The Critical Materials Council (CMC) Conference Committee has issued a call for papers for presentations to be given at the CMC Conference to be held May 11-12, 2017 in Dallas, Texas, USA. Semiconductor manufacturing industry experts from IDMs, OEMS, and materials suppliers will gather to discuss actionable information on critical materials used in HVM fabs surrounding the theme of "Critical Materials for Device Driven Scaling," while also looking at issues associated with new materials needed for future devices.
Following the annual members-only Critical Materials Council meeting to be held earlier that week, the 2017 CMC Conference is open to the public. Business drives our world, but technology enables the profitable business of manufacturing new devices in IC fabs, and new devices need new materials. In addition to panel discussions, presentation sessions will focus on the following topics:
I. Global Issues & the Supply Chain
II. Immediate Challenges of Materials & Manufacturing
III. Emerging Materials Challenges
To submit a paper for consideration, please send a 1-page abstract focusing on critical materials supply dynamics by February 10, 2017 to cmcinfo@techcet.com.
Attendees will include industry experts handling supply-chains, business-development, R&D, and product management, as well as academics and analysts. The early-bird registration fee (before April 15th) for the CMC Conference is $350; the standard registration fee is $425 (after April 16th). CMC member companies will be attending this meeting, as it is an important part of their membership.
Registration Opens January 1, 2017 Early Bird Discount $350 (opens in January) Standard Registration $425
Event Sponsorship Opportunities
It is our continued goal to provide timely, relevant information on the supply-chains of critical materials through education and collaboration. None of this is possible without the help of our sponsors! For Sponsorship Opportunities, please contact Diane Scott at dscott@techcet.com.
Dr. Florian Schön from Robert Bosch GmbH will present "ALD applications in MEMS manufacturing" at the EFDS ALD for Industry workshop in Dresden 17-18th of January 2017. MEMS (MicroElectroMechanical Systems; Microsystems) are micrometer-scale, semiconductor-based components that combine e.g. electrical, mechanical, and optical functions. They are present in our everyday electronics in products such as hard disk read heads, inkjet printer nozzles, microphone and videoprojector chips, and airbag controls, tire pressure monitoring, and driving stability systems in cars. [Picosun, BALD Engineering]
According to the MEMS market is lead by “MEMS Titan” Robert Bosch (Yole Développment Aug 2016) followed by STMicroelectronics and Texas Instruments.
According to the Yole Status of the MEMS Industry 2016 Report
the compound CAGR from 2015-2021 for the value of MEMS markets will be
8.9%, moving from $11.9B to $20B. Over the same period the CAGR of units
shipped will be 13%.
Passivation of MEMS by Atomic Layer Deposition, Matthias Schwille, Robert Bosch (ALD Lab Dresden Symposium, SEMICON Europa 2015)
After Robert Bosch, Dr. Tero Pilvi from Picosun Oy., Finland will give a talk very much related to MEMS "ALD and 3D coatings" Last year Mr. Timo Malinen, CTO of Picosun had tis to say about their ALD MEMS offering “Our MEMS customers gain immense benefits from our SEMI S2 certified PICOPLATFORM™ cluster technology. Equipped with our production-proven PICOSUN™ P-series batch ALD tools, these cluster systems have already proven their worth at the manufacturing sites of leading, global microsystems industries. Considering the MEMS market growth forecasts, propelled by the coming era of the Internet-of-Things, this product line will definitely be one of the cornerstones of our industrial ALD business".
The registration fee includes admission to the conference Monday 12 June to Wednesday 14 June, conference material, lunch, coffee/tea breaks, welcome mixer Sunday 11 June, pub night on Monday 12 June and conference dinner on Tuesday 13 June.
Abstracts will only be accepted though the online abstract submission system, which will be available on November 10, 2016. The deadline for submission is January 10, 2017.
The abstract will consist of two parts: the extended abstract and the summary:
1.The extended abstract can be up to 2 A4 pages, and must follow the extended abstract template available below for download. Please download the template here (Word .docx format). Save the completed extended abstract as a .pdf for submission. Note: only .pdf files will be accepted in the online submission process.
2.The summary will be maximum 1600 character overview of the extended abstract. This should be written in as plain text as possible, with no references or figures. This summary will be pasted into a text submission box during the submission procedure.
Abstract submission closes on January 10, 2017 by midnight GMT. All abstracts should be submitted by this date. Authors will be notified of acceptance of their contributions and the type of presentation (oral or poster) by February 10, 2017.
It is important to note that the authors are solely responsible copy-editing and formatting their abstract documents. The accepted abstracts will be published as received, and any errors in formatting, spelling, grammar, or scientific content will not be corrected. If you have any technical difficulties with the submission process, please contact the organizing committee at cvdald17.abstract@meetagain.se. Other questions about the conference can be directed to henrik.pedersen@liu.se.
