Sunday, March 19, 2017

Beneq launched Rotary spatial plasma batch wafer ALD at SEMICON China


Sami Sneck from Beneq will presented about Rotary Spatial Plasma Enhanced Atomic Layer Deposition on Monday, 13 March, at the Shanghai International Expo Center.
  • The benefits of rotary spatial PEALD
  • µm-thick ALD films with high throughput
  • optical coating stacks by rotary spatial PEALD.

Beneq R11 offers high-perfomance ALD in a low temperature plasma enhanced process for example for multilayer anti-reflection coatings. The deposition rates are really high (µm/hour for SiO2) as is the throughput (15000 pcs of 200 mm wafers/month).

The Beneq WCS 600 roll-to-roll ALD system has been designed for demanding flexible electronics applications. It is a high-capacity industrial ALD tool for up to 500 mm wide flexible substrates. It provides continuous coating capacity of 10 nm @ 1 m/min for materials such as AI2O3.

Beneq T2S is a batch wafer tool for high capacity ALD for semiconductor applications. It offers full cassette-to-cassette automation for up to 200 mm wafers with a capacity of 20 000 wafers/month (50 nm Al2O3 ). It is ideal for LED, MEMS, and sensor applications.
[this story is a past event and will be updated when more information is available] 

 BALD Engineering talking to Beneq at ALD Ireland 2016 (Photo: Katharina Knaut)