[Beneq] With ALD, it is possible to create moisture barriers that are thinner and keep humidity and vapors out better than other hermetic packaging options, which makes it a winning moisture barrier for many industries, especially the semiconductor industry. ALD moisture protection can be applied in different phases of the production process: wafer-level, chip-level, package-level, and/or during the final assembly of the Printed Circuit Board (PCB).
Read more in the Beneq Blog : LINK
Download white paper : LINK
(beneq.com)
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