The scientific committee will vet the submitted abstracts, and notify the submitting author about the acceptance decision. Accepted abstracts will further be assigned as an oral or poster presentation according to the scientific committee’s decision. The two page abstract will appear in an electronic collection of abstracts distributed to the conference attendees during registration. The 1600-character summary will be published in the conference booklet. Publication of both the extended abstract and summary is contingent on registration of the submitting author.
Presenters will be notified about the scientific committee's decision by email.
We are very happy to announce that have received a late news abstract from RASIRC out of San Diego, USA, for a presentation to be given at the EFDS Workshop "ALD for Industry" entitled “New ALD chemistries for low temperature
oxide and nitride films”. RASIRC is also sponsoring the workshop and will have a stand the the exhibition.
There are still room for some delegates to attend - so please consider to come to Dresden 17-18th of January and participate!
I have met Rasirc many times in Dresden and around the world. Here is a picture from Rasirc sponsoring and presenting the CMC Conference 2016 in Hillsboro USA organized by TECHCET, "Hydrazine as a Low Temperature
Nitride Source: Materials Challenges for High Volume Manufacturing " at
the event posing Dan Alvarez CTO and Jeff Spiegelman President and
Founder.
In an European context ALD was invented independently twice in Europe
(Russia & Finland) and since the last 15 years Germany has grown to
become one of the strongest European markets for ALD in R&D,
chemicals, equipment and end users. Here, Dresden and Saxony is a unique
ALD hotspot due to a strong semiconductor and equipment industry.
As you can see we have managed to put together a fantastic program with
representatives from the European ALD Equipment Industry : Picosun
(FIN), Beneq (FIN), Sentech (GER), FHR Anlagenbau (GER), Encapsulix
(FRA), ASM International (NL) and special guests from the USA -
Ultratech CNT!
In addition, representatives from the chemical industry (Air Liquide),
customers (Robert Bosch) and research institutions from Germany
(Fraunhofer) and Finland (Aalto University and VTT Finland) will make
invited and contributing talks. Topics will cover industrialization of
ALD beyond the semiconductor industry:
OLED Net reports:Taiwanese
company, AU Optronics(AUO) introduced bi-directional foldable AMOLED
display at IDW(International Display Workshoops) 2016 opened in Japan
Fukuoka from last December 7th through 9th, which both internal and
external displays can be bent 180 degrees.
The
Display has an impressivily small folding radius of less than 4 mm and
can endure folding cycle of more than 1.2 million times. There are no
reports yet of which encapsulation technology that has been employed.
COLLEGE PARK, Md. — A team of researchers at the University of Maryland Energy Research Center and A. James Clark School of Engineering have announced a transformative development in the race to produce batteries that are at once safe, powerful, and affordable.
The researchers are developing game-changing solid-state battery technology, and have made a key advance by inserting a layer of ultra-thin aluminum oxide between lithium electrodes and a solid non-flammable ceramic electrolyte known as garnet. Prior to this advance, there had been little success in developing high-performance, garnet-based solid-state batteries, because the high impedance, more commonly called resistance, between the garnet electrolyte and electrode materials limited the flow of energy or current, dramatically decreasing the battery's ability to charge and discharge.
The University of Maryland team has solved the problem of high impedance between the garnet electrolyte and electrode materials with the layer of ultrathin aluminum oxide, which decreases the impedance 300 fold. This virtually eliminates the barrier to electricity flow within the battery, allowing for efficient charging and discharging of the stored energy.
A new paper describing the research was published online December 19 in the peer-reviewed journal Nature Materials.
“This is a revolutionary advancement in the field of solid-state batteries—particularly in light of recent battery fires, from Boeing 787s to hoverboards to Samsung smartphones,” said Liangbing Hu, associate professor of materials science and engineering and one of the corresponding authors of the paper. “Our garnet-based solid-state battery is a triple threat, solving the typical problems that trouble existing lithium-ion batteries: safety, performance, and cost.”
Self-assembly of molecules that spontaneously
form ordered phases exhibiting well-defined nanoscale periodicity and
shapes may be used for future Logic, Memory and intreconnects. However, until to day these have been limited to lamellae or hexagonally packed cylinders.
A team of researchers at Brookhaven National Laboratory have recently showed how soft
self-assembling materials—block copolymer thin films—can be manipulated
to form a diverse library of previously unreported morphologies. The processes s modules can be repeated as an iterative self-assembly as described in the figure below.
(a) The responsive assembly strategy begins by depositing a
neutral brush on the substrate of interest. A block copolymer (BCP) film
is then spin-coated on the substrate and annealed to yield a
well-defined morphology. Selective infiltration synthesis (SIS) is used
to load one of the BCP domains with alumina; this process ‘fixes’ the
thin film, making it robust and insoluble, and generates height
variation between the domains. The fixed BCP film can be used as the
substrate in a subsequent round of ordering. The height variation (which
remains after depositing the neutral brush) templates the subsequent
BCP layer, causing it to align and register in a well-defined way.
