Wednesday, April 2, 2014

University of Colorado present Ultra-thin 3D Nano-Devices from ALD on Polyimide

A new nanofabrication process for nano/micro-devices through the combination of inorganic nanomaterials from atomic layer deposition (ALD) on 3-dimensional organic polyimide substrates is developed. The first suspended ALD structures with multiple patterned suspended levels on the order of 10 nm are fabricated and results surrounding the mechanical stability of ultra-thin suspended structures are discussed.

Examples demonstrated and applied to N/MEMS applications (Picture from graphical Abstract, Advanced Materials)

As published in by University of Colorado at Boulder in Advanced Materials

Ultra-thin 3D Nano-Devices from Atomic Layer Deposition on Polyimide

Nathan T. Eigenfeld, Jason M. Gray, Joseph J. Brown, George D. Skidmore, Steven M. George and Victor M. Bright

Article first published online: 1 APR 2014
DOI: 10.1002/adma.201400410

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