Thursday, November 5, 2020

Improving Curved uOLED encapsulation with ALD

[Beneq Blog] For the past decades, organic light emitting diodes (OLEDs) have become of great interests for applications to micro-displays. Unfortunately, these systems are highly sensitive to moisture and oxygen ingress and require high barrier encapsulation. Additionally, a specific protection needs to be added to protect the device from mechanical failure. Depending on the application, various options from glass lids to flexible barriers have been developed. The former offers high mechanical protection but suffers from long implementation processes, while the later typically exhibit low hardness and poor wear resistance.

Pinhole free encapsulation via ALD deposited directly onto micro-OLEDs means simpler manufacturing and robust protection. The thinner ALD encasement enable substrate bending and open the possibility of more compact curved devices with less complex optical engines.

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