Single-layer, bi-layer or multilayer inorganic replicas can be formed by
ashing the film (exposure to O2 plasma), as shown in the right-most column. (b)
Cross-sectional scanning electron microscopy (SEM) of an exemplar
single-layer infiltrated nanostructure before and after ashing
(lamellar-forming BCP, L36). (c) Cross-sectional SEM of an
exemplar four-layer nanostructure. False-colour applied to highlight
layers (from bottom to top): L104, L74, L36, C132. Scale bars are
100 nm. Released unde Creative Commons 4.0 from Rahman,
A. et al. Non-native three-dimensional blockcopolymer morphologies.
Nat. Commun. 7, 13988 doi: 10.1038/ncomms13988 (2016).
Hollow cathode plasma sources, are an alternative to ICP and CCP sources and has been successfully introduced for PEALD by Meaglow Ltd. Semiconductor Today reports: Bilkent University in Turkey has developed a low-temperature process to
create gallium nitride (GaN) back-gated thin-film transistors (TFTs)
on flexible and rigid substrates [S. Bolat et al, Appl. Phys. Lett.,
vol 109, p233504, 2016]. The team reports that the "overall fabrication
thermal budget is below 200°C, the lowest reported for the GaN-based
transistors so far."
According to the article in Applied Physics Letters, the GaN thin films were grown by hollow cathode plasma assisted atomic layer deposition (HCPA-ALD) at 200 °C using the popular Ultratech Cambridge Nantech Fiji PEALD system equipped with an HCP source from Meaglow.
ESPOO, Finland, 28th December, 2016 – Picosun Oy, the leading
supplier of advanced industrial ALD (Atomic Layer Deposition) solutions,
reports winning more than 20 new customers in China for its ALD systems
since December 2015.
According to SEMI, out of 62 front-end fabs that will open worldwide
over the next three years, 26 are in China, representing 42% of the
global total. (Data from SEMI)
Amongst these customers are many of China’s leading companies in LEDs, III-V semiconductors, and new energy. Thanks to the high technical level of PICOSUN™ ALD equipment and the excellent customer support, Picosun has become the supplier of choice for ALD technology in China.
Chinese semiconductor manufacturing and the number of planned fabs in the country are booming, making China the new key market for semiconductor processing equipment. This is the most excellent news considering Picosun’s prominent position as the advanced ALD solutions provider. Collaboration with the leading Chinese research institutes is further supporting Picosun’s sprint in the market.
“We are extremely happy with the development of our ALD business in China. Our achievements are based on solid ALD knowhow, high-level support and proprietary designs, which give the best value for our Chinese customers and ensure our steady progress in the Chinese market. We are committed to our customer satisfaction by providing the newest and the best ALD solutions and systems in the market,” states Mr. Xiaopeng Wu, CEO of Picosun China.
Applied
Materials is world leading in CVD processing for wafer and display.
However, i big part of the CVD equipment market today is the booming
segment of ALD where Applied only have single digit percentage of the
revenue. According to a recent report by Seeking Alpha, "Applied
Materials is facing strong competition as its deposition technology is
being supplanted by Atomic Layer Deposition at Samsung Electronics and
LG Display". Other applications where Applied Materials did not enter with ALD include:
Watch For Big Display Equipment Cancellations Coming From Applied Materials
Tight supply of a critical piece of OLED equipment from Canon Tokki
will limit OLED production in 2017 and impact Applied Material's sales
of supplemental equipment.
Applied Materials also is facing strong competition as its
deposition technology is being supplanted by Atomic Layer Deposition at
Samsung Electronics and LG Display.
As much as $1 billion in display equipment from Applied Materials could be cancelled in 2017.
The ALD for Industry workshop is coming up in Dresden 17-18th of January 2017 organizes by EFDS and ALD Lab Saxony - IHM TU Dresden & Frauhhofer IKTS with support from NaMLab, von Ardenne and Globalfoundries and very many sponsors from the ALD industry!
Frohe Weihnachten und ein gusundes Neues Jahr aus Dresden
On the first day after the tutorials there will be an opportunity to visit ALD labs and cleanrooms and labs at the Technical University Dresden and Fraunhofer Institute for Ceramic Technologies and Systems IKTS. After the tours we will have a get to gether "ALD Fest" at Freiberger Schankhaus in Dresden Altstadt. Her you can read about the History of this former Pharmacy starting in 1756 under the intriguing original name »Zum König Salomon« (The King Solomon) : LINK
PERC solar cells are a type of high efficiency solar cells where the electron gain of the cell is improved with a passivating film on the rear side of the cell structure. The complete term is Passivated Emitter Rear Cell. The PERC manufacturing technology has become more mature and cost effective, and PERC cells are now causing a buzz in the industry.
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