Monday, March 7, 2016

Fraunhofer IVV develops ultra barrier films using atomic layer deposition

According to a press release March 07, 2016 : The Fraunhofer Institute for Process Engineering and Packaging IVV will present its latest work on the manufacture of ultra barrier films for the flexible encapsulation of Organic Electronics (OEs) at the international LOPEC fair in Munich on 6-7 April 2016 (Hall B0, Stand 100). A plant for coating films by atomic layer deposition is currently being constructed at the institute. This will allow the Fraunhofer IVV to further reduce the permeability of films and offer new film products to industry.


Minimizing the permeability to water vapor and oxygen is the key to further successful optimization of high barrier films. Atomic layer deposition (ALD) is paving the way for this. This technology is suitable for roll-to-roll processes, so allowing high production efficiency. Furthermore the processing speed is similar to that of the vacuum processes currently used to manufacture the highest barrier films.



This new technology at the Fraunhofer IVV will be used for publicly funded R&D projects aimed at providing industry with customized solutions and R&D services in the area of process and material development.

The new atomic layer deposition technology coupled with the existing expertise of the Fraunhofer IVV in the area of high barrier films means that there are very promising opportunities for significantly improving the barrier properties of films and in the medium term meeting the barrier requirements for OLED encapsulation.