In between all those very important policy tweets for the world as we knew it there seems to be Metal ALD theme this week on Twitter. Many new interesting publications on both the practical and theoretical paths to successful ALD of Metals to solve those BEOL issues at 7 nm.
Copper #AtomicLayerDeposition #moleculardynamic simulation using #reaxff#compchem #ALDep pic.twitter.com/NCH7qpxSGe— Scienomics (@Scienomics) February 6, 2017
Our suggestion for classifying metal #ALDep processes according to mechanism in J. Chem. Phys. special issue https://t.co/7K3sdHVxNd pic.twitter.com/BtpJPsIgCt— Simon Elliott (@Simon_D_Elliott) February 7, 2017
Efficient Process for Direct #ALDep of Metallic Cu Thin Films Based on an Organic Reductant - Chemistry of Materials https://t.co/5ynEmY6mKP— BALD Engineering AB (@jv3sund) February 6, 2017
— SemiEngineering (@SemiEngineering) January 17, 2017
Managing Parasitics For Transistor Performance- #Capacitances are critical factors @ advanced nodes https://t.co/3x74SyoSLo#transistors pic.twitter.com/ICQHHpxTtH
— SemiEngineering (@SemiEngineering) January 30, 2017
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