Trelleborg Sealing Solutions Unveils State-of-the-Art Semiconductor Seals and Pioneering Engineering Expertise at Semicon Taiwan 2023: Spotlight on Atomic Layer Deposition Application

Trelleborg Sealing Solutions Exhibits Advanced Semiconductor Seals and Engineering Prowess at Semicon Taiwan 2023

Trelleborg Sealing Solutions, a leading player in engineering solutions, is making waves at Semicon Taiwan 2023 by showcasing its cutting-edge engineering capabilities and an expanded range of semiconductor sealing solutions. The event, hosted at the Taipei Nangang Exhibition Center, features Trelleborg's booth highlighting their latest additions to the Isolast PureFab FFKM material range, a significant advancement in semiconductor seal technology.

At the forefront of their display is the Isolast PureFab JPF40, an ultra-high temperature perfluoroelastomer (FFKM) designed for demanding subfab applications and thermal processes. This includes pivotal processes such as rapid thermal processing (RTP) and atomic layer deposition (ALD), crucial for semiconductor manufacturing. This material boasts unparalleled compression set performance within a wide operating temperature range, ensuring airtight seals in critical processes even at extreme temperatures reaching +300°C. The remarkable capability to withstand peak application temperatures exceeding +325°C makes it a game-changer in the semiconductor industry.

Ethan Huang, the Semiconductor Segment Manager at Trelleborg Sealing Solutions, emphasized the vital role of reliable sealing solutions in safeguarding semiconductor processes against escalating temperatures and aggressive chemical agents. The Isolast PureFab JPF40 and other offerings within the PureFab range are meticulously engineered to address the unique challenges posed by semiconductor environments.

Furthermore, Trelleborg's expertise extends to predictive engineering through finite element analysis. This innovative approach aids in modeling compression set data, allowing engineers to more accurately estimate the usable lifetime of seals during design and production. This predictive technology is a significant leap forward, enabling enhanced seal longevity assessments.

A standout in their exhibition is the Isolast K-Fab Flange Seal, designed for critical subfab applications and capable of withstanding temperatures up to +327°C, dependent on material selection. The seal's versatility in material options, including Isolast FFKM, PureFab FFKM, and PureFab Fluoroelastomer (FKM), makes it adaptable to various requirements.

An interesting focus lies on Trelleborg's contributions to atomic layer deposition (ALD). Their materials, like Isolast PureFab JPF22, exhibit remarkable chemical compatibility with wet process chemicals, steam, and amine-based ALD precursors. This makes them well-suited for ALD applications, which are vital to modern semiconductor fabrication processes.

In addition to their product lineup, Trelleborg also presents the Turcon Variseal NW, showcasing their prowess in spring-energized seals for extreme environments. This seal operates across an extensive temperature range and excels in both wear resistance and friction characteristics.

Semicon Taiwan 2023 provides a platform for Trelleborg Sealing Solutions to not only showcase their groundbreaking products but also to engage with industry professionals about their specific sealing needs. The event highlights the convergence of innovative engineering and the semiconductor industry's evolving demands.