WEST LAFAYETTE, Ind. – Researchers have
experimentally demonstrated how to harness a property called negative
capacitance for a new type of transistor that could reduce power
consumption, validating a theory proposed in 2008 by a team at Purdue
University.
The researchers used an extremely thin, or 2-D,
layer of the semiconductor molybdenum disulfide to make a channel
adjacent to a critical part of transistors called the gate. Then they
used a “ferroelectric material” called hafnium zirconium oxide to create
a key component in the newly designed gate called a negative capacitor.
Capacitance, or the storage of electrical charge,
normally has a positive value. However, using the ferroelectric
material in a transistor’s gate allows for negative capacitance, which
could result in far lower power consumption to operate a transistor.
Such an innovation could bring more efficient devices that run longer on
a battery charge.
Hafnium oxide is now widely used as the
dielectric, or insulating material, in the gates of today’s transistors.
The new design replaces the hafnium oxide with hafnium zirconium oxide,
in work led by Peide Ye, Purdue’s Richard J. and Mary Jo Schwartz Professor of Electrical and Computer Engineering.
“The overarching goal is to make more efficient
transistors that consume less power, especially for power-constrained
applications such as mobile phones, distributed sensors, and emerging
components for the internet of things,” Ye said.
Findings are detailed in a research paper published on Dec. 18 in the journal Nature Nanotechnology.
The original theory for the concept was proposed in 2008 by Supriyo Datta, the Thomas Duncan Distinguished Professor of Electrical and Computer Engineering, and Sayeef Salahuddin,
who was a Purdue doctoral student at the time and is now a professor of
electrical engineering and computer sciences at the University of
California, Berkeley.
The paper’s lead author was Purdue electrical and
computer engineering doctoral student Mengwei Si. Among the paper’s
co-authors are Ye; Ali Shakouri,
the Mary Jo and Robert L. Kirk Director of Purdue’s Birck
Nanotechnology Center and a professor of electrical and computer
engineering; and Muhammad A. Alam,
the Jai N. Gupta Professor of Electrical and Computer Engineering, who
made critical and wide-ranging contributions to the theory describing
the physics behind negative capacitance devices.
Transistors are tiny switches that rapidly turn
on and off, enabling computers to process information in binary code.
Properly switching off is of special importance to ensure that no
electricity “leaks” through. This switching normally requires a minimum
of 60 millivolts for every tenfold increase in current, a requirement
called the thermionic limit. However, transistors that harness negative
capacitance might break this fundamental limit, switching at far lower
voltages and resulting in less power consumption.
New findings demonstrate the ferroelectric
material and negative capacitance in the gate results in good switching
in both the on and off states. The new design achieves another
requirement: for the transistors to switch on and off properly they must
not generate a harmful electronic property called hysteresis.
The negative capacitance was created with a
process called atomic layer deposition, which is commonly used in
industry, making the approach potentially practical for manufacturing.
The research is ongoing, and future work will
explore whether the devices switch on and off fast enough to be
practical for ultra-high speed commercial applications.
“However, even without ultrafast switching, the
device could still have a transformative impact in a broad range of
devices that may operate at lower frequency and must operate with low
power levels,” Ye said.
Portions of the research were based at the Birck
Nanotechnology Center in Purdue's Discovery Park. The work was funded by
the U.S. Air Force Office of Scientific Research, National Science
Foundation, Army Research Office and Semiconductor Research Corporation.
The work was performed by researchers from
Purdue, the National Nano Device Laboratories in Taiwan, and National
Laboratory for Information Science and Technology of Tsinghua University
in Beijing. A complete listing of the paper’s co-authors is contained
in the abstract.
Writer: Emil Venere, 765-494-4709, venere@purdue.edu
Source: Peide Ye, 765-494-7611, yep@purdue.edu
Note to Journalists: A copy of the research papers is available from Emil Venere, Purdue News Service, at 765-494-4709, venere@purdue.edu
ABSTRACT
Steep Slope Hysteresis-free Negative Capacitance MoS2 Transistors
Mengwei Si1,3, Chun-Jung Su2, Chunsheng Jiang1,4, Nathan J. Conrad1,3, Hong Zhou1,3, Kerry D. Maize1,3, Gang Qiu1,3, Chien-Ting Wu2, Ali Shakouri1,3, Muhammad A. Alam1 and Peide D. Ye*,1,3
1 School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47907, United States
2 National Nano Device Laboratories, Hsinchu 300, Taiwan
3 Birck Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States 4
Tsinghua National Laboratory for Information Science and Technology,
Institute of Microelectronics, Tsinghua University, Beijing 100084,
China
* Address correspondence to: yep@purdue.edu (P.D.Y.)
The so-called Boltzmann Tyranny defines the
fundamental thermionic limit of the subthreshold slope (SS) of a
metal-oxide-semiconductor field-effect transistor (MOSFET) at 60 mV/dec
at room temperature and, therefore, precludes the lowering of the supply
voltage and the overall power consumption. Adding a ferroelectric
negative capacitor to the gate stack of a MOSFET may offer a promising
solution to bypassing this fundamental barrier. Meanwhile,
two-dimensional (2D) semiconductors, such as atomically thin transition
metal dichalcogenides (TMDs) due to their low dielectric constant, and
ease of integration in a junctionless transistor topology, offer
enhanced electrostatic control of the channel. Here, we combine these
two advantages and demonstrate for the first time a molybdenum disulfide
(MoS2) 2D steep slope transistor with a ferroelectric
hafnium zirconium oxide layer (HZO) in the gate dielectric stack. This
device exhibits excellent performance in both on- and off- states, with
maximum drain current of 510 μA/μm, sub-thermionic subthreshold slope
and is essentially hysteresis-free. Negative differential resistance
(NDR) was observed at room temperature in the MoS2 negative
capacitance field-effect-transistors (NC-FETs) as the result of negative
capacitance due to the negative drain-induced-barrier-lowering (DIBL).
High on-current induced self-heating effect was also observed and
studied.
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