developed. These projects have given us unique insight into this business, which is quite different from the semiconductor industries, the most typical ‘playground’ for ALD,” says Mr. Juhana Kostamo, Managing Director of Picosun Group.

The common fact to all implantable medical devices is that they need protection from the rather hostile environment inside human body. Body fluids are corrosive so the implant must be isolated from them, and vice versa – the body needs to be protected from possible rejection reaction or metal ion leakage caused by the implant. This is where ALD, with its capability to form intrinsically biocompatible, reliably hermetic and ultra-thin sealing around the implanted device, shows its strength. ALD encapsulation increases the implant lifetime and safety, potentially reducing the number of replacement surgeries or ‘maintenance’ operations of the implanted device.

“Our PicoMEDICAL™ solutions are tailored especially to the needs of medical industries that are often still new to ALD. We provide not only the equipment, but the whole chain starting from application consultancy to equipment and process optimization, production ramp-up and comprehensive after-sales support to ensure our customers’ production keeps running smoothly and with minimum downtime. We are happy that we have been chosen as the ALD solutions provider to a yet new prominent customer in this field. Our technology shows again its agility and the potential to improve the quality of life for so many implant patients now and in the future,” continues Mr. Kostamo.

Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

VLSI 2019 Workshop - The Impact of Atomic Layer Processing and Selective Area Patterning on Device Fabrication and Performance

On June 9th, the 2019 Symposia on VLSI Technology and Circuits will feature a free workshop on The Impact of Atomic Layer Processing and Selective Area Patterning on Device Fabrication and Performance. This workshop is endorsed by the AVS and features presentations from some prominent members of the AVS community. If you happen to be attending the VLSI Symposia, or have colleagues who are planning to attend, please let them know about this opportunity hear about the impact of ALD/ALE on device properties and to further develop the link between the ALD/ALE process community and the semiconductor device and circuits community. 

 

Any additional questions you may have, please feel free to reach out to Eric Joseph, the workshop organizer, to the workshop committee (which consists of the 2019 ALD Conference / ALE Workshop Chairs) or to the VLSI or AVS staff. 

 

More information: LINK

 

SALDtech receives further funding to enable mass production of the next generation foldable OLED displays

SALDtech speeds up commercialization of Spatial Atomic Layer Deposition equipment for the display industry

Eindhoven, 22 May 2019 - SALDtech announced today that it has closed a second investment round with Innovation Industries, a leading high-tech VC fund and BOM, Brabant Development agency. TNO, through its subsidiary Holst Centre, has invested over 10 years in developing a new technology called Spatial Atomic Layer Deposition to produce large area ultra-thin layers with world class performance. SALDtech, a spin-off of TNO, will use the investment to develop and build production equipment to be integrated into the production lines of next generation flexible OLED displays for mobile phones, tablets, TVs and more. 

 

(Photo: TNO)

 

“We are very pleased with this investment as it enables us to further develop our product and speed up our sales” Huib Heezen, CEO of SALDtech states: “SALDtech will continue to cooperate closely with TNO on process innovation and will use the expertise on high tech equipment as readily available in the Eindhoven area for our product development. We are delighted to now have two top Dutch investors in the form of Innovation Industries and BOM on board who are committed for the long term.”

 

“We are excited that we have been a part of SALDtech since its first round last year and that we can continue to support SALDtech’s growth by participating also in this financing round”, says Nard Sintenie, Partner at Innovation Industries. “SALDtech’s technology has the ability to change the way we are working and interacting with displays and thereby addresses a huge market.”

“SALDtech has the potential to become the leading supplier in the display market” according Jurgen Van Eck, Senior investment manager at BOM Brabant Ventures“ As such, the company will play an important role towards local suppliers. We are happy we are able to contribute towards the further development of SALDtech”

Founding institute TNO is delighted with the opportunity this second financing round offers to SALDtech. “Both Innovation Industries and BOM have multiple investments in TNO spin-offs, , which shows the potential of the research we are doing at Holst Centre and TNO for the Dutch high tech industry. This investment is the next step in strengthening the Dutch economic position and Brainport in particular.” says Jaap Lombaers, Director at TNO.

About SALDtech
SALDtech BV is a spinoff from the Netherlands Organisation for Applied Scientific Research (TNO) and is based in Eindhoven, The Netherlands. The company was founded in 2018 to further develop, build and sell commercial Spatial Atomic Layer Deposition (SALD) systems into the flat panel display industry. The SALDtech tool will help enable the production scale up of next generation display technologies. Related end product display markets include smartphones, tablets, TV’s as well a new form factor displays in (autonomous) cars and on practically every surface.

Contact:
Huib Heezen (CEO)
huib.heezen@saldtech.com
+31 (0)6 30